HiSilicon Kirin 9000 5G vs MediaTek Dimensity 700
The HiSilicon Kirin 9000 5G and MediaTek Dimensity 700 are two processors with different specifications. Let's compare them.
Starting with the HiSilicon Kirin 9000 5G, it boasts a powerful architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor offers a total of eight cores, ensuring efficient multitasking capabilities. With its ARMv8.2-A instruction set, it can execute a wide range of applications smoothly.
The HiSilicon Kirin 9000 5G is built on a 5 nm lithography process, which allows for reduced power consumption and improved performance. With around 15.3 billion transistors, it offers excellent processing power, making it suitable for high-demand applications. It has a TDP (Thermal Design Power) of 6 Watts, which indicates its energy-efficient nature.
When it comes to neural processing, the Kirin 9000 5G utilizes Ascend Lite (2x) and Ascend Tiny (1x) processors, contributing to enhanced AI capabilities. It features the HUAWEI Da Vinci Architecture 2.0, further improving its AI performance.
Moving on to the MediaTek Dimensity 700, it utilizes a different architecture, including 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Like the Kirin 9000 5G, it also offers a total of eight cores for efficient multitasking. It operates on the ARMv8.2-A instruction set, ensuring compatibility with various applications.
The MediaTek Dimensity 700 is built on a 7 nm lithography process, which although not as advanced as the Kirin 9000 5G, still provides decent power efficiency. It has a TDP of 10 Watts, indicating slightly higher power consumption compared to the Kirin 9000 5G.
In conclusion, both processors have their strengths. The HiSilicon Kirin 9000 5G excels in terms of its advanced architecture, higher clock speeds, smaller lithography, and lower TDP. The MediaTek Dimensity 700, on the other hand, has a less advanced architecture and slightly higher power consumption but still offers good performance for everyday tasks.
Starting with the HiSilicon Kirin 9000 5G, it boasts a powerful architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor offers a total of eight cores, ensuring efficient multitasking capabilities. With its ARMv8.2-A instruction set, it can execute a wide range of applications smoothly.
The HiSilicon Kirin 9000 5G is built on a 5 nm lithography process, which allows for reduced power consumption and improved performance. With around 15.3 billion transistors, it offers excellent processing power, making it suitable for high-demand applications. It has a TDP (Thermal Design Power) of 6 Watts, which indicates its energy-efficient nature.
When it comes to neural processing, the Kirin 9000 5G utilizes Ascend Lite (2x) and Ascend Tiny (1x) processors, contributing to enhanced AI capabilities. It features the HUAWEI Da Vinci Architecture 2.0, further improving its AI performance.
Moving on to the MediaTek Dimensity 700, it utilizes a different architecture, including 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Like the Kirin 9000 5G, it also offers a total of eight cores for efficient multitasking. It operates on the ARMv8.2-A instruction set, ensuring compatibility with various applications.
The MediaTek Dimensity 700 is built on a 7 nm lithography process, which although not as advanced as the Kirin 9000 5G, still provides decent power efficiency. It has a TDP of 10 Watts, indicating slightly higher power consumption compared to the Kirin 9000 5G.
In conclusion, both processors have their strengths. The HiSilicon Kirin 9000 5G excels in terms of its advanced architecture, higher clock speeds, smaller lithography, and lower TDP. The MediaTek Dimensity 700, on the other hand, has a less advanced architecture and slightly higher power consumption but still offers good performance for everyday tasks.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 7 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 12 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP24 | Mali-G57 MP2 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 950 MHz |
Execution units | 24 | 2 |
Shaders | 384 | 32 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@90Hz |
Max camera resolution | 1x 64MP, 2x 16MP | |
Max Video Capture | 4K@60fps | 2K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 October | 2021 Quarter 1 |
Partnumber | MT6833V/ZA, MT6833V/NZA | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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