HiSilicon Kirin 9000 5G vs HiSilicon Kirin 9000E 5G
The HiSilicon Kirin 9000 5G and the HiSilicon Kirin 9000E 5G are two powerful processors that offer exceptional performance.
Both processors have the same CPU cores and architecture, with 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. They also use the same ARMv8.2-A instruction set and have a lithography of 5 nm, ensuring efficient power usage and improved performance. Additionally, they both have a TDP (Thermal Design Power) of 6 watts, which means they generate less heat and provide better power efficiency.
The HiSilicon Kirin 9000 5G and the HiSilicon Kirin 9000E 5G are both equipped with 15300 million transistors, which enable them to handle complex tasks and multitasking with ease. This makes them suitable for high-intensity applications and demanding workloads.
The main difference between the two processors lies in their neural processing capabilities. The HiSilicon Kirin 9000 5G features the Ascend Lite neural processor, which is complemented by the Ascend Tiny neural processor. This combination, based on the HUAWEI Da Vinci Architecture 2.0, delivers enhanced AI performance, allowing for advanced machine learning, image recognition, and natural language processing tasks.
On the other hand, the HiSilicon Kirin 9000E 5G comes with the Ascend Lite and Ascend Tiny neural processors, which also contribute to its AI capabilities. However, it does not specify the version of the HUAWEI Da Vinci Architecture, which may indicate a slight difference in performance compared to the HiSilicon Kirin 9000 5G.
In conclusion, both the HiSilicon Kirin 9000 5G and the HiSilicon Kirin 9000E 5G offer impressive specifications and performance. The HiSilicon Kirin 9000 5G stands out with its specific mentions of the Ascend Lite (2x) and Ascend Tiny (1x) neural processors, indicating potentially improved AI performance. However, without further details, it is challenging to determine the exact differences between the two processors.
Both processors have the same CPU cores and architecture, with 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. They also use the same ARMv8.2-A instruction set and have a lithography of 5 nm, ensuring efficient power usage and improved performance. Additionally, they both have a TDP (Thermal Design Power) of 6 watts, which means they generate less heat and provide better power efficiency.
The HiSilicon Kirin 9000 5G and the HiSilicon Kirin 9000E 5G are both equipped with 15300 million transistors, which enable them to handle complex tasks and multitasking with ease. This makes them suitable for high-intensity applications and demanding workloads.
The main difference between the two processors lies in their neural processing capabilities. The HiSilicon Kirin 9000 5G features the Ascend Lite neural processor, which is complemented by the Ascend Tiny neural processor. This combination, based on the HUAWEI Da Vinci Architecture 2.0, delivers enhanced AI performance, allowing for advanced machine learning, image recognition, and natural language processing tasks.
On the other hand, the HiSilicon Kirin 9000E 5G comes with the Ascend Lite and Ascend Tiny neural processors, which also contribute to its AI capabilities. However, it does not specify the version of the HUAWEI Da Vinci Architecture, which may indicate a slight difference in performance compared to the HiSilicon Kirin 9000 5G.
In conclusion, both the HiSilicon Kirin 9000 5G and the HiSilicon Kirin 9000E 5G offer impressive specifications and performance. The HiSilicon Kirin 9000 5G stands out with its specific mentions of the Ascend Lite (2x) and Ascend Tiny (1x) neural processors, indicating potentially improved AI performance. However, without further details, it is challenging to determine the exact differences between the two processors.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 5 nm |
Number of transistors | 15300 million | 15300 million |
TDP | 6 Watt | 6 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR5 | LPDDR5 |
Memory frequency | 2750 MHz | 2750 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 3.1 |
Graphics
GPU name | Mali-G78 MP24 | Mali-G78 MP22 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 760 MHz |
Execution units | 24 | 22 |
Shaders | 384 | 352 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 3840x2160 |
Max Video Capture | 4K@60fps | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 4.6 Gbps |
Peak Upload Speed | 2.5 Gbps | 2.5 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2020 October | 2020 October |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 6080 vs HiSilicon Kirin 970
2
Samsung Exynos 7880 vs Samsung Exynos 9810
3
Unisoc Tiger T310 vs MediaTek Helio P35
4
Samsung Exynos 9820 vs MediaTek Helio G85
5
MediaTek Dimensity 8100 vs MediaTek Dimensity 8000
6
HiSilicon Kirin 960 vs Qualcomm Snapdragon 768G
7
MediaTek Dimensity 9200 Plus vs MediaTek Helio G36
8
HiSilicon Kirin 820 5G vs Qualcomm Snapdragon 865 Plus
9
Qualcomm Snapdragon 480 vs Unisoc Tanggula T770 5G
10
MediaTek Helio G70 vs MediaTek Dimensity 1200