HiSilicon Kirin 935 vs MediaTek Dimensity 810
The HiSilicon Kirin 935 and MediaTek Dimensity 810 are two processors that are commonly used in mobile devices. While they both have similar features, there are some key differences between them.
In terms of CPU cores and architecture, the Kirin 935 has a total of 8 cores divided into 2 clusters. It consists of 4 Cortex-A53 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.5 GHz. On the other hand, the Dimensity 810 also has 8 cores, but with a different architecture. It includes 2 powerful Cortex-A76 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. This means that the Dimensity 810 has a more powerful configuration in terms of clock speed and architecture.
When it comes to other specifications, the Kirin 935 operates on a 28 nm lithography process, while the Dimensity 810 has a more advanced 6 nm lithography process. This indicates that the Dimensity 810 is likely to be more power-efficient and generate less heat compared to the Kirin 935. Additionally, the Dimensity 810 boasts a much higher number of transistors at 12 billion, while the Kirin 935 has 1 billion. This suggests that the Dimensity 810 is capable of handling more complex tasks and processing data at a faster rate.
Furthermore, the Dimensity 810 has an additional feature called Neural Processing Unit (NPU), which enhances artificial intelligence (AI) capabilities. The Kirin 935 does not include such specialized AI processing capabilities.
In terms of power consumption, the Kirin 935 has a TDP (Thermal Design Power) of 7 Watts, while the Dimensity 810 has a slightly higher TDP of 8 Watts. This means that the Dimensity 810 may consume a bit more power than the Kirin 935.
Overall, both processors have their own strengths and weaknesses. While the Kirin 935 may offer better power efficiency, the Dimensity 810 outshines it in terms of clock speed, lithography process, and AI capabilities. Ultimately, the choice between these two processors would depend on the specific requirements and priorities of the device manufacturer and the consumers.
In terms of CPU cores and architecture, the Kirin 935 has a total of 8 cores divided into 2 clusters. It consists of 4 Cortex-A53 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.5 GHz. On the other hand, the Dimensity 810 also has 8 cores, but with a different architecture. It includes 2 powerful Cortex-A76 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. This means that the Dimensity 810 has a more powerful configuration in terms of clock speed and architecture.
When it comes to other specifications, the Kirin 935 operates on a 28 nm lithography process, while the Dimensity 810 has a more advanced 6 nm lithography process. This indicates that the Dimensity 810 is likely to be more power-efficient and generate less heat compared to the Kirin 935. Additionally, the Dimensity 810 boasts a much higher number of transistors at 12 billion, while the Kirin 935 has 1 billion. This suggests that the Dimensity 810 is capable of handling more complex tasks and processing data at a faster rate.
Furthermore, the Dimensity 810 has an additional feature called Neural Processing Unit (NPU), which enhances artificial intelligence (AI) capabilities. The Kirin 935 does not include such specialized AI processing capabilities.
In terms of power consumption, the Kirin 935 has a TDP (Thermal Design Power) of 7 Watts, while the Dimensity 810 has a slightly higher TDP of 8 Watts. This means that the Dimensity 810 may consume a bit more power than the Kirin 935.
Overall, both processors have their own strengths and weaknesses. While the Kirin 935 may offer better power efficiency, the Dimensity 810 outshines it in terms of clock speed, lithography process, and AI capabilities. Ultimately, the choice between these two processors would depend on the specific requirements and priorities of the device manufacturer and the consumers.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
Number of transistors | 1000 million | 12000 million |
TDP | 7 Watt | 8 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP2 |
GPU Architecture | Mali Midgard | Mali Valhall |
GPU frequency | 680 MHz | 950 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@120Hz |
Max camera resolution | 1x 20MP | 1x 64MP, 2x 16MP |
Max Video Capture | 4K@30fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 Quarter 3 |
Partnumber | Hi3635 | MT6833V/PNZA, MT6833P |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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