HiSilicon Kirin 820 5G vs Unisoc Tiger T710
The HiSilicon Kirin 820 5G and the Unisoc Tiger T710 are two processors that cater to different segments of the market. Let's compare their specifications to understand their strengths and weaknesses.
Starting with the HiSilicon Kirin 820 5G, it boasts an impressive CPU architecture. It consists of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This combination allows for efficient multitasking and enhanced performance. The Kirin 820 5G is equipped with ARMv8.2-A instruction set and manufactured on a 7 nm lithography process. This leads to improved power efficiency and better heat dissipation. With a TDP of 6 watts, it strikes a balance between performance and energy consumption. Additionally, it features the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, enabling advanced AI capabilities.
On the other hand, we have the Unisoc Tiger T710. Its CPU architecture consists of 4x 1.8 GHz Cortex-A75 and 4x 1.8 GHz Cortex-A55 cores. While it may have a similar number of cores as the Kirin 820 5G, its cortex-A75 cores might not offer the same level of performance. The Tiger T710 also supports ARMv8.2-A instruction set and is manufactured on a 12 nm lithography process. Although it may not be as power-efficient as the Kirin 820 5G, it can still deliver satisfactory performance. The Tiger T710 features a dual NPU for neural processing, enhancing its AI capabilities but potentially falling short compared to the Kirin 820 5G.
In summary, the HiSilicon Kirin 820 5G outshines the Unisoc Tiger T710 in terms of CPU architecture, lithography process, and neural processing capabilities. It offers higher clock speeds, better power efficiency, and advanced AI integration. However, the Tiger T710 may offer a more affordable option without compromising on basic performance. Ultimately, the choice between these processors depends on the specific requirements and budget of the user.
Starting with the HiSilicon Kirin 820 5G, it boasts an impressive CPU architecture. It consists of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. This combination allows for efficient multitasking and enhanced performance. The Kirin 820 5G is equipped with ARMv8.2-A instruction set and manufactured on a 7 nm lithography process. This leads to improved power efficiency and better heat dissipation. With a TDP of 6 watts, it strikes a balance between performance and energy consumption. Additionally, it features the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, enabling advanced AI capabilities.
On the other hand, we have the Unisoc Tiger T710. Its CPU architecture consists of 4x 1.8 GHz Cortex-A75 and 4x 1.8 GHz Cortex-A55 cores. While it may have a similar number of cores as the Kirin 820 5G, its cortex-A75 cores might not offer the same level of performance. The Tiger T710 also supports ARMv8.2-A instruction set and is manufactured on a 12 nm lithography process. Although it may not be as power-efficient as the Kirin 820 5G, it can still deliver satisfactory performance. The Tiger T710 features a dual NPU for neural processing, enhancing its AI capabilities but potentially falling short compared to the Kirin 820 5G.
In summary, the HiSilicon Kirin 820 5G outshines the Unisoc Tiger T710 in terms of CPU architecture, lithography process, and neural processing capabilities. It offers higher clock speeds, better power efficiency, and advanced AI integration. However, the Tiger T710 may offer a more affordable option without compromising on basic performance. Ultimately, the choice between these processors depends on the specific requirements and budget of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
TDP | 6 Watt | |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | Dual NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G57 MP6 | Imagination PowerVR GM9446 |
GPU Architecture | Mali Valhall | PowerVR Rogue |
GPU frequency | 850 MHz | 800 MHz |
Execution units | 6 | |
Shaders | 96 | |
DirectX | 12 | |
OpenCL API | 2.1 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.1 |
Camera, Video, Display
Max camera resolution | 1x 48MP, 2x 20MP | 1x 24MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2019 |
Partnumber | T710 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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