HiSilicon Kirin 9000 5G vs MediaTek Dimensity 700

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The HiSilicon Kirin 9000 5G and MediaTek Dimensity 700 are two processors with different specifications. Let's compare them.

Starting with the HiSilicon Kirin 9000 5G, it boasts a powerful architecture consisting of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor offers a total of eight cores, ensuring efficient multitasking capabilities. With its ARMv8.2-A instruction set, it can execute a wide range of applications smoothly.

The HiSilicon Kirin 9000 5G is built on a 5 nm lithography process, which allows for reduced power consumption and improved performance. With around 15.3 billion transistors, it offers excellent processing power, making it suitable for high-demand applications. It has a TDP (Thermal Design Power) of 6 Watts, which indicates its energy-efficient nature.

When it comes to neural processing, the Kirin 9000 5G utilizes Ascend Lite (2x) and Ascend Tiny (1x) processors, contributing to enhanced AI capabilities. It features the HUAWEI Da Vinci Architecture 2.0, further improving its AI performance.

Moving on to the MediaTek Dimensity 700, it utilizes a different architecture, including 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Like the Kirin 9000 5G, it also offers a total of eight cores for efficient multitasking. It operates on the ARMv8.2-A instruction set, ensuring compatibility with various applications.

The MediaTek Dimensity 700 is built on a 7 nm lithography process, which although not as advanced as the Kirin 9000 5G, still provides decent power efficiency. It has a TDP of 10 Watts, indicating slightly higher power consumption compared to the Kirin 9000 5G.

In conclusion, both processors have their strengths. The HiSilicon Kirin 9000 5G excels in terms of its advanced architecture, higher clock speeds, smaller lithography, and lower TDP. The MediaTek Dimensity 700, on the other hand, has a less advanced architecture and slightly higher power consumption but still offers good performance for everyday tasks.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 7 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount up to 16 GB up to 12 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 3.1 UFS 2.2

Graphics

GPU name Mali-G78 MP24 Mali-G57 MP2
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 950 MHz
Execution units 24 2
Shaders 384 32
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@90Hz
Max camera resolution 1x 64MP, 2x 16MP
Max Video Capture 4K@60fps 2K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2020 October 2021 Quarter 1
Partnumber MT6833V/ZA, MT6833V/NZA
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000 5G
762886
Dimensity 700
325860

GeekBench 6 Single-Core

Score
Kirin 9000 5G
1062
Dimensity 700
531

GeekBench 6 Multi-Core

Score
Kirin 9000 5G
3724
Dimensity 700
1719