HiSilicon Kirin 955 vs MediaTek Dimensity 700
When comparing the specifications of the HiSilicon Kirin 955 and the MediaTek Dimensity 700 processors, there are several notable differences to consider.
Starting with the CPU cores and architecture, the HiSilicon Kirin 955 features a combination of 4 Cortex-A72 cores clocked at 2.5 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. On the other hand, the MediaTek Dimensity 700 consists of 2 Cortex-A76 cores clocked at 2.2 GHz and 6 Cortex-A55 cores clocked at 2 GHz. Both processors have 8 cores in total, but the core configuration is different.
In terms of instruction set, the HiSilicon Kirin 955 utilizes ARMv8-A, while the MediaTek Dimensity 700 employs ARMv8.2-A. This means that the MediaTek Dimensity 700 supports the latest ARM instruction set, which could potentially lead to better performance and improved efficiency.
Another significant difference is the lithography process. The HiSilicon Kirin 955 is produced using a 16 nm process, whereas the MediaTek Dimensity 700 is manufactured using a more advanced 7 nm process. A smaller lithography generally results in better power efficiency and performance as it allows for more transistors to be packed into the same area.
Speaking of transistors, the HiSilicon Kirin 955 is equipped with 2000 million transistors, while no information regarding the number of transistors in the MediaTek Dimensity 700 is provided.
When considering power consumption, the TDP (Thermal Design Power) of the HiSilicon Kirin 955 is specified as 5 Watts, whereas the MediaTek Dimensity 700 has a TDP of 10 Watts. This suggests that the HiSilicon Kirin 955 may consume less power compared to the MediaTek Dimensity 700.
In summary, the HiSilicon Kirin 955 and MediaTek Dimensity 700 processors differ in their CPU core configuration, instruction set support, lithography process, and TDP. Overall, the MediaTek Dimensity 700 appears to have a more advanced architecture and manufacturing process, potentially resulting in improved performance and efficiency. However, without detailed information on other aspects such as GPU, cache, and memory support, it is challenging to make a definitive comparison between these processors.
Starting with the CPU cores and architecture, the HiSilicon Kirin 955 features a combination of 4 Cortex-A72 cores clocked at 2.5 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. On the other hand, the MediaTek Dimensity 700 consists of 2 Cortex-A76 cores clocked at 2.2 GHz and 6 Cortex-A55 cores clocked at 2 GHz. Both processors have 8 cores in total, but the core configuration is different.
In terms of instruction set, the HiSilicon Kirin 955 utilizes ARMv8-A, while the MediaTek Dimensity 700 employs ARMv8.2-A. This means that the MediaTek Dimensity 700 supports the latest ARM instruction set, which could potentially lead to better performance and improved efficiency.
Another significant difference is the lithography process. The HiSilicon Kirin 955 is produced using a 16 nm process, whereas the MediaTek Dimensity 700 is manufactured using a more advanced 7 nm process. A smaller lithography generally results in better power efficiency and performance as it allows for more transistors to be packed into the same area.
Speaking of transistors, the HiSilicon Kirin 955 is equipped with 2000 million transistors, while no information regarding the number of transistors in the MediaTek Dimensity 700 is provided.
When considering power consumption, the TDP (Thermal Design Power) of the HiSilicon Kirin 955 is specified as 5 Watts, whereas the MediaTek Dimensity 700 has a TDP of 10 Watts. This suggests that the HiSilicon Kirin 955 may consume less power compared to the MediaTek Dimensity 700.
In summary, the HiSilicon Kirin 955 and MediaTek Dimensity 700 processors differ in their CPU core configuration, instruction set support, lithography process, and TDP. Overall, the MediaTek Dimensity 700 appears to have a more advanced architecture and manufacturing process, potentially resulting in improved performance and efficiency. However, without detailed information on other aspects such as GPU, cache, and memory support, it is challenging to make a definitive comparison between these processors.
CPU cores and architecture
Architecture | 4x 2.5 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 7 nm |
Number of transistors | 2000 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 4 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1333 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T880 MP4 | Mali-G57 MP2 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 900 MHz | 950 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 64MP, 2x 16MP |
Max Video Capture | FullHD@60fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2016 April | 2021 Quarter 1 |
Partnumber | Hi3655 | MT6833V/ZA, MT6833V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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