HiSilicon Kirin 960 vs MediaTek Dimensity 700
The HiSilicon Kirin 960 and MediaTek Dimensity 700 are two processors that offer different specifications and features. Let's compare them based on their key specifications.
Starting with the HiSilicon Kirin 960, it features an architecture that consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on the ARMv8-A instruction set. With a lithography of 16 nm, it manages to pack in around 4000 million transistors. In terms of power consumption, the Kirin 960 has a TDP of 5 Watts.
On the other hand, the MediaTek Dimensity 700 boasts an architecture consisting of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Like the Kirin 960, it also features an octa-core configuration and operates on the ARMv8.2-A instruction set. The Dimensity 700, however, has a smaller lithography of 7 nm, which allows for better power efficiency. In terms of power consumption, the Dimensity 700 has a TDP of 10 Watts.
Both processors offer similarities in terms of the number of cores and instruction sets supported. However, there are notable differences in the clock speeds and lithography. The Kirin 960 has higher clock speeds for its faster cores, while the Dimensity 700 focuses on power efficiency with its smaller lithography.
It's important to note that there are other factors to consider when comparing processors, such as GPU performance, AI processing capabilities, and overall system integration. However, based on the provided specifications, the HiSilicon Kirin 960 may be better suited for applications that require higher performance, while the MediaTek Dimensity 700 might excel in power-efficient usage scenarios.
Ultimately, the choice between these two processors would depend on the specific requirements and preferences of the user.
Starting with the HiSilicon Kirin 960, it features an architecture that consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on the ARMv8-A instruction set. With a lithography of 16 nm, it manages to pack in around 4000 million transistors. In terms of power consumption, the Kirin 960 has a TDP of 5 Watts.
On the other hand, the MediaTek Dimensity 700 boasts an architecture consisting of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Like the Kirin 960, it also features an octa-core configuration and operates on the ARMv8.2-A instruction set. The Dimensity 700, however, has a smaller lithography of 7 nm, which allows for better power efficiency. In terms of power consumption, the Dimensity 700 has a TDP of 10 Watts.
Both processors offer similarities in terms of the number of cores and instruction sets supported. However, there are notable differences in the clock speeds and lithography. The Kirin 960 has higher clock speeds for its faster cores, while the Dimensity 700 focuses on power efficiency with its smaller lithography.
It's important to note that there are other factors to consider when comparing processors, such as GPU performance, AI processing capabilities, and overall system integration. However, based on the provided specifications, the HiSilicon Kirin 960 may be better suited for applications that require higher performance, while the MediaTek Dimensity 700 might excel in power-efficient usage scenarios.
Ultimately, the choice between these two processors would depend on the specific requirements and preferences of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A73 4x 1.8 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 7 nm |
Number of transistors | 4000 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G71 MP8 | Mali-G57 MP2 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 900 MHz | 950 MHz |
Execution units | 8 | 2 |
Shaders | 128 | 32 |
DirectX | 11.3 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | |
Max camera resolution | 1x 20MP, 2x 12MP | 1x 64MP, 2x 16MP |
Max Video Capture | 4K@30fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2016 October | 2021 Quarter 1 |
Partnumber | Hi3660 | MT6833V/ZA, MT6833V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
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