HiSilicon Kirin 955 vs MediaTek Dimensity 920
The HiSilicon Kirin 955 and MediaTek Dimensity 920 are two processors with different specifications. Let's compare them in terms of architecture, CPU cores, instruction set, lithography, TDP, and additional features.
Starting with the architecture, the HiSilicon Kirin 955 features 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores, while the MediaTek Dimensity 920 includes 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores in total, but the arrangement and clock speeds differ.
Moving on to the instruction set, the HiSilicon Kirin 955 uses ARMv8-A, while the MediaTek Dimensity 920 incorporates ARMv8.2-A. This indicates that the Dimensity 920 supports newer instruction sets and potentially offers better optimizations for software.
In terms of lithography, the HiSilicon Kirin 955 is manufactured using a 16 nm process, while the MediaTek Dimensity 920 takes advantage of a more advanced 6 nm process. A smaller lithography generally allows for improved power efficiency and better overall performance.
Next, let's compare the thermal design power (TDP) of the two processors. The HiSilicon Kirin 955 has a TDP of 5 Watts, while the MediaTek Dimensity 920 has a TDP of 10 Watts. A lower TDP suggests that the Kirin 955 may generate less heat and consume less power, potentially leading to longer battery life and cooler operation.
Lastly, the MediaTek Dimensity 920 offers an additional feature in the form of a Neural Processing Unit (NPU). This specialized component can accelerate tasks related to artificial intelligence and machine learning, enhancing the performance and efficiency of certain applications.
In summary, the HiSilicon Kirin 955 and MediaTek Dimensity 920 processors differ in several key aspects. The Dimensity 920 features a more advanced lithography, higher clock speeds for some cores, support for a newer instruction set, and an NPU. On the other hand, the Kirin 955 has a lower TDP and an architecture that includes both high performance and power-efficient cores. The choice between the two processors would depend on the specific requirements and priorities of the user or device.
Starting with the architecture, the HiSilicon Kirin 955 features 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores, while the MediaTek Dimensity 920 includes 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Both processors have 8 cores in total, but the arrangement and clock speeds differ.
Moving on to the instruction set, the HiSilicon Kirin 955 uses ARMv8-A, while the MediaTek Dimensity 920 incorporates ARMv8.2-A. This indicates that the Dimensity 920 supports newer instruction sets and potentially offers better optimizations for software.
In terms of lithography, the HiSilicon Kirin 955 is manufactured using a 16 nm process, while the MediaTek Dimensity 920 takes advantage of a more advanced 6 nm process. A smaller lithography generally allows for improved power efficiency and better overall performance.
Next, let's compare the thermal design power (TDP) of the two processors. The HiSilicon Kirin 955 has a TDP of 5 Watts, while the MediaTek Dimensity 920 has a TDP of 10 Watts. A lower TDP suggests that the Kirin 955 may generate less heat and consume less power, potentially leading to longer battery life and cooler operation.
Lastly, the MediaTek Dimensity 920 offers an additional feature in the form of a Neural Processing Unit (NPU). This specialized component can accelerate tasks related to artificial intelligence and machine learning, enhancing the performance and efficiency of certain applications.
In summary, the HiSilicon Kirin 955 and MediaTek Dimensity 920 processors differ in several key aspects. The Dimensity 920 features a more advanced lithography, higher clock speeds for some cores, support for a newer instruction set, and an NPU. On the other hand, the Kirin 955 has a lower TDP and an architecture that includes both high performance and power-efficient cores. The choice between the two processors would depend on the specific requirements and priorities of the user or device.
CPU cores and architecture
Architecture | 4x 2.5 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 2000 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1333 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T880 MP4 | Mali-G68 MP4 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 900 MHz | 950 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 96 |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 108MP, 2x 20MP |
Max Video Capture | FullHD@60fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2016 April | 2021 Quarter 3 |
Partnumber | Hi3655 | MT6877T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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