HiSilicon Kirin 930 vs MediaTek Dimensity 900
The HiSilicon Kirin 930 and MediaTek Dimensity 900 are both processors designed for mobile devices, but they have some key differences in their specifications.
Starting with the HiSilicon Kirin 930, it features a CPU architecture that includes 4 Cortex-A53 cores clocked at 2 GHz and another set of 4 Cortex-A53 cores clocked at 1.5 GHz. This provides a total of 8 cores for enhanced multitasking capabilities. The Kirin 930 is based on the ARMv8-A instruction set and has a lithography of 28 nm, which indicates its manufacturing process. With around 1000 million transistors, it offers a decent level of performance while maintaining a low power consumption of 5 Watts.
On the other hand, the MediaTek Dimensity 900 has a different CPU architecture. It consists of 2 Cortex-A78 cores clocked at 2.4 GHz for high-performance tasks and 6 Cortex-A55 cores clocked at 2.0 GHz for power efficiency. Like the Kirin 930, it also has 8 cores in total. However, it utilizes the ARMv8.2-A instruction set, which may offer some advanced features that the Kirin 930 lacks. The Dimensity 900 boasts a lithography of 6 nm, indicating a more advanced manufacturing process. With around 10000 million transistors, it possesses a higher level of integration and likely offers improved performance compared to the Kirin 930. However, this comes at the cost of a higher power consumption of 10 Watts.
Another difference between the two processors is that the MediaTek Dimensity 900 includes a Neural Processing Unit (NPU). This specialized hardware component accelerates AI-related tasks, such as machine learning and computer vision. While the Kirin 930 does not have an NPU, it is still capable of executing these tasks, albeit potentially at a slower pace.
In conclusion, the HiSilicon Kirin 930 and MediaTek Dimensity 900 have distinct specifications. The Kirin 930 offers a balanced combination of cores with a lower TDP and lithography, while the Dimensity 900 provides high-performance Cortex-A78 cores, a more advanced manufacturing process, and an NPU for AI tasks. Depending on the specific requirements and priorities of users, either processor may offer a suitable choice for different mobile devices.
Starting with the HiSilicon Kirin 930, it features a CPU architecture that includes 4 Cortex-A53 cores clocked at 2 GHz and another set of 4 Cortex-A53 cores clocked at 1.5 GHz. This provides a total of 8 cores for enhanced multitasking capabilities. The Kirin 930 is based on the ARMv8-A instruction set and has a lithography of 28 nm, which indicates its manufacturing process. With around 1000 million transistors, it offers a decent level of performance while maintaining a low power consumption of 5 Watts.
On the other hand, the MediaTek Dimensity 900 has a different CPU architecture. It consists of 2 Cortex-A78 cores clocked at 2.4 GHz for high-performance tasks and 6 Cortex-A55 cores clocked at 2.0 GHz for power efficiency. Like the Kirin 930, it also has 8 cores in total. However, it utilizes the ARMv8.2-A instruction set, which may offer some advanced features that the Kirin 930 lacks. The Dimensity 900 boasts a lithography of 6 nm, indicating a more advanced manufacturing process. With around 10000 million transistors, it possesses a higher level of integration and likely offers improved performance compared to the Kirin 930. However, this comes at the cost of a higher power consumption of 10 Watts.
Another difference between the two processors is that the MediaTek Dimensity 900 includes a Neural Processing Unit (NPU). This specialized hardware component accelerates AI-related tasks, such as machine learning and computer vision. While the Kirin 930 does not have an NPU, it is still capable of executing these tasks, albeit potentially at a slower pace.
In conclusion, the HiSilicon Kirin 930 and MediaTek Dimensity 900 have distinct specifications. The Kirin 930 offers a balanced combination of cores with a lower TDP and lithography, while the Dimensity 900 provides high-performance Cortex-A78 cores, a more advanced manufacturing process, and an NPU for AI tasks. Depending on the specific requirements and priorities of users, either processor may offer a suitable choice for different mobile devices.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 6 nm |
Number of transistors | 1000 million | 10000 million |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR3 | LPDDR5 |
Memory frequency | 800 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 3.1 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G68 MP4 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 600 MHz | 900 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@120Hz |
Max camera resolution | 1x 20MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 Quarter 1 |
Partnumber | Hi3630 | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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