HiSilicon Kirin 970 vs HiSilicon Kirin 9000 5G
The HiSilicon Kirin 970 and HiSilicon Kirin 9000 5G are two processors with distinct specifications.
In terms of CPU cores and architecture, the HiSilicon Kirin 970 features a 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53 architecture, whereas the HiSilicon Kirin 9000 5G boasts a more advanced configuration of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55. The Kirin 9000 5G's architecture suggests improved performance and efficiency compared to the Kirin 970.
Both processors have 8 cores and utilize the ARMv8 instruction set. However, the Kirin 9000 5G employs the ARMv8.2-A instruction set, which indicates potential optimizations and enhancements over the Kirin 970's ARMv8-A instruction set.
In terms of fabrication process, the Kirin 970 features a 10 nm lithography, whereas the Kirin 9000 5G has a more advanced 5 nm lithography. The smaller lithography size in the Kirin 9000 5G implies a more power-efficient and potentially faster processor.
The number of transistors in the Kirin 970 is 5500 million, while the Kirin 9000 5G has a significantly higher transistor count of 15300 million. This suggests that the Kirin 9000 5G's design allows for a higher density of transistors, potentially leading to improved performance and capabilities.
Regarding thermal design power (TDP), the Kirin 970 has a TDP of 9 watts, whereas the Kirin 9000 5G has a lower TDP of 6 watts. A lower TDP generally indicates better power efficiency, which can result in a cooler and more energy-efficient device.
Both processors feature neural processing units (NPU) to enhance AI capabilities. The Kirin 970 utilizes the HiSilicon NPU, while the Kirin 9000 5G employs Ascend Lite (2x) + Ascend Tiny (1x) with Huawei's Da Vinci 2.0 architecture. While the specifics of each NPU may differ, both processors boast dedicated AI hardware for improved AI performance in tasks such as photography, voice recognition, and augmented reality.
In summary, the HiSilicon Kirin 9000 5G offers advancements over the Kirin 970 in terms of CPU cores and architecture, lithography, transistor count, TDP, and neural processing. These improvements suggest that the Kirin 9000 5G is a more powerful and efficient processor overall.
In terms of CPU cores and architecture, the HiSilicon Kirin 970 features a 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53 architecture, whereas the HiSilicon Kirin 9000 5G boasts a more advanced configuration of 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55. The Kirin 9000 5G's architecture suggests improved performance and efficiency compared to the Kirin 970.
Both processors have 8 cores and utilize the ARMv8 instruction set. However, the Kirin 9000 5G employs the ARMv8.2-A instruction set, which indicates potential optimizations and enhancements over the Kirin 970's ARMv8-A instruction set.
In terms of fabrication process, the Kirin 970 features a 10 nm lithography, whereas the Kirin 9000 5G has a more advanced 5 nm lithography. The smaller lithography size in the Kirin 9000 5G implies a more power-efficient and potentially faster processor.
The number of transistors in the Kirin 970 is 5500 million, while the Kirin 9000 5G has a significantly higher transistor count of 15300 million. This suggests that the Kirin 9000 5G's design allows for a higher density of transistors, potentially leading to improved performance and capabilities.
Regarding thermal design power (TDP), the Kirin 970 has a TDP of 9 watts, whereas the Kirin 9000 5G has a lower TDP of 6 watts. A lower TDP generally indicates better power efficiency, which can result in a cooler and more energy-efficient device.
Both processors feature neural processing units (NPU) to enhance AI capabilities. The Kirin 970 utilizes the HiSilicon NPU, while the Kirin 9000 5G employs Ascend Lite (2x) + Ascend Tiny (1x) with Huawei's Da Vinci 2.0 architecture. While the specifics of each NPU may differ, both processors boast dedicated AI hardware for improved AI performance in tasks such as photography, voice recognition, and augmented reality.
In summary, the HiSilicon Kirin 9000 5G offers advancements over the Kirin 970 in terms of CPU cores and architecture, lithography, transistor count, TDP, and neural processing. These improvements suggest that the Kirin 9000 5G is a more powerful and efficient processor overall.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 10 nm | 5 nm |
Number of transistors | 5500 million | 15300 million |
TDP | 9 Watt | 6 Watt |
Neural Processing | HiSilicon NPU | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 2750 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G72 MP12 | Mali-G78 MP24 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 750 MHz | 760 MHz |
Execution units | 12 | 24 |
Shaders | 192 | 384 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 3840x2160 |
Max camera resolution | 1x 48MP, 2x 20MP | |
Max Video Capture | 4K@30fps | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.2 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 2.5 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2017 September | 2020 October |
Partnumber | Hi3670 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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