HiSilicon Kirin 930 vs MediaTek Dimensity 900

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The HiSilicon Kirin 930 and MediaTek Dimensity 900 are both processors designed for mobile devices, but they have some key differences in their specifications.

Starting with the HiSilicon Kirin 930, it features a CPU architecture that includes 4 Cortex-A53 cores clocked at 2 GHz and another set of 4 Cortex-A53 cores clocked at 1.5 GHz. This provides a total of 8 cores for enhanced multitasking capabilities. The Kirin 930 is based on the ARMv8-A instruction set and has a lithography of 28 nm, which indicates its manufacturing process. With around 1000 million transistors, it offers a decent level of performance while maintaining a low power consumption of 5 Watts.

On the other hand, the MediaTek Dimensity 900 has a different CPU architecture. It consists of 2 Cortex-A78 cores clocked at 2.4 GHz for high-performance tasks and 6 Cortex-A55 cores clocked at 2.0 GHz for power efficiency. Like the Kirin 930, it also has 8 cores in total. However, it utilizes the ARMv8.2-A instruction set, which may offer some advanced features that the Kirin 930 lacks. The Dimensity 900 boasts a lithography of 6 nm, indicating a more advanced manufacturing process. With around 10000 million transistors, it possesses a higher level of integration and likely offers improved performance compared to the Kirin 930. However, this comes at the cost of a higher power consumption of 10 Watts.

Another difference between the two processors is that the MediaTek Dimensity 900 includes a Neural Processing Unit (NPU). This specialized hardware component accelerates AI-related tasks, such as machine learning and computer vision. While the Kirin 930 does not have an NPU, it is still capable of executing these tasks, albeit potentially at a slower pace.

In conclusion, the HiSilicon Kirin 930 and MediaTek Dimensity 900 have distinct specifications. The Kirin 930 offers a balanced combination of cores with a lower TDP and lithography, while the Dimensity 900 provides high-performance Cortex-A78 cores, a more advanced manufacturing process, and an NPU for AI tasks. Depending on the specific requirements and priorities of users, either processor may offer a suitable choice for different mobile devices.

CPU cores and architecture

Architecture 4x 2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 28 nm 6 nm
Number of transistors 1000 million 10000 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR3 LPDDR5
Memory frequency 800 MHz 3200 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.0 UFS 3.1

Graphics

GPU name Mali-T628 MP4 Mali-G68 MP4
GPU Architecture Midgard Valhall
GPU frequency 600 MHz 900 MHz
Execution units 4 4
Shaders 64 64
DirectX 11 12
OpenCL API 1.2 2.0
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2560x1600 2520x1080@120Hz
Max camera resolution 1x 20MP 1x 108MP, 2x 20MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.3 Gbps 2.77 Gbps
Peak Upload Speed 0.05 Gbps 1.2 Gbps
Wi-Fi 5 (802.11ac) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou
GPS
Galileo
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2015 Quarter 2 2021 Quarter 1
Partnumber Hi3630 MT6877
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 930
Dimensity 900
435318

GeekBench 6 Single-Core

Score
Kirin 930
Dimensity 900
704

GeekBench 6 Multi-Core

Score
Kirin 930
Dimensity 900
2139