HiSilicon Kirin 930 vs HiSilicon Kirin 950
The HiSilicon Kirin 930 and HiSilicon Kirin 950 are both processors developed by HiSilicon, but they differ in terms of their specifications and capabilities.
Starting with the HiSilicon Kirin 930, it features a CPU architecture consisting of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores, resulting in a total of 8 cores. This processor is built using a 28 nm lithography process and has a total of 1000 million transistors. It operates at a power consumption of 5 Watts.
On the other hand, the HiSilicon Kirin 950 showcases improvements in its specifications. It boasts a more powerful CPU architecture, with 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores, also totaling 8 cores. The Kirin 950 is built using a more advanced 16 nm lithography process and has a significantly higher number of transistors, at 2000 million. It operates at the same power consumption level as the Kirin 930, at 5 Watts.
The upgrade from Cortex-A53 cores to Cortex-A72 cores in the Kirin 950 translates to better performance and power efficiency. The 2.4 GHz clock speed of the Cortex-A72 cores allows for faster processing and multitasking capabilities compared to the 2 GHz speed of the Kirin 930. Additionally, the Kirin 950's 16 nm lithography process and higher number of transistors signify improved manufacturing technology and potentially better heat dissipation.
Overall, the HiSilicon Kirin 950 offers superior specifications compared to the Kirin 930. It comes with more advanced architecture, higher clock speeds, and a more efficient manufacturing process. These improvements may result in better performance, faster processing speeds, and improved power efficiency, making the Kirin 950 a more capable and future-proof choice for devices that utilize it as the processor.
Starting with the HiSilicon Kirin 930, it features a CPU architecture consisting of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores, resulting in a total of 8 cores. This processor is built using a 28 nm lithography process and has a total of 1000 million transistors. It operates at a power consumption of 5 Watts.
On the other hand, the HiSilicon Kirin 950 showcases improvements in its specifications. It boasts a more powerful CPU architecture, with 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores, also totaling 8 cores. The Kirin 950 is built using a more advanced 16 nm lithography process and has a significantly higher number of transistors, at 2000 million. It operates at the same power consumption level as the Kirin 930, at 5 Watts.
The upgrade from Cortex-A53 cores to Cortex-A72 cores in the Kirin 950 translates to better performance and power efficiency. The 2.4 GHz clock speed of the Cortex-A72 cores allows for faster processing and multitasking capabilities compared to the 2 GHz speed of the Kirin 930. Additionally, the Kirin 950's 16 nm lithography process and higher number of transistors signify improved manufacturing technology and potentially better heat dissipation.
Overall, the HiSilicon Kirin 950 offers superior specifications compared to the Kirin 930. It comes with more advanced architecture, higher clock speeds, and a more efficient manufacturing process. These improvements may result in better performance, faster processing speeds, and improved power efficiency, making the Kirin 950 a more capable and future-proof choice for devices that utilize it as the processor.
CPU cores and architecture
Architecture | 4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
4x 2.4 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 28 nm | 16 nm |
Number of transistors | 1000 million | 2000 million |
TDP | 5 Watt | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR3 | LPDDR4 |
Memory frequency | 800 MHz | 1333 MHz |
Memory-bus | 2x32 bit | 2x32 bit |
Storage
Storage specification | UFS 2.0 | UFS 2.0 |
Graphics
GPU name | Mali-T628 MP4 | Mali-T880 MP4 |
GPU Architecture | Midgard | Midgard |
GPU frequency | 600 MHz | 900 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 11 | 11.2 |
OpenCL API | 1.2 | 1.2 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2560x1600 | |
Max camera resolution | 1x 20MP | 1x 31MP, 2x 13MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 |
H.264 (AVC) H.265 (HEVC) VP8 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.3 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.05 Gbps | 0.05 Gbps |
Wi-Fi | 5 (802.11ac) | 5 (802.11ac) |
Bluetooth | 4.2 | 4.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2015 Quarter 2 | 2015 November |
Partnumber | Hi3630 | Hi3650 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Helio G37 vs Google Tensor G1
2
MediaTek Helio G35 vs Qualcomm Snapdragon 765G
3
MediaTek Dimensity 8200 vs Qualcomm Snapdragon 670
4
MediaTek Dimensity 8000 vs Qualcomm Snapdragon 7 Gen 1
5
Samsung Exynos 1330 vs MediaTek Helio P70
6
Qualcomm Snapdragon 768G vs Qualcomm Snapdragon 821
7
Qualcomm Snapdragon 870 vs MediaTek Dimensity 1200
8
HiSilicon Kirin 710F vs MediaTek Dimensity 720
9
Qualcomm Snapdragon 6 Gen 1 vs Qualcomm Snapdragon 732G
10
Samsung Exynos 2200 vs Apple A14 Bionic