HiSilicon Kirin 935 vs MediaTek Dimensity 720

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The HiSilicon Kirin 935 and MediaTek Dimensity 720 are both processors commonly found in smartphones and other devices. When comparing their specifications, several key differences stand out.

Starting with the HiSilicon Kirin 935, it features eight CPU cores, divided into two clusters. The first cluster consists of four Cortex-A53 cores running at a maximum frequency of 2.2 GHz, while the second cluster includes four Cortex-A53 cores clocked at 1.5 GHz. This architecture allows for a balanced performance, ensuring efficient handling of everyday tasks. The Kirin 935 adopts the ARMv8-A instruction set and is built on a 28 nm lithography process, with approximately 1 billion transistors. It has a relatively low thermal design power (TDP) of 7 Watts, enabling energy efficiency.

On the other hand, the MediaTek Dimensity 720 also has eight CPU cores, but with a different distribution. It comprises two powerful Cortex-A76 cores operating at a maximum frequency of 2.2 GHz, accompanied by six Cortex-A55 cores running at 2 GHz. This configuration offers a blend of high-performance and power-efficiency, allowing for smooth multitasking and resource-intensive applications. The Dimensity 720 utilizes the ARMv8.2-A instruction set and relies on a more advanced 7 nm lithography process, resulting in improved power efficiency and better thermal management. Additionally, it features a neural processing unit (NPU), which enhances AI-related tasks and contributes to improved performance in tasks like image recognition and voice processing. The TDP of the Dimensity 720 is slightly higher at 10 Watts.

In summary, when comparing the HiSilicon Kirin 935 and MediaTek Dimensity 720 processors, they differ in their CPU architecture, lithography process, instruction set, and TDP. The HiSilicon Kirin 935 offers a balanced performance with its eight Cortex-A53 cores, while the MediaTek Dimensity 720 provides a combination of power and efficiency with its two Cortex-A76 cores and NPU. The Dimensity 720 also benefits from a more advanced 7 nm lithography process, offering better power efficiency. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the device or smartphone that they will be used in.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 28 nm 7 nm
Number of transistors 1000 million
TDP 7 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR3 LPDDR4X
Memory frequency 800 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.0 UFS 2.2

Graphics

GPU name Mali-T628 MP4 Mali-G57 MP3
GPU Architecture Midgard Valhall
GPU frequency 680 MHz 850 MHz
Execution units 4 3
Shaders 64
DirectX 11 12
OpenCL API 1.2 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2560x1600 2520x1080@90Hz
Max camera resolution 1x 20MP 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.77 Gbps
Peak Upload Speed 0.05 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2015 Quarter 2 2020 Quarter 3
Partnumber Hi3635 MT6853V/ZA, MT6853V/NZA
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 935
Dimensity 720
293337

GeekBench 6 Single-Core

Score
Kirin 935
Dimensity 720
540

GeekBench 6 Multi-Core

Score
Kirin 935
Dimensity 720
1698