HiSilicon Kirin 9000 5G vs MediaTek Dimensity 700

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The HiSilicon Kirin 9000 5G and MediaTek Dimensity 700 are two processors with different specifications. Let's compare them.

Starting with the HiSilicon Kirin 9000 5G, it boasts a powerful architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor offers a total of eight cores, ensuring efficient multitasking capabilities. With its ARMv8.2-A instruction set, it can execute a wide range of applications smoothly.

The HiSilicon Kirin 9000 5G is built on a 5 nm lithography process, which allows for reduced power consumption and improved performance. With around 15.3 billion transistors, it offers excellent processing power, making it suitable for high-demand applications. It has a TDP (Thermal Design Power) of 6 Watts, which indicates its energy-efficient nature.

When it comes to neural processing, the Kirin 9000 5G utilizes Ascend Lite (2x) and Ascend Tiny (1x) processors, contributing to enhanced AI capabilities. It features the HUAWEI Da Vinci Architecture 2.0, further improving its AI performance.

Moving on to the MediaTek Dimensity 700, it utilizes a different architecture, including 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Like the Kirin 9000 5G, it also offers a total of eight cores for efficient multitasking. It operates on the ARMv8.2-A instruction set, ensuring compatibility with various applications.

The MediaTek Dimensity 700 is built on a 7 nm lithography process, which although not as advanced as the Kirin 9000 5G, still provides decent power efficiency. It has a TDP of 10 Watts, indicating slightly higher power consumption compared to the Kirin 9000 5G.

In conclusion, both processors have their strengths. The HiSilicon Kirin 9000 5G excels in terms of its advanced architecture, higher clock speeds, smaller lithography, and lower TDP. The MediaTek Dimensity 700, on the other hand, has a less advanced architecture and slightly higher power consumption but still offers good performance for everyday tasks.

CPU cores and architecture

Architecture	1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55	2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55
Number of cores	8	8
Instruction Set	ARMv8.2-A	ARMv8.2-A
Lithography	5 nm	7 nm
Number of transistors	15300 million
TDP	6 Watt	10 Watt
Neural Processing	Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount	up to 16 GB	up to 12 GB
Memory type	LPDDR5	LPDDR4X
Memory frequency	2750 MHz	2133 MHz
Memory-bus	4x16 bit	2x16 bit

Storage

Storage specification

UFS 3.1

UFS 2.2

Graphics

GPU name	Mali-G78 MP24	Mali-G57 MP2
GPU Architecture	Valhall	Valhall
GPU frequency	760 MHz	950 MHz
Execution units	24	2
Shaders	384	32
DirectX	12	12
OpenCL API	2.1	2.1
OpenGL API	ES 3.2	ES 3.2
Vulkan API	1.2	1.2

Camera, Video, Display

Max screen resolution	3840x2160	2520x1080@90Hz
Max camera resolution		1x 64MP, 2x 16MP
Max Video Capture	4K@60fps	2K@30FPS
Video codec support	H.264 (AVC) H.265 (HEVC) VP8 VP9	H.264 (AVC) H.265 (HEVC) VP9

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	4.6 Gbps	2.77 Gbps
Peak Upload Speed	2.5 Gbps	1.2 Gbps
Wi-Fi	6 (802.11ax)	5 (802.11ac)
Bluetooth	5.2	5.1
Satellite navigation	BeiDou GPS Galileo GLONASS NavIC	BeiDou GPS Galileo GLONASS NavIC QZSS