HiSilicon Kirin 820 5G vs Unisoc Tanggula T770 5G

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The HiSilicon Kirin 820 5G and Unisoc Tanggula T770 5G are both processors designed for mobile devices. Let's compare their specifications to see how they differ.

In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G features a 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T770 5G incorporates a 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. This means that the Tanggula T770 5G has slightly higher clock speeds across all its cores compared to the Kirin 820 5G, which may result in better performance.

Both processors use the ARMv8.2-A instruction set, which ensures compatibility with a wide range of software. However, there is a slight difference in the lithography process used to manufacture these processors. The HiSilicon Kirin 820 5G adopts a 7 nm process, while the Unisoc Tanggula T770 5G utilizes a slightly more advanced 6 nm process. A smaller lithography process generally translates to improved power efficiency and potentially better performance.

When it comes to thermal design power (TDP), the Unisoc Tanggula T770 5G has a lower TDP of 5 Watts compared to the 6 Watts of the HiSilicon Kirin 820 5G. This suggests that the Tanggula T770 5G may generate less heat and consume less power, potentially leading to longer battery life and improved thermals.

In terms of neural processing capabilities, the HiSilicon Kirin 820 5G features the Ascend D110 Lite with HUAWEI Da Vinci Architecture, which is designed for artificial intelligence (AI) tasks. On the other hand, the Unisoc Tanggula T770 5G incorporates an NPU for optimized AI processing.

In summary, the Unisoc Tanggula T770 5G offers higher clock speeds, a more advanced lithography process, lower TDP, and an NPU for AI processing. However, the HiSilicon Kirin 820 5G's Ascend D110 Lite with HUAWEI Da Vinci Architecture may provide additional AI capabilities. Ultimately, the choice between these processors will depend on specific requirements and priorities.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
1x 2.5 GHz – Cortex-A76
3x 2.2 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
TDP 6 Watt 5 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 12 GB up to 32 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G57 MP6 Mali-G57 MP6
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 850 MHz
Execution units 6 6
Shaders 96 96
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2160x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 108MP, 2x 24MP
Max Video Capture 4K@30fps FullHD@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 2.7 Gbps
Peak Upload Speed 0.2 Gbps 1.5 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2020 March 2021 February
Partnumber T770, Tiger T7520
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Tanggula T770 5G
342190

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Tanggula T770 5G
659

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Tanggula T770 5G
2635