HiSilicon Kirin 970 vs MediaTek Dimensity 800
The HiSilicon Kirin 970 and the MediaTek Dimensity 800 are both processors used in smartphones and tablets. While they have some similarities, there are several key differences in their specifications.
Starting with the HiSilicon Kirin 970, it boasts an architecture of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With a total of 8 cores, it offers a powerful performance. The instruction set is ARMv8-A, ensuring compatibility with the latest applications. The Kirin 970 is manufactured using a 10 nm lithography process, resulting in improved power efficiency. It contains 5500 million transistors for enhanced processing capabilities. The TDP (Thermal Design Power) of this processor is 9 watts, indicating relatively low power consumption. Additionally, it features the advanced HiSilicon Neural Processing Unit (NPU) for efficient machine learning tasks.
On the other hand, the MediaTek Dimensity 800 has an architecture consisting of 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. With 4 cores in total, it offers a balanced performance. The instruction set is ARMv8.2-A, ensuring compatibility with most modern applications. Manufactured using a 7 nm lithography process, this processor provides improved power efficiency compared to the Kirin 970. It features a TDP of 10 watts, indicating slightly higher power consumption than the Kirin 970. It also includes an NPU for neural processing tasks, but the specifics of the NPU are not specified.
In summary, the HiSilicon Kirin 970 and the MediaTek Dimensity 800 have some notable differences. The Kirin 970 offers a higher number of cores and a wider range of clock speeds, potentially providing a more powerful performance. It has a slightly lower power consumption and offers the advanced HiSilicon NPU for efficient machine learning tasks. On the other hand, the Dimensity 800 has a more balanced configuration with a lower number of cores. It utilizes a more advanced ARMv8.2-A instruction set and a more power-efficient 7 nm lithography process. While both processors are capable options, the specific requirements and preferences of the user should be considered when choosing between them.
Starting with the HiSilicon Kirin 970, it boasts an architecture of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With a total of 8 cores, it offers a powerful performance. The instruction set is ARMv8-A, ensuring compatibility with the latest applications. The Kirin 970 is manufactured using a 10 nm lithography process, resulting in improved power efficiency. It contains 5500 million transistors for enhanced processing capabilities. The TDP (Thermal Design Power) of this processor is 9 watts, indicating relatively low power consumption. Additionally, it features the advanced HiSilicon Neural Processing Unit (NPU) for efficient machine learning tasks.
On the other hand, the MediaTek Dimensity 800 has an architecture consisting of 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. With 4 cores in total, it offers a balanced performance. The instruction set is ARMv8.2-A, ensuring compatibility with most modern applications. Manufactured using a 7 nm lithography process, this processor provides improved power efficiency compared to the Kirin 970. It features a TDP of 10 watts, indicating slightly higher power consumption than the Kirin 970. It also includes an NPU for neural processing tasks, but the specifics of the NPU are not specified.
In summary, the HiSilicon Kirin 970 and the MediaTek Dimensity 800 have some notable differences. The Kirin 970 offers a higher number of cores and a wider range of clock speeds, potentially providing a more powerful performance. It has a slightly lower power consumption and offers the advanced HiSilicon NPU for efficient machine learning tasks. On the other hand, the Dimensity 800 has a more balanced configuration with a lower number of cores. It utilizes a more advanced ARMv8.2-A instruction set and a more power-efficient 7 nm lithography process. While both processors are capable options, the specific requirements and preferences of the user should be considered when choosing between them.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 9 Watt | 10 Watt |
Neural Processing | HiSilicon NPU | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G57 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 750 MHz | 650 MHz |
Execution units | 12 | 4 |
Shaders | 192 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2017 September | 2020 Quarter 2 |
Partnumber | Hi3670 | MT6873, MT6873V |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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