HiSilicon Kirin 820 5G vs Unisoc Tiger T612
The HiSilicon Kirin 820 5G and the Unisoc Tiger T612 are two processors that offer different specifications and capabilities.
Starting with the HiSilicon Kirin 820 5G, this processor features a more advanced architecture with a combination of Cortex-A76 and Cortex-A55 cores. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores, providing a range of performance levels for different tasks. With a 7 nm lithography, it offers improved efficiency and power consumption. The Kirin 820 5G has a TDP of 6 Watts, meaning it operates at a relatively low power level. Additionally, it integrates the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, enabling enhanced AI capabilities.
On the other hand, the Unisoc Tiger T612 employs a different architecture, utilizing Cortex-A75 and Cortex-A55 cores. It has 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. While it offers a similar number of cores as the Kirin 820, the Tiger T612 has a 12 nm lithography, which is slightly less advanced. This processor has a higher TDP of 10 Watts, suggesting that it may consume more power.
Both processors support the ARMv8.2-A instruction set, ensuring compatibility with various software and applications. However, the Kirin 820 5G has an advantage with its 7 nm lithography, providing better energy efficiency. The Unisoc Tiger T612, on the other hand, has a higher power consumption with its 12 nm lithography.
In conclusion, the HiSilicon Kirin 820 5G and the Unisoc Tiger T612 offer different specifications and performance capabilities. The Kirin 820 stands out with its advanced architecture, lower power consumption, and AI processing capabilities. On the other hand, the Tiger T612 may provide a decent performance but lacks the efficiency and AI processing advancements of the Kirin 820. Ultimately, the choice between the two processors would depend on specific usage requirements and priorities.
Starting with the HiSilicon Kirin 820 5G, this processor features a more advanced architecture with a combination of Cortex-A76 and Cortex-A55 cores. It includes 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores, providing a range of performance levels for different tasks. With a 7 nm lithography, it offers improved efficiency and power consumption. The Kirin 820 5G has a TDP of 6 Watts, meaning it operates at a relatively low power level. Additionally, it integrates the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, enabling enhanced AI capabilities.
On the other hand, the Unisoc Tiger T612 employs a different architecture, utilizing Cortex-A75 and Cortex-A55 cores. It has 2x 1.8 GHz Cortex-A75 and 6x 1.8 GHz Cortex-A55 cores. While it offers a similar number of cores as the Kirin 820, the Tiger T612 has a 12 nm lithography, which is slightly less advanced. This processor has a higher TDP of 10 Watts, suggesting that it may consume more power.
Both processors support the ARMv8.2-A instruction set, ensuring compatibility with various software and applications. However, the Kirin 820 5G has an advantage with its 7 nm lithography, providing better energy efficiency. The Unisoc Tiger T612, on the other hand, has a higher power consumption with its 12 nm lithography.
In conclusion, the HiSilicon Kirin 820 5G and the Unisoc Tiger T612 offer different specifications and performance capabilities. The Kirin 820 stands out with its advanced architecture, lower power consumption, and AI processing capabilities. On the other hand, the Tiger T612 may provide a decent performance but lacks the efficiency and AI processing advancements of the Kirin 820. Ultimately, the choice between the two processors would depend on specific usage requirements and priorities.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP1 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 650 MHz |
Execution units | 6 | 1 |
Shaders | 96 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 50MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2022 January |
Partnumber | T612 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 900 vs Qualcomm Snapdragon 778G Plus
2
Unisoc Tanggula T740 5G vs Qualcomm Snapdragon 835
3
MediaTek Dimensity 9000 Plus vs MediaTek Helio G96
4
Unisoc SC9863A vs Unisoc Tiger T612
5
Qualcomm Snapdragon 821 vs MediaTek Dimensity 8000
6
Qualcomm Snapdragon 690 vs MediaTek Dimensity 9000
7
Qualcomm Snapdragon 710 vs Qualcomm Snapdragon 4 Gen 1
8
MediaTek Helio G35 vs Qualcomm Snapdragon 660
9
Unisoc Tiger T616 vs Apple A13 Bionic
10
Google Tensor G2 vs Qualcomm Snapdragon 778G