HiSilicon Kirin 9000 5G vs MediaTek Dimensity 800
The HiSilicon Kirin 9000 5G and MediaTek Dimensity 800 are two processors that cater to different segments of the market. Let's compare their specifications to understand their differences.
Starting with the HiSilicon Kirin 9000 5G, it boasts an impressive architecture, with 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This 8-core processor is built on a 5 nm lithography, which results in greater power efficiency. With 15300 million transistors and an instruction set of ARMv8.2-A, the Kirin 9000 5G offers a power-efficient performance. It also features Ascend Lite (2x) and Ascend Tiny (1x) for neural processing, along with HUAWEI Da Vinci Architecture 2.0. The TDP (thermal design power) of this processor is 6 Watts.
In contrast, the MediaTek Dimensity 800 has a slightly different architecture. It comprises 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. This 4-core processor is built on a 7 nm lithography, providing a balance between performance and power efficiency. With an instruction set of ARMv8.2-A, this processor offers a reliable performance. It is equipped with an NPU (neural processing unit) for handling AI tasks. The TDP of the Dimensity 800 is slightly higher at 10 Watts.
In summary, the Kirin 9000 5G offers a more advanced architecture with a higher number of cores compared to the Dimensity 800. It also uses a more efficient 5 nm lithography, resulting in better power efficiency. Additionally, the Kirin 9000 5G features specialized neural processing units for AI tasks. On the other hand, the Dimensity 800 offers a balanced performance with its 7 nm lithography and includes an NPU for AI tasks. The choice between the two processors would depend on the specific requirements and priorities of the user.
Starting with the HiSilicon Kirin 9000 5G, it boasts an impressive architecture, with 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This 8-core processor is built on a 5 nm lithography, which results in greater power efficiency. With 15300 million transistors and an instruction set of ARMv8.2-A, the Kirin 9000 5G offers a power-efficient performance. It also features Ascend Lite (2x) and Ascend Tiny (1x) for neural processing, along with HUAWEI Da Vinci Architecture 2.0. The TDP (thermal design power) of this processor is 6 Watts.
In contrast, the MediaTek Dimensity 800 has a slightly different architecture. It comprises 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. This 4-core processor is built on a 7 nm lithography, providing a balance between performance and power efficiency. With an instruction set of ARMv8.2-A, this processor offers a reliable performance. It is equipped with an NPU (neural processing unit) for handling AI tasks. The TDP of the Dimensity 800 is slightly higher at 10 Watts.
In summary, the Kirin 9000 5G offers a more advanced architecture with a higher number of cores compared to the Dimensity 800. It also uses a more efficient 5 nm lithography, resulting in better power efficiency. Additionally, the Kirin 9000 5G features specialized neural processing units for AI tasks. On the other hand, the Dimensity 800 offers a balanced performance with its 7 nm lithography and includes an NPU for AI tasks. The choice between the two processors would depend on the specific requirements and priorities of the user.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 7 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP24 | Mali-G57 MP4 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 650 MHz |
Execution units | 24 | 4 |
Shaders | 384 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 80MP, 1x 32MP + 1x 16MP | |
Max Video Capture | 4K@60fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 October | 2020 Quarter 2 |
Partnumber | MT6873, MT6873V | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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