HiSilicon Kirin 970 vs MediaTek Dimensity 800

The HiSilicon Kirin 970 and the MediaTek Dimensity 800 are both processors used in smartphones and tablets. While they have some similarities, there are several key differences in their specifications.

Starting with the HiSilicon Kirin 970, it boasts an architecture of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. With a total of 8 cores, it offers a powerful performance. The instruction set is ARMv8-A, ensuring compatibility with the latest applications. The Kirin 970 is manufactured using a 10 nm lithography process, resulting in improved power efficiency. It contains 5500 million transistors for enhanced processing capabilities. The TDP (Thermal Design Power) of this processor is 9 watts, indicating relatively low power consumption. Additionally, it features the advanced HiSilicon Neural Processing Unit (NPU) for efficient machine learning tasks.

On the other hand, the MediaTek Dimensity 800 has an architecture consisting of 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. With 4 cores in total, it offers a balanced performance. The instruction set is ARMv8.2-A, ensuring compatibility with most modern applications. Manufactured using a 7 nm lithography process, this processor provides improved power efficiency compared to the Kirin 970. It features a TDP of 10 watts, indicating slightly higher power consumption than the Kirin 970. It also includes an NPU for neural processing tasks, but the specifics of the NPU are not specified.

In summary, the HiSilicon Kirin 970 and the MediaTek Dimensity 800 have some notable differences. The Kirin 970 offers a higher number of cores and a wider range of clock speeds, potentially providing a more powerful performance. It has a slightly lower power consumption and offers the advanced HiSilicon NPU for efficient machine learning tasks. On the other hand, the Dimensity 800 has a more balanced configuration with a lower number of cores. It utilizes a more advanced ARMv8.2-A instruction set and a more power-efficient 7 nm lithography process. While both processors are capable options, the specific requirements and preferences of the user should be considered when choosing between them.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
4x 2.0 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 4
Instruction Set ARMv8-A ARMv8.2-A
Lithography 10 nm 7 nm
Number of transistors 5500 million
TDP 9 Watt 10 Watt
Neural Processing HiSilicon NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit


Storage specification UFS 2.1 UFS 2.2


GPU name Mali-G72 MP12 Mali-G57 MP4
GPU Architecture Bifrost Valhall
GPU frequency 750 MHz 650 MHz
Execution units 12 4
Shaders 192 64
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou

Supplemental Information

Launch Date 2017 September 2020 Quarter 2
Partnumber Hi3670 MT6873, MT6873V
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 970
Dimensity 800

GeekBench 6 Single-Core

Kirin 970
Dimensity 800

GeekBench 6 Multi-Core

Kirin 970
Dimensity 800