HiSilicon Kirin 9000 5G vs MediaTek Dimensity 800

The HiSilicon Kirin 9000 5G and MediaTek Dimensity 800 are two processors that cater to different segments of the market. Let's compare their specifications to understand their differences.

Starting with the HiSilicon Kirin 9000 5G, it boasts an impressive architecture, with 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This 8-core processor is built on a 5 nm lithography, which results in greater power efficiency. With 15300 million transistors and an instruction set of ARMv8.2-A, the Kirin 9000 5G offers a power-efficient performance. It also features Ascend Lite (2x) and Ascend Tiny (1x) for neural processing, along with HUAWEI Da Vinci Architecture 2.0. The TDP (thermal design power) of this processor is 6 Watts.

In contrast, the MediaTek Dimensity 800 has a slightly different architecture. It comprises 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. This 4-core processor is built on a 7 nm lithography, providing a balance between performance and power efficiency. With an instruction set of ARMv8.2-A, this processor offers a reliable performance. It is equipped with an NPU (neural processing unit) for handling AI tasks. The TDP of the Dimensity 800 is slightly higher at 10 Watts.

In summary, the Kirin 9000 5G offers a more advanced architecture with a higher number of cores compared to the Dimensity 800. It also uses a more efficient 5 nm lithography, resulting in better power efficiency. Additionally, the Kirin 9000 5G features specialized neural processing units for AI tasks. On the other hand, the Dimensity 800 offers a balanced performance with its 7 nm lithography and includes an NPU for AI tasks. The choice between the two processors would depend on the specific requirements and priorities of the user.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
4x 2.0 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 4
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 7 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 16 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit


Storage specification UFS 3.1 UFS 2.2


GPU name Mali-G78 MP24 Mali-G57 MP4
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 650 MHz
Execution units 24 4
Shaders 384 64
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@60fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 October 2020 Quarter 2
Partnumber MT6873, MT6873V
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000 5G
Dimensity 800

GeekBench 6 Single-Core

Kirin 9000 5G
Dimensity 800

GeekBench 6 Multi-Core

Kirin 9000 5G
Dimensity 800