HiSilicon Kirin 935 vs MediaTek Dimensity 700

The HiSilicon Kirin 935 and the MediaTek Dimensity 700 are two processors known for their performance and efficiency. While both processors have similarities, they also have key differences that set them apart.

In terms of CPU cores and architecture, the HiSilicon Kirin 935 features 4x 2.2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This gives a total of 8 cores and an ARMv8-A instruction set. On the other hand, the MediaTek Dimensity 700 offers 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. It also has 8 cores, but with an ARMv8.2-A instruction set.

When it comes to lithography, the HiSilicon Kirin 935 has a 28 nm lithography, while the MediaTek Dimensity 700 boasts a much more advanced 7 nm lithography. This means that the Dimensity 700 has a smaller transistor size and is more power-efficient than the Kirin 935.

Speaking of transistors, the Kirin 935 has 1000 million transistors, but the Dimensity 700's transistor count is not specified. However, the Dimensity 700's more modern 7 nm lithography suggests that it might have a higher transistor count, which can positively impact performance and power efficiency.

In terms of thermal design power (TDP), the Kirin 935 has a TDP of 7 Watts, while the Dimensity 700 has a slightly higher TDP of 10 Watts. This indicates that the Kirin 935 is more power-efficient and generates less heat compared to the Dimensity 700.

Overall, both processors have their own strengths and weaknesses. The Kirin 935 may have a lower TDP and potentially greater transistor count, but the Dimensity 700 offers a more advanced lithography and configuration of cores for potentially better performance. Ultimately, the choice between these processors will depend on specific requirements and preferences in terms of power efficiency and performance in various applications.