HiSilicon Kirin 960 vs MediaTek Dimensity 900
The HiSilicon Kirin 960 and MediaTek Dimensity 900 are both powerful processors, but they differ in terms of their specifications.
In terms of CPU cores and architecture, the HiSilicon Kirin 960 boasts 8 cores consisting of 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53. On the other hand, the MediaTek Dimensity 900 features 8 cores as well, with 2x 2.4 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55. This means that the Dimensity 900 has a slightly higher clock speed for its more powerful cores.
When it comes to instruction set, the Kirin 960 utilizes the ARMv8-A instruction set, while the Dimensity 900 uses the newer ARMv8.2-A instruction set. This suggests that the Dimensity 900 may have better compatibility with certain software and applications.
In terms of manufacturing process, the Kirin 960 has a lithography of 16 nm, while the Dimensity 900 boasts a smaller 6 nm lithography. The smaller lithography generally results in greater power efficiency and improved performance.
The number of transistors is also worth comparing. The Kirin 960 has 4000 million transistors, while the Dimensity 900 takes it a step further with 10000 million transistors. This signifies that the Dimensity 900 has a more advanced architecture and potentially better performance capabilities.
Additionally, the Dimensity 900 comes with Neural Processing Unit (NPU) technology, which allows for enhanced artificial intelligence performance.
In terms of thermal design power (TDP), the Kirin 960 has a lower TDP of 5 Watts, which implies that it may run cooler and consume less power than the Dimensity 900, which has a TDP of 10 Watts.
Overall, the MediaTek Dimensity 900 is technologically more advanced than the HiSilicon Kirin 960. It features a smaller lithography, higher transistor count, and the inclusion of an NPU for superior AI capabilities. However, the Kirin 960 still offers a respectable performance and a lower TDP, which may be beneficial in certain use cases.
In terms of CPU cores and architecture, the HiSilicon Kirin 960 boasts 8 cores consisting of 4x 2.4 GHz Cortex-A73 and 4x 1.8 GHz Cortex-A53. On the other hand, the MediaTek Dimensity 900 features 8 cores as well, with 2x 2.4 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55. This means that the Dimensity 900 has a slightly higher clock speed for its more powerful cores.
When it comes to instruction set, the Kirin 960 utilizes the ARMv8-A instruction set, while the Dimensity 900 uses the newer ARMv8.2-A instruction set. This suggests that the Dimensity 900 may have better compatibility with certain software and applications.
In terms of manufacturing process, the Kirin 960 has a lithography of 16 nm, while the Dimensity 900 boasts a smaller 6 nm lithography. The smaller lithography generally results in greater power efficiency and improved performance.
The number of transistors is also worth comparing. The Kirin 960 has 4000 million transistors, while the Dimensity 900 takes it a step further with 10000 million transistors. This signifies that the Dimensity 900 has a more advanced architecture and potentially better performance capabilities.
Additionally, the Dimensity 900 comes with Neural Processing Unit (NPU) technology, which allows for enhanced artificial intelligence performance.
In terms of thermal design power (TDP), the Kirin 960 has a lower TDP of 5 Watts, which implies that it may run cooler and consume less power than the Dimensity 900, which has a TDP of 10 Watts.
Overall, the MediaTek Dimensity 900 is technologically more advanced than the HiSilicon Kirin 960. It features a smaller lithography, higher transistor count, and the inclusion of an NPU for superior AI capabilities. However, the Kirin 960 still offers a respectable performance and a lower TDP, which may be beneficial in certain use cases.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 4000 million | 10000 million |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G68 MP4 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 900 MHz | 900 MHz |
Execution units | 8 | 4 |
Shaders | 128 | 64 |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2016 October | 2021 Quarter 1 |
Partnumber | Hi3660 | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
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