HiSilicon Kirin 820 5G vs Unisoc Tanggula T770 5G
The HiSilicon Kirin 820 5G and Unisoc Tanggula T770 5G are both processors designed for mobile devices. Let's compare their specifications to see how they differ.
In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G features a 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T770 5G incorporates a 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. This means that the Tanggula T770 5G has slightly higher clock speeds across all its cores compared to the Kirin 820 5G, which may result in better performance.
Both processors use the ARMv8.2-A instruction set, which ensures compatibility with a wide range of software. However, there is a slight difference in the lithography process used to manufacture these processors. The HiSilicon Kirin 820 5G adopts a 7 nm process, while the Unisoc Tanggula T770 5G utilizes a slightly more advanced 6 nm process. A smaller lithography process generally translates to improved power efficiency and potentially better performance.
When it comes to thermal design power (TDP), the Unisoc Tanggula T770 5G has a lower TDP of 5 Watts compared to the 6 Watts of the HiSilicon Kirin 820 5G. This suggests that the Tanggula T770 5G may generate less heat and consume less power, potentially leading to longer battery life and improved thermals.
In terms of neural processing capabilities, the HiSilicon Kirin 820 5G features the Ascend D110 Lite with HUAWEI Da Vinci Architecture, which is designed for artificial intelligence (AI) tasks. On the other hand, the Unisoc Tanggula T770 5G incorporates an NPU for optimized AI processing.
In summary, the Unisoc Tanggula T770 5G offers higher clock speeds, a more advanced lithography process, lower TDP, and an NPU for AI processing. However, the HiSilicon Kirin 820 5G's Ascend D110 Lite with HUAWEI Da Vinci Architecture may provide additional AI capabilities. Ultimately, the choice between these processors will depend on specific requirements and priorities.
In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G features a 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T770 5G incorporates a 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. This means that the Tanggula T770 5G has slightly higher clock speeds across all its cores compared to the Kirin 820 5G, which may result in better performance.
Both processors use the ARMv8.2-A instruction set, which ensures compatibility with a wide range of software. However, there is a slight difference in the lithography process used to manufacture these processors. The HiSilicon Kirin 820 5G adopts a 7 nm process, while the Unisoc Tanggula T770 5G utilizes a slightly more advanced 6 nm process. A smaller lithography process generally translates to improved power efficiency and potentially better performance.
When it comes to thermal design power (TDP), the Unisoc Tanggula T770 5G has a lower TDP of 5 Watts compared to the 6 Watts of the HiSilicon Kirin 820 5G. This suggests that the Tanggula T770 5G may generate less heat and consume less power, potentially leading to longer battery life and improved thermals.
In terms of neural processing capabilities, the HiSilicon Kirin 820 5G features the Ascend D110 Lite with HUAWEI Da Vinci Architecture, which is designed for artificial intelligence (AI) tasks. On the other hand, the Unisoc Tanggula T770 5G incorporates an NPU for optimized AI processing.
In summary, the Unisoc Tanggula T770 5G offers higher clock speeds, a more advanced lithography process, lower TDP, and an NPU for AI processing. However, the HiSilicon Kirin 820 5G's Ascend D110 Lite with HUAWEI Da Vinci Architecture may provide additional AI capabilities. Ultimately, the choice between these processors will depend on specific requirements and priorities.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 6 Watt | 5 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 32 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP6 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 850 MHz |
Execution units | 6 | 6 |
Shaders | 96 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 2x 24MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.5 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2021 February |
Partnumber | T770, Tiger T7520 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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