HiSilicon Kirin 960 vs MediaTek Dimensity 700

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The HiSilicon Kirin 960 and MediaTek Dimensity 700 are two processors that offer different specifications and features. Let's compare them based on their key specifications.

Starting with the HiSilicon Kirin 960, it features an architecture that consists of 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This octa-core processor operates on the ARMv8-A instruction set. With a lithography of 16 nm, it manages to pack in around 4000 million transistors. In terms of power consumption, the Kirin 960 has a TDP of 5 Watts.

On the other hand, the MediaTek Dimensity 700 boasts an architecture consisting of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Like the Kirin 960, it also features an octa-core configuration and operates on the ARMv8.2-A instruction set. The Dimensity 700, however, has a smaller lithography of 7 nm, which allows for better power efficiency. In terms of power consumption, the Dimensity 700 has a TDP of 10 Watts.

Both processors offer similarities in terms of the number of cores and instruction sets supported. However, there are notable differences in the clock speeds and lithography. The Kirin 960 has higher clock speeds for its faster cores, while the Dimensity 700 focuses on power efficiency with its smaller lithography.

It's important to note that there are other factors to consider when comparing processors, such as GPU performance, AI processing capabilities, and overall system integration. However, based on the provided specifications, the HiSilicon Kirin 960 may be better suited for applications that require higher performance, while the MediaTek Dimensity 700 might excel in power-efficient usage scenarios.

Ultimately, the choice between these two processors would depend on the specific requirements and preferences of the user.

CPU cores and architecture

Architecture 4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 16 nm 7 nm
Number of transistors 4000 million
TDP 5 Watt 10 Watt

Memory (RAM)

Max amount up to 6 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G71 MP8 Mali-G57 MP2
GPU Architecture Bifrost Valhall
GPU frequency 900 MHz 950 MHz
Execution units 8 2
Shaders 128 32
DirectX 11.3 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@90Hz
Max camera resolution 1x 20MP, 2x 12MP 1x 64MP, 2x 16MP
Max Video Capture 4K@30fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2016 October 2021 Quarter 1
Partnumber Hi3660 MT6833V/ZA, MT6833V/NZA
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 960
253892
Dimensity 700
325860

GeekBench 6 Single-Core

Score
Kirin 960
382
Dimensity 700
531

GeekBench 6 Multi-Core

Score
Kirin 960
1544
Dimensity 700
1719