HiSilicon Kirin 820 5G vs Unisoc Tiger T700

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The HiSilicon Kirin 820 5G and the Unisoc Tiger T700 are two processors that differ in terms of their specifications.

Starting with the HiSilicon Kirin 820 5G, it boasts a powerful CPU architecture with a combination of different cores. It features 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. This combination provides a good balance between performance and power efficiency. The processor also utilizes the ARMv8.2-A instruction set and has a lithography of 7 nm. With a TDP of 6 Watts, it is designed to consume less power and generate less heat. Additionally, the Kirin 820 5G includes Neural Processing capabilities with the Ascend D110 Lite and Huawei Da Vinci Architecture, enabling advanced AI processing tasks.

On the other hand, the Unisoc Tiger T700 features a different CPU architecture. It consists of 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. While it offers a similar number of cores as the Kirin 820 5G, the Tiger T700's architecture is less powerful and efficient compared to the Kirin's Cortex-A76 cores. The processor operates on the ARMv8.2-A instruction set and has a lithography of 12 nm. With a TDP of 10 Watts, it consumes more power and may generate more heat than the Kirin 820 5G.

Overall, while both processors have eight cores and utilize the ARMv8.2-A instruction set, the HiSilicon Kirin 820 5G stands out with its more powerful and efficient CPU cores, smaller lithography size, lower TDP, and additional Neural Processing capabilities. These specifications make the Kirin 820 5G a suitable choice for users who require a high-performance and power-efficient processor for various applications and tasks, including AI processing.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
2x 1.8 GHz – Cortex-A75
6x 1.8 GHz – Cortex-A5
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 12 nm
TDP 6 Watt 10 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 12 GB up to 4 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 1866 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G57 MP6 Mali-G52 MP2
GPU Architecture Valhall Bifrost
GPU frequency 850 MHz 850 MHz
Execution units 6 2
Shaders 96 32
DirectX 12 11
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2400x1080
Max camera resolution 1x 48MP, 2x 20MP 1x 48MP
Max Video Capture 4K@30fps FullHD@60fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 0.3 Gbps
Peak Upload Speed 0.2 Gbps 0.1 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2020 March 2021 March
Partnumber T700
Vertical Segment Mobiles Mobiles
Positioning Mid-end Low-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Tiger T700
217829

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Tiger T700
356

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Tiger T700
1298