HiSilicon Kirin 930 vs MediaTek Dimensity 700
The HiSilicon Kirin 930 and the MediaTek Dimensity 700 are two processors that cater to different needs and offer varying performance levels. Let's delve into their specifications to understand their differences and similarities.
Starting with the HiSilicon Kirin 930, it features an architecture composed of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This design allows for a balance between power and efficiency. With a total of 8 cores, the Kirin 930 offers multitasking capabilities for smoother performance. It operates on the ARMv8-A instruction set and is built on a 28 nm lithography process, making it suitable for mid-range smartphones. The Kirin 930 has a TDP (Thermal Design Power) of 5 Watts, indicating its power consumption levels.
On the other hand, the MediaTek Dimensity 700 boasts an architecture consisting of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This configuration emphasizes power and performance, especially for demanding tasks. Like the Kirin 930, it also has 8 cores, ensuring efficient multitasking capabilities. The Dimensity 700 operates on the newer ARMv8.2-A instruction set, which brings potential optimizations and enhancements. What sets it apart from the Kirin 930 is its 7 nm lithography process, allowing for more power efficiency. The Dimensity 700 has a slightly higher TDP of 10 Watts, indicating its higher power consumption.
In summary, while both processors offer an octa-core setup, they differ in their core configurations and lithography processes. The Kirin 930 focuses on a balanced power-efficiency ratio with its Cortex-A53 cores and 28 nm lithography, whereas the Dimensity 700 leans towards raw power and performance with its Cortex-A76 cores and 7 nm lithography. Choosing between the two would depend on the specific needs of the user – whether power efficiency or maximum performance is prioritized – and the devices they are intended for.
Starting with the HiSilicon Kirin 930, it features an architecture composed of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. This design allows for a balance between power and efficiency. With a total of 8 cores, the Kirin 930 offers multitasking capabilities for smoother performance. It operates on the ARMv8-A instruction set and is built on a 28 nm lithography process, making it suitable for mid-range smartphones. The Kirin 930 has a TDP (Thermal Design Power) of 5 Watts, indicating its power consumption levels.
On the other hand, the MediaTek Dimensity 700 boasts an architecture consisting of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This configuration emphasizes power and performance, especially for demanding tasks. Like the Kirin 930, it also has 8 cores, ensuring efficient multitasking capabilities. The Dimensity 700 operates on the newer ARMv8.2-A instruction set, which brings potential optimizations and enhancements. What sets it apart from the Kirin 930 is its 7 nm lithography process, allowing for more power efficiency. The Dimensity 700 has a slightly higher TDP of 10 Watts, indicating its higher power consumption.
In summary, while both processors offer an octa-core setup, they differ in their core configurations and lithography processes. The Kirin 930 focuses on a balanced power-efficiency ratio with its Cortex-A53 cores and 28 nm lithography, whereas the Dimensity 700 leans towards raw power and performance with its Cortex-A76 cores and 7 nm lithography. Choosing between the two would depend on the specific needs of the user – whether power efficiency or maximum performance is prioritized – and the devices they are intended for.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 28 nm | 7 nm |
Number of transistors | 1000 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR3 | LPDDR4X |
Memory frequency | 800 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.2 |
Graphics
GPU name | Mali-T628 MP4 | Mali-G57 MP2 |
GPU Architecture | Midgard | Valhall |
GPU frequency | 600 MHz | 950 MHz |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 11 | 12 |
OpenCL API | 1.2 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2560x1600 | 2520x1080@90Hz |
Max camera resolution | 1x 20MP | 1x 64MP, 2x 16MP |
Max Video Capture | 4K@30fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.05 Gbps | 1.2 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2021 Quarter 1 |
Partnumber | Hi3630 | MT6833V/ZA, MT6833V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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