HiSilicon Kirin 935 vs MediaTek Dimensity 810

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The HiSilicon Kirin 935 and MediaTek Dimensity 810 are two processors that are commonly used in mobile devices. While they both have similar features, there are some key differences between them.

In terms of CPU cores and architecture, the Kirin 935 has a total of 8 cores divided into 2 clusters. It consists of 4 Cortex-A53 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.5 GHz. On the other hand, the Dimensity 810 also has 8 cores, but with a different architecture. It includes 2 powerful Cortex-A76 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. This means that the Dimensity 810 has a more powerful configuration in terms of clock speed and architecture.

When it comes to other specifications, the Kirin 935 operates on a 28 nm lithography process, while the Dimensity 810 has a more advanced 6 nm lithography process. This indicates that the Dimensity 810 is likely to be more power-efficient and generate less heat compared to the Kirin 935. Additionally, the Dimensity 810 boasts a much higher number of transistors at 12 billion, while the Kirin 935 has 1 billion. This suggests that the Dimensity 810 is capable of handling more complex tasks and processing data at a faster rate.

Furthermore, the Dimensity 810 has an additional feature called Neural Processing Unit (NPU), which enhances artificial intelligence (AI) capabilities. The Kirin 935 does not include such specialized AI processing capabilities.

In terms of power consumption, the Kirin 935 has a TDP (Thermal Design Power) of 7 Watts, while the Dimensity 810 has a slightly higher TDP of 8 Watts. This means that the Dimensity 810 may consume a bit more power than the Kirin 935.

Overall, both processors have their own strengths and weaknesses. While the Kirin 935 may offer better power efficiency, the Dimensity 810 outshines it in terms of clock speed, lithography process, and AI capabilities. Ultimately, the choice between these two processors would depend on the specific requirements and priorities of the device manufacturer and the consumers.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 28 nm 6 nm
Number of transistors 1000 million 12000 million
TDP 7 Watt 8 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR3 LPDDR4X
Memory frequency 800 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.0 UFS 2.2

Graphics

GPU name Mali-T628 MP4 Mali-G57 MP2
GPU Architecture Midgard Valhall
GPU frequency 680 MHz 950 MHz
Execution units 4 2
Shaders 64 32
DirectX 11 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2560x1600 2520x1080@120Hz
Max camera resolution 1x 20MP 1x 64MP, 2x 16MP
Max Video Capture 4K@30fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.77 Gbps
Peak Upload Speed 0.05 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2015 Quarter 2 2021 Quarter 3
Partnumber Hi3635 MT6833V/PNZA, MT6833P
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 935
Dimensity 810
356915

GeekBench 6 Single-Core

Score
Kirin 935
Dimensity 810
584

GeekBench 6 Multi-Core

Score
Kirin 935
Dimensity 810
1662