HiSilicon Kirin 930 vs Unisoc Tiger T700
The HiSilicon Kirin 930 and the Unisoc Tiger T700 are two processors that stand out in terms of their specifications. Both processors feature multiple cores and architecture that contribute to their overall performance and efficiency.
Starting with the HiSilicon Kirin 930, it boasts a unique architecture that comprises 4x 2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53 cores. With a total of 8 cores, this processor is capable of handling complex tasks efficiently. The instruction set, ARMv8-A, ensures compatibility with a wide range of applications. The processor uses a 28 nm lithography, indicating a level of efficiency in power consumption. TDP (Thermal Design Power) of 5 Watt indicates a relatively low power consumption level.
On the other hand, the Unisoc Tiger T700 features a slightly different architecture with 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A5 cores. Similarly, it offers 8 cores, which can handle multitasking and demanding applications effectively. The instruction set is ARMv8.2-A, ensuring compatibility and efficient processing. With a smaller lithography of 12 nm, this processor has the advantage of being more power efficient than the HiSilicon Kirin 930. However, it has a higher TDP of 10 Watts, indicating that it may consume more power.
In conclusion, both the HiSilicon Kirin 930 and the Unisoc Tiger T700 have their unique specifications that cater to different user requirements. The HiSilicon Kirin 930 offers a balanced combination of power and efficiency with its 28 nm lithography and low TDP. The Unisoc Tiger T700, on the other hand, boasts a smaller lithography of 12 nm, making it more power efficient. Ultimately, the choice between the two processors will depend on the specific needs and preferences of the user.
Starting with the HiSilicon Kirin 930, it boasts a unique architecture that comprises 4x 2 GHz Cortex-A53 and 4x 1.5 GHz Cortex-A53 cores. With a total of 8 cores, this processor is capable of handling complex tasks efficiently. The instruction set, ARMv8-A, ensures compatibility with a wide range of applications. The processor uses a 28 nm lithography, indicating a level of efficiency in power consumption. TDP (Thermal Design Power) of 5 Watt indicates a relatively low power consumption level.
On the other hand, the Unisoc Tiger T700 features a slightly different architecture with 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A5 cores. Similarly, it offers 8 cores, which can handle multitasking and demanding applications effectively. The instruction set is ARMv8.2-A, ensuring compatibility and efficient processing. With a smaller lithography of 12 nm, this processor has the advantage of being more power efficient than the HiSilicon Kirin 930. However, it has a higher TDP of 10 Watts, indicating that it may consume more power.
In conclusion, both the HiSilicon Kirin 930 and the Unisoc Tiger T700 have their unique specifications that cater to different user requirements. The HiSilicon Kirin 930 offers a balanced combination of power and efficiency with its 28 nm lithography and low TDP. The Unisoc Tiger T700, on the other hand, boasts a smaller lithography of 12 nm, making it more power efficient. Ultimately, the choice between the two processors will depend on the specific needs and preferences of the user.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 12 nm |
Number of transistors | 1000 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G52 MP2 |
GPU Architecture | Midgard | Bifrost |
GPU frequency | 600 MHz | 850 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 11 | 11 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2400x1080 |
Max camera resolution | 1x 20MP | 1x 48MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.05 Gbps | 0.1 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 March |
Partnumber | Hi3630 | T700 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
HiSilicon Kirin 935 vs Unisoc Tiger T616
2
Samsung Exynos 7870 vs Samsung Exynos 8895
3
MediaTek Dimensity 1050 vs Google Tensor G2
4
Samsung Exynos 1380 vs HiSilicon Kirin 930
5
Unisoc Tiger T310 vs MediaTek Dimensity 6020
6
Apple A14 Bionic vs Qualcomm Snapdragon 665
7
Unisoc SC9832E vs HiSilicon Kirin 990 5G
8
MediaTek Helio A25 vs MediaTek Dimensity 1200
9
MediaTek Dimensity 1100 vs MediaTek Dimensity 800U
10
MediaTek Dimensity 9000 Plus vs MediaTek Helio G80