HiSilicon Kirin 935 vs MediaTek Dimensity 720
The HiSilicon Kirin 935 and MediaTek Dimensity 720 are both processors commonly found in smartphones and other devices. When comparing their specifications, several key differences stand out.
Starting with the HiSilicon Kirin 935, it features eight CPU cores, divided into two clusters. The first cluster consists of four Cortex-A53 cores running at a maximum frequency of 2.2 GHz, while the second cluster includes four Cortex-A53 cores clocked at 1.5 GHz. This architecture allows for a balanced performance, ensuring efficient handling of everyday tasks. The Kirin 935 adopts the ARMv8-A instruction set and is built on a 28 nm lithography process, with approximately 1 billion transistors. It has a relatively low thermal design power (TDP) of 7 Watts, enabling energy efficiency.
On the other hand, the MediaTek Dimensity 720 also has eight CPU cores, but with a different distribution. It comprises two powerful Cortex-A76 cores operating at a maximum frequency of 2.2 GHz, accompanied by six Cortex-A55 cores running at 2 GHz. This configuration offers a blend of high-performance and power-efficiency, allowing for smooth multitasking and resource-intensive applications. The Dimensity 720 utilizes the ARMv8.2-A instruction set and relies on a more advanced 7 nm lithography process, resulting in improved power efficiency and better thermal management. Additionally, it features a neural processing unit (NPU), which enhances AI-related tasks and contributes to improved performance in tasks like image recognition and voice processing. The TDP of the Dimensity 720 is slightly higher at 10 Watts.
In summary, when comparing the HiSilicon Kirin 935 and MediaTek Dimensity 720 processors, they differ in their CPU architecture, lithography process, instruction set, and TDP. The HiSilicon Kirin 935 offers a balanced performance with its eight Cortex-A53 cores, while the MediaTek Dimensity 720 provides a combination of power and efficiency with its two Cortex-A76 cores and NPU. The Dimensity 720 also benefits from a more advanced 7 nm lithography process, offering better power efficiency. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the device or smartphone that they will be used in.
Starting with the HiSilicon Kirin 935, it features eight CPU cores, divided into two clusters. The first cluster consists of four Cortex-A53 cores running at a maximum frequency of 2.2 GHz, while the second cluster includes four Cortex-A53 cores clocked at 1.5 GHz. This architecture allows for a balanced performance, ensuring efficient handling of everyday tasks. The Kirin 935 adopts the ARMv8-A instruction set and is built on a 28 nm lithography process, with approximately 1 billion transistors. It has a relatively low thermal design power (TDP) of 7 Watts, enabling energy efficiency.
On the other hand, the MediaTek Dimensity 720 also has eight CPU cores, but with a different distribution. It comprises two powerful Cortex-A76 cores operating at a maximum frequency of 2.2 GHz, accompanied by six Cortex-A55 cores running at 2 GHz. This configuration offers a blend of high-performance and power-efficiency, allowing for smooth multitasking and resource-intensive applications. The Dimensity 720 utilizes the ARMv8.2-A instruction set and relies on a more advanced 7 nm lithography process, resulting in improved power efficiency and better thermal management. Additionally, it features a neural processing unit (NPU), which enhances AI-related tasks and contributes to improved performance in tasks like image recognition and voice processing. The TDP of the Dimensity 720 is slightly higher at 10 Watts.
In summary, when comparing the HiSilicon Kirin 935 and MediaTek Dimensity 720 processors, they differ in their CPU architecture, lithography process, instruction set, and TDP. The HiSilicon Kirin 935 offers a balanced performance with its eight Cortex-A53 cores, while the MediaTek Dimensity 720 provides a combination of power and efficiency with its two Cortex-A76 cores and NPU. The Dimensity 720 also benefits from a more advanced 7 nm lithography process, offering better power efficiency. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the device or smartphone that they will be used in.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 7 nm |
Number of transistors | 1000 million | |
TDP | 7 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP3 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 680 MHz | 850 MHz |
Execution units | 4 | 3 |
Shaders | 64 | |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@90Hz |
Max camera resolution | 1x 20MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2020 Quarter 3 |
Partnumber | Hi3635 | MT6853V/ZA, MT6853V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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