HiSilicon Kirin 970 vs MediaTek Dimensity 720

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When comparing the specifications of the HiSilicon Kirin 970 and MediaTek Dimensity 720 processors, there are several notable differences worth considering.

Firstly, in terms of CPU cores and architecture, the HiSilicon Kirin 970 features a combination of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 720 uses 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. It is worth noting that the Cortex-A76 cores in the Dimensity 720 have a higher clock speed than the Cortex-A73 cores in the Kirin 970, potentially offering better performance.

Both processors have 8 cores in total and support the ARMv8 instruction set. However, the MediaTek Dimensity 720 uses ARMv8.2-A, which is a newer version of the instruction set compared to the ARMv8-A used by the HiSilicon Kirin 970. This suggests that the Dimensity 720 may have more advanced features and capabilities.

In terms of lithography, the HiSilicon Kirin 970 is manufactured using a 10 nm process, while the MediaTek Dimensity 720 uses a more advanced 7 nm process. Generally, a smaller lithography results in more power-efficient processors and potentially better performance.

Regarding power consumption, the TDP (Thermal Design Power) of the HiSilicon Kirin 970 is 9 Watts, while the MediaTek Dimensity 720 has a slightly higher TDP of 10 Watts. Although the difference is minimal, it implies that the Kirin 970 might be more power-efficient.

Both processors also incorporate a Neural Processing Unit (NPU). The HiSilicon Kirin 970 utilizes the HiSilicon NPU for neural processing tasks, while the Dimensity 720 simply states it has an NPU. Without further information, it is challenging to determine the capabilities and performance of their NPUs.

In summary, the MediaTek Dimensity 720 appears to have a newer CPU architecture, a more advanced lithography, and potentially higher power consumption compared to the HiSilicon Kirin 970. However, when it comes to overall performance, it is important to consider other factors such as optimizations, software integration, and real-world benchmark results.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 10 nm 7 nm
Number of transistors 5500 million
TDP 9 Watt 10 Watt
Neural Processing HiSilicon NPU NPU

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G72 MP12 Mali-G57 MP3
GPU Architecture Bifrost Valhall
GPU frequency 750 MHz 850 MHz
Execution units 12 3
Shaders 192
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@90Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.2 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2017 September 2020 Quarter 3
Partnumber Hi3670 MT6853V/ZA, MT6853V/NZA
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 970
318577
Dimensity 720
293337

GeekBench 6 Single-Core

Score
Kirin 970
389
Dimensity 720
540

GeekBench 6 Multi-Core

Score
Kirin 970
1502
Dimensity 720
1698