HiSilicon Kirin 955 vs MediaTek Dimensity 700

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When comparing the specifications of the HiSilicon Kirin 955 and the MediaTek Dimensity 700 processors, there are several notable differences to consider.

Starting with the CPU cores and architecture, the HiSilicon Kirin 955 features a combination of 4 Cortex-A72 cores clocked at 2.5 GHz and 4 Cortex-A53 cores clocked at 1.8 GHz. On the other hand, the MediaTek Dimensity 700 consists of 2 Cortex-A76 cores clocked at 2.2 GHz and 6 Cortex-A55 cores clocked at 2 GHz. Both processors have 8 cores in total, but the core configuration is different.

In terms of instruction set, the HiSilicon Kirin 955 utilizes ARMv8-A, while the MediaTek Dimensity 700 employs ARMv8.2-A. This means that the MediaTek Dimensity 700 supports the latest ARM instruction set, which could potentially lead to better performance and improved efficiency.

Another significant difference is the lithography process. The HiSilicon Kirin 955 is produced using a 16 nm process, whereas the MediaTek Dimensity 700 is manufactured using a more advanced 7 nm process. A smaller lithography generally results in better power efficiency and performance as it allows for more transistors to be packed into the same area.

Speaking of transistors, the HiSilicon Kirin 955 is equipped with 2000 million transistors, while no information regarding the number of transistors in the MediaTek Dimensity 700 is provided.

When considering power consumption, the TDP (Thermal Design Power) of the HiSilicon Kirin 955 is specified as 5 Watts, whereas the MediaTek Dimensity 700 has a TDP of 10 Watts. This suggests that the HiSilicon Kirin 955 may consume less power compared to the MediaTek Dimensity 700.

In summary, the HiSilicon Kirin 955 and MediaTek Dimensity 700 processors differ in their CPU core configuration, instruction set support, lithography process, and TDP. Overall, the MediaTek Dimensity 700 appears to have a more advanced architecture and manufacturing process, potentially resulting in improved performance and efficiency. However, without detailed information on other aspects such as GPU, cache, and memory support, it is challenging to make a definitive comparison between these processors.

CPU cores and architecture

Architecture 4x 2.5 GHz – Cortex-A72
4x 1.8 GHz – Cortex-A53
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 16 nm 7 nm
Number of transistors 2000 million
TDP 5 Watt 10 Watt

Memory (RAM)

Max amount up to 4 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1333 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.0 UFS 2.2

Graphics

GPU name Mali-T880 MP4 Mali-G57 MP2
GPU Architecture Midgard Valhall
GPU frequency 900 MHz 950 MHz
Execution units 4 2
Shaders 64 32
DirectX 11.2 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@90Hz
Max camera resolution 1x 31MP, 2x 13MP 1x 64MP, 2x 16MP
Max Video Capture FullHD@60fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.77 Gbps
Peak Upload Speed 0.05 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2016 April 2021 Quarter 1
Partnumber Hi3655 MT6833V/ZA, MT6833V/NZA
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 955
147887
Dimensity 700
325860

GeekBench 6 Single-Core

Score
Kirin 955
345
Dimensity 700
531

GeekBench 6 Multi-Core

Score
Kirin 955
1180
Dimensity 700
1719