HiSilicon Kirin 970 vs MediaTek Dimensity 720
When comparing the specifications of the HiSilicon Kirin 970 and MediaTek Dimensity 720 processors, there are several notable differences worth considering.
Firstly, in terms of CPU cores and architecture, the HiSilicon Kirin 970 features a combination of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 720 uses 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. It is worth noting that the Cortex-A76 cores in the Dimensity 720 have a higher clock speed than the Cortex-A73 cores in the Kirin 970, potentially offering better performance.
Both processors have 8 cores in total and support the ARMv8 instruction set. However, the MediaTek Dimensity 720 uses ARMv8.2-A, which is a newer version of the instruction set compared to the ARMv8-A used by the HiSilicon Kirin 970. This suggests that the Dimensity 720 may have more advanced features and capabilities.
In terms of lithography, the HiSilicon Kirin 970 is manufactured using a 10 nm process, while the MediaTek Dimensity 720 uses a more advanced 7 nm process. Generally, a smaller lithography results in more power-efficient processors and potentially better performance.
Regarding power consumption, the TDP (Thermal Design Power) of the HiSilicon Kirin 970 is 9 Watts, while the MediaTek Dimensity 720 has a slightly higher TDP of 10 Watts. Although the difference is minimal, it implies that the Kirin 970 might be more power-efficient.
Both processors also incorporate a Neural Processing Unit (NPU). The HiSilicon Kirin 970 utilizes the HiSilicon NPU for neural processing tasks, while the Dimensity 720 simply states it has an NPU. Without further information, it is challenging to determine the capabilities and performance of their NPUs.
In summary, the MediaTek Dimensity 720 appears to have a newer CPU architecture, a more advanced lithography, and potentially higher power consumption compared to the HiSilicon Kirin 970. However, when it comes to overall performance, it is important to consider other factors such as optimizations, software integration, and real-world benchmark results.
Firstly, in terms of CPU cores and architecture, the HiSilicon Kirin 970 features a combination of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 720 uses 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. It is worth noting that the Cortex-A76 cores in the Dimensity 720 have a higher clock speed than the Cortex-A73 cores in the Kirin 970, potentially offering better performance.
Both processors have 8 cores in total and support the ARMv8 instruction set. However, the MediaTek Dimensity 720 uses ARMv8.2-A, which is a newer version of the instruction set compared to the ARMv8-A used by the HiSilicon Kirin 970. This suggests that the Dimensity 720 may have more advanced features and capabilities.
In terms of lithography, the HiSilicon Kirin 970 is manufactured using a 10 nm process, while the MediaTek Dimensity 720 uses a more advanced 7 nm process. Generally, a smaller lithography results in more power-efficient processors and potentially better performance.
Regarding power consumption, the TDP (Thermal Design Power) of the HiSilicon Kirin 970 is 9 Watts, while the MediaTek Dimensity 720 has a slightly higher TDP of 10 Watts. Although the difference is minimal, it implies that the Kirin 970 might be more power-efficient.
Both processors also incorporate a Neural Processing Unit (NPU). The HiSilicon Kirin 970 utilizes the HiSilicon NPU for neural processing tasks, while the Dimensity 720 simply states it has an NPU. Without further information, it is challenging to determine the capabilities and performance of their NPUs.
In summary, the MediaTek Dimensity 720 appears to have a newer CPU architecture, a more advanced lithography, and potentially higher power consumption compared to the HiSilicon Kirin 970. However, when it comes to overall performance, it is important to consider other factors such as optimizations, software integration, and real-world benchmark results.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 10 nm | 7 nm |
| Number of transistors | 5500 million | |
| TDP | 9 Watt | 10 Watt |
| Neural Processing | HiSilicon NPU | NPU |
Memory (RAM)
| Max amount | up to 8 GB | up to 12 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 2133 MHz |
| Memory-bus | 4x16 bit | 2x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
| GPU name | Mali-G72 MP12 | Mali-G57 MP3 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 750 MHz | 850 MHz |
| Execution units | 12 | 3 |
| Shaders | 192 | |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 2520x1080@90Hz |
| Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 1x 20MP + 1x 16MP |
| Max Video Capture | 4K@30fps | 4K@30FPS |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 1.2 Gbps | 2.77 Gbps |
| Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
| Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
| Bluetooth | 4.2 | 5.1 |
| Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
| Launch Date | 2017 September | 2020 Quarter 3 |
| Partnumber | Hi3670 | MT6853V/ZA, MT6853V/NZA |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Flagship | Mid-end |
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