HiSilicon Kirin 950 vs MediaTek Dimensity 700
The HiSilicon Kirin 950 and the MediaTek Dimensity 700 are two processors used in smartphones and other devices. While they have some similarities, such as having 8 cores and using an ARM instruction set, they differ in several key specifications.
In terms of CPU cores and architecture, the HiSilicon Kirin 950 features a combination of 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 700 is equipped with 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This indicates that the HiSilicon Kirin 950 offers a higher clock speed for its powerful cores, which may result in better performance for demanding tasks. However, the MediaTek Dimensity 700 has more efficient cores, which may be advantageous for power-saving and everyday usage.
Another distinguishing factor is the lithography process. The HiSilicon Kirin 950 is built on a 16 nm lithography, while the MediaTek Dimensity 700 is manufactured using a more advanced 7 nm lithography. Generally, a smaller lithography allows for more transistors and better power efficiency. Therefore, the MediaTek Dimensity 700 is expected to offer a higher level of power efficiency compared to the HiSilicon Kirin 950.
Speaking of transistors, the HiSilicon Kirin 950 possesses 2000 million transistors. In contrast, the MediaTek Dimensity 700's transistor count is not specified. However, due to its more advanced lithography process, it is reasonable to assume that the Dimensity 700 could have a higher transistor count. This could potentially translate to improved performance capabilities.
Lastly, the TDP (Thermal Design Power) of the HiSilicon Kirin 950 is 5 Watts, while the MediaTek Dimensity 700 has a slightly higher TDP of 10 Watts. The TDP refers to the amount of power that a processor is designed to dissipate while operating under typical workloads. In this case, the Dimensity 700 may consume more power than the Kirin 950.
In conclusion, the HiSilicon Kirin 950 and the MediaTek Dimensity 700 have several differences in their specifications. The Kirin 950 offers higher clock speed for its powerful cores, while the Dimensity 700 focuses on power efficiency with a more advanced lithography. The number of transistors and the TDP also differ between the two processors. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the device and the user.
In terms of CPU cores and architecture, the HiSilicon Kirin 950 features a combination of 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. On the other hand, the MediaTek Dimensity 700 is equipped with 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This indicates that the HiSilicon Kirin 950 offers a higher clock speed for its powerful cores, which may result in better performance for demanding tasks. However, the MediaTek Dimensity 700 has more efficient cores, which may be advantageous for power-saving and everyday usage.
Another distinguishing factor is the lithography process. The HiSilicon Kirin 950 is built on a 16 nm lithography, while the MediaTek Dimensity 700 is manufactured using a more advanced 7 nm lithography. Generally, a smaller lithography allows for more transistors and better power efficiency. Therefore, the MediaTek Dimensity 700 is expected to offer a higher level of power efficiency compared to the HiSilicon Kirin 950.
Speaking of transistors, the HiSilicon Kirin 950 possesses 2000 million transistors. In contrast, the MediaTek Dimensity 700's transistor count is not specified. However, due to its more advanced lithography process, it is reasonable to assume that the Dimensity 700 could have a higher transistor count. This could potentially translate to improved performance capabilities.
Lastly, the TDP (Thermal Design Power) of the HiSilicon Kirin 950 is 5 Watts, while the MediaTek Dimensity 700 has a slightly higher TDP of 10 Watts. The TDP refers to the amount of power that a processor is designed to dissipate while operating under typical workloads. In this case, the Dimensity 700 may consume more power than the Kirin 950.
In conclusion, the HiSilicon Kirin 950 and the MediaTek Dimensity 700 have several differences in their specifications. The Kirin 950 offers higher clock speed for its powerful cores, while the Dimensity 700 focuses on power efficiency with a more advanced lithography. The number of transistors and the TDP also differ between the two processors. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the device and the user.
CPU cores and architecture
Architecture | 4x 2.4 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 16 nm | 7 nm |
Number of transistors | 2000 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 4 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1333 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T880 MP4 | Mali-G57 MP2 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 900 MHz | 950 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 11.2 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | |
Max camera resolution | 1x 31MP, 2x 13MP | 1x 64MP, 2x 16MP |
Max Video Capture | FullHD@60fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2015 November | 2021 Quarter 1 |
Partnumber | Hi3650 | MT6833V/ZA, MT6833V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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