HiSilicon Kirin 9000E 5G vs MediaTek Dimensity 720
The HiSilicon Kirin 9000E 5G and MediaTek Dimensity 720 are two processors that offer different specifications. Let's compare them below.
Starting with the HiSilicon Kirin 9000E 5G, it boasts a powerful CPU architecture. It is equipped with 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This eight-core processor operates on the ARMv8.2-A instruction set. With a lithography of 5 nm, it offers improved efficiency and power consumption. The Kirin 9000E 5G packs 15300 million transistors and has a TDP of 6 Watt. It also features advanced neural processing capabilities using Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0.
Moving on to the MediaTek Dimensity 720, it utilizes a different CPU architecture. It consists of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Like the Kirin 9000E 5G, it operates on the ARMv8.2-A instruction set. However, it has a slightly larger lithography of 7 nm. The Dimensity 720 is an eight-core processor that offers a TDP of 10 Watt. It incorporates a neural processing unit (NPU) for efficient AI performance.
In terms of specifications, the Kirin 9000E 5G has a smaller lithography, which generally indicates better power efficiency. It also has a higher number of transistors, potentially enabling better performance. The Kirin 9000E 5G's CPU architecture consists of both high-performance and power-efficient cores, providing a balance between power and efficiency. Additionally, the Kirin 9000E 5G integrates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for enhanced neural processing capabilities.
On the other hand, the Dimensity 720 has a lower TDP but a larger lithography compared to the Kirin 9000E 5G. It offers a combination of Cortex-A76 and Cortex-A55 cores for a balanced performance. The Dimensity 720 features an NPU to enhance its AI capabilities.
In conclusion, while both processors have their unique strengths, the HiSilicon Kirin 9000E 5G appears to offer a more advanced CPU architecture and better neural processing capabilities. However, the MediaTek Dimensity 720 may provide a more power-efficient option. The choice ultimately depends on the specific needs and preferences of the user.
Starting with the HiSilicon Kirin 9000E 5G, it boasts a powerful CPU architecture. It is equipped with 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This eight-core processor operates on the ARMv8.2-A instruction set. With a lithography of 5 nm, it offers improved efficiency and power consumption. The Kirin 9000E 5G packs 15300 million transistors and has a TDP of 6 Watt. It also features advanced neural processing capabilities using Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0.
Moving on to the MediaTek Dimensity 720, it utilizes a different CPU architecture. It consists of 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Like the Kirin 9000E 5G, it operates on the ARMv8.2-A instruction set. However, it has a slightly larger lithography of 7 nm. The Dimensity 720 is an eight-core processor that offers a TDP of 10 Watt. It incorporates a neural processing unit (NPU) for efficient AI performance.
In terms of specifications, the Kirin 9000E 5G has a smaller lithography, which generally indicates better power efficiency. It also has a higher number of transistors, potentially enabling better performance. The Kirin 9000E 5G's CPU architecture consists of both high-performance and power-efficient cores, providing a balance between power and efficiency. Additionally, the Kirin 9000E 5G integrates Ascend Lite + Ascend Tiny and HUAWEI Da Vinci Architecture 2.0 for enhanced neural processing capabilities.
On the other hand, the Dimensity 720 has a lower TDP but a larger lithography compared to the Kirin 9000E 5G. It offers a combination of Cortex-A76 and Cortex-A55 cores for a balanced performance. The Dimensity 720 features an NPU to enhance its AI capabilities.
In conclusion, while both processors have their unique strengths, the HiSilicon Kirin 9000E 5G appears to offer a more advanced CPU architecture and better neural processing capabilities. However, the MediaTek Dimensity 720 may provide a more power-efficient option. The choice ultimately depends on the specific needs and preferences of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8.2-A | ARMv8.2-A |
| Lithography | 5 nm | 7 nm |
| Number of transistors | 15300 million | |
| TDP | 6 Watt | 10 Watt |
| Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
| Max amount | up to 16 GB | up to 12 GB |
| Memory type | LPDDR5 | LPDDR4X |
| Memory frequency | 2750 MHz | 2133 MHz |
| Memory-bus | 4x16 bit | 2x16 bit |
Storage
| Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
| GPU name | Mali-G78 MP22 | Mali-G57 MP3 |
| GPU Architecture | Mali Valhall | Mali Valhall |
| GPU frequency | 760 MHz | 850 MHz |
| Execution units | 22 | 3 |
| Shaders | 352 | |
| DirectX | 12 | 12 |
| OpenCL API | 2.1 | 2.1 |
| OpenGL API | ES 3.2 | ES 3.2 |
| Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
| Max screen resolution | 3840x2160 | 2520x1080@90Hz |
| Max camera resolution | 1x 64MP, 1x 20MP + 1x 16MP | |
| Max Video Capture | 4K@60fps | 4K@30FPS |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
| Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
| Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
| Bluetooth | 5.2 | 5.1 |
| Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
| Launch Date | 2020 October | 2020 Quarter 3 |
| Partnumber | MT6853V/ZA, MT6853V/NZA | |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Flagship | Mid-end |
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