HiSilicon Kirin 820 5G vs Unisoc SC9863A
The HiSilicon Kirin 820 5G and the Unisoc SC9863A are two processors with differing specifications.
Starting with the HiSilicon Kirin 820 5G, it features a powerful CPU with an architecture that consists of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor offers efficient and high-performance computing capabilities. It also operates on the ARMv8.2-A instruction set and has a lithography of 7 nm, indicating advanced manufacturing technology for improved power efficiency. With a TDP of 6 Watts, it provides a balance between performance and energy consumption. The Kirin 820 5G also includes a Neural Processing Unit (NPU) called Ascend D110 Lite, which utilizes Huawei's Da Vinci Architecture to enhance AI processing.
On the other hand, the Unisoc SC9863A features an architecture with 4x 1.6 GHz Cortex-A55 cores and 4x 1.2 GHz Cortex-A55 cores. Similar to the Kirin 820 5G, it also has 8 cores, operating on the ARMv8.2-A instruction set. However, it is manufactured using a 28 nm lithography process, which is less advanced compared to the Kirin 820 5G's 7 nm lithography. This suggests that the Unisoc SC9863A may not perform as efficiently in terms of power consumption. With a TDP of 3 Watts, it offers lower power requirements but also potentially lower performance. The SC9863A includes a Neural Processing Unit (NPU) for AI processing as well.
In conclusion, the HiSilicon Kirin 820 5G and the Unisoc SC9863A have several differences in their specifications. The Kirin 820 5G boasts a more powerful and efficient CPU architecture, a more advanced 7 nm lithography, and a higher TDP. It also includes the Ascend D110 Lite NPU with Huawei's Da Vinci Architecture for enhanced AI processing. On the other hand, the Unisoc SC9863A has a less advanced 28 nm lithography, a lower TDP, and a simpler NPU. These differences suggest that the Kirin 820 5G may offer superior performance and power efficiency compared to the SC9863A.
Starting with the HiSilicon Kirin 820 5G, it features a powerful CPU with an architecture that consists of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. With a total of 8 cores, this processor offers efficient and high-performance computing capabilities. It also operates on the ARMv8.2-A instruction set and has a lithography of 7 nm, indicating advanced manufacturing technology for improved power efficiency. With a TDP of 6 Watts, it provides a balance between performance and energy consumption. The Kirin 820 5G also includes a Neural Processing Unit (NPU) called Ascend D110 Lite, which utilizes Huawei's Da Vinci Architecture to enhance AI processing.
On the other hand, the Unisoc SC9863A features an architecture with 4x 1.6 GHz Cortex-A55 cores and 4x 1.2 GHz Cortex-A55 cores. Similar to the Kirin 820 5G, it also has 8 cores, operating on the ARMv8.2-A instruction set. However, it is manufactured using a 28 nm lithography process, which is less advanced compared to the Kirin 820 5G's 7 nm lithography. This suggests that the Unisoc SC9863A may not perform as efficiently in terms of power consumption. With a TDP of 3 Watts, it offers lower power requirements but also potentially lower performance. The SC9863A includes a Neural Processing Unit (NPU) for AI processing as well.
In conclusion, the HiSilicon Kirin 820 5G and the Unisoc SC9863A have several differences in their specifications. The Kirin 820 5G boasts a more powerful and efficient CPU architecture, a more advanced 7 nm lithography, and a higher TDP. It also includes the Ascend D110 Lite NPU with Huawei's Da Vinci Architecture for enhanced AI processing. On the other hand, the Unisoc SC9863A has a less advanced 28 nm lithography, a lower TDP, and a simpler NPU. These differences suggest that the Kirin 820 5G may offer superior performance and power efficiency compared to the SC9863A.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 1.6 GHz – Cortex-A55 4x 1.2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 28 nm |
TDP | 6 Watt | 3 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 4 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G57 MP6 | Imagination PowerVR GE8322 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 850 MHz | 550 MHz |
Execution units | 6 | 4 |
Shaders | 96 | 128 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 3.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 16MP + 1x 5MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 4 (802.11n) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2020 March | 2018 November |
Partnumber | SC9863A | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Samsung Exynos 2200 vs MediaTek Dimensity 810
2
Qualcomm Snapdragon 480 Plus vs MediaTek Helio G35
3
Qualcomm Snapdragon 710 vs MediaTek Helio G25
4
MediaTek Dimensity 720 vs Google Tensor G3
5
HiSilicon Kirin 955 vs Unisoc Tiger T710
6
MediaTek Dimensity 800U vs MediaTek Dimensity 1050
7
MediaTek Dimensity 9200 vs Apple A15 Bionic
8
Samsung Exynos 9825 vs Samsung Exynos 1330
9
Qualcomm Snapdragon 845 vs MediaTek Helio G70
10
Qualcomm Snapdragon 855 vs MediaTek Helio P60