HiSilicon Kirin 955 vs MediaTek Dimensity 810
The HiSilicon Kirin 955 and MediaTek Dimensity 810 are two processors that provide powerful performance for mobile devices. Let's compare their specifications to see how they differ.
In terms of CPU cores and architecture, the Kirin 955 features 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. This combination of cores allows for efficient multitasking and handling demanding tasks. On the other hand, the Dimensity 810 has 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. The inclusion of Cortex-A76 cores provides faster performance for single-threaded applications.
Both processors have 8 cores, making them suitable for handling various tasks simultaneously. However, the Kirin 955 utilizes ARMv8-A instruction set, while the Dimensity 810 employs the more advanced ARMv8.2-A instruction set. This makes the Dimensity 810 better optimized to take advantage of newer software advancements.
Lithography is an important factor in determining power efficiency and heat generation. The Kirin 955 has a 16 nm lithography, while the Dimensity 810 stands out with its more advanced 6 nm lithography. The smaller lithography offers improved power efficiency, enabling longer battery life and reducing heat.
The number of transistors in a processor is indicative of its complexity and capability. The Kirin 955 has 2000 million transistors, while the Dimensity 810 takes the lead with an impressive 12000 million transistors. This indicates that the Dimensity 810 is a more powerful processor with increased capabilities.
When it comes to power consumption, the Kirin 955 impresses with a TDP of 5 Watts, indicating its energy efficiency. On the other hand, the Dimensity 810 has a slightly higher TDP of 8 Watts.
One notable feature of the Dimensity 810 is the inclusion of a Neural Processing Unit (NPU). This specialized hardware enhances the device's ability to handle AI-related tasks efficiently.
In conclusion, both the HiSilicon Kirin 955 and MediaTek Dimensity 810 have their strengths. The Kirin 955 offers a balanced combination of cores and power efficiency. On the other hand, the Dimensity 810 boasts a more advanced instruction set, smaller lithography, a higher number of transistors, and an additional NPU for AI tasks. Ultimately, the choice between the two processors depends on the specific needs and priorities of the user.
In terms of CPU cores and architecture, the Kirin 955 features 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. This combination of cores allows for efficient multitasking and handling demanding tasks. On the other hand, the Dimensity 810 has 2x 2.4 GHz Cortex-A76 cores and 6x 2.0 GHz Cortex-A55 cores. The inclusion of Cortex-A76 cores provides faster performance for single-threaded applications.
Both processors have 8 cores, making them suitable for handling various tasks simultaneously. However, the Kirin 955 utilizes ARMv8-A instruction set, while the Dimensity 810 employs the more advanced ARMv8.2-A instruction set. This makes the Dimensity 810 better optimized to take advantage of newer software advancements.
Lithography is an important factor in determining power efficiency and heat generation. The Kirin 955 has a 16 nm lithography, while the Dimensity 810 stands out with its more advanced 6 nm lithography. The smaller lithography offers improved power efficiency, enabling longer battery life and reducing heat.
The number of transistors in a processor is indicative of its complexity and capability. The Kirin 955 has 2000 million transistors, while the Dimensity 810 takes the lead with an impressive 12000 million transistors. This indicates that the Dimensity 810 is a more powerful processor with increased capabilities.
When it comes to power consumption, the Kirin 955 impresses with a TDP of 5 Watts, indicating its energy efficiency. On the other hand, the Dimensity 810 has a slightly higher TDP of 8 Watts.
One notable feature of the Dimensity 810 is the inclusion of a Neural Processing Unit (NPU). This specialized hardware enhances the device's ability to handle AI-related tasks efficiently.
In conclusion, both the HiSilicon Kirin 955 and MediaTek Dimensity 810 have their strengths. The Kirin 955 offers a balanced combination of cores and power efficiency. On the other hand, the Dimensity 810 boasts a more advanced instruction set, smaller lithography, a higher number of transistors, and an additional NPU for AI tasks. Ultimately, the choice between the two processors depends on the specific needs and priorities of the user.
CPU cores and architecture
Architecture | 4x 2.5 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 6 nm |
Number of transistors | 2000 million | 12000 million |
TDP | 5 Watt | 8 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 4 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1333 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T880 MP4 | Mali-G57 MP2 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 900 MHz | 950 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 64MP, 2x 16MP |
Max Video Capture | FullHD@60fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2016 April | 2021 Quarter 3 |
Partnumber | Hi3655 | MT6833V/PNZA, MT6833P |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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