HiSilicon Kirin 820 5G vs MediaTek Dimensity 920
The HiSilicon Kirin 820 5G and the MediaTek Dimensity 920 are two powerful processors that offer impressive specifications. Let's compare their key features.
In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a combination of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 920 offers 2x 2.5 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55 cores. Both processors feature 8 cores and support the ARMv8.2-A instruction set.
Moving on to lithography, the HiSilicon Kirin 820 5G stands out with its 7 nm technology, which allows for more power efficiency and better performance. The MediaTek Dimensity 920, on the other hand, utilizes a 6 nm lithography, offering slightly improved performance compared to its counterpart.
When it comes to thermal design power (TDP), the HiSilicon Kirin 820 5G has a rating of 6 Watts, indicating its energy efficiency and cool operation. In contrast, the MediaTek Dimensity 920 has a TDP of 10 Watts, which means it may consume more power and generate more heat.
Lastly, the neural processing capabilities of these processors differ. The HiSilicon Kirin 820 5G incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture, which enhance AI capabilities for better performance in tasks such as image recognition and voice assistants. On the other hand, the MediaTek Dimensity 920 features an NPU (Neural Processing Unit) for efficient AI processing.
In conclusion, both the HiSilicon Kirin 820 5G and the MediaTek Dimensity 920 offer impressive specifications. The Kirin 820 5G excels with its efficient 7 nm lithography, lower TDP, and advanced neural processing architecture. On the other hand, the Dimensity 920 offers powerful CPU cores, a slightly improved 6 nm lithography, and its own NPU for AI processing. Ultimately, the choice between these processors will depend on specific requirements and priorities of the user.
In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a combination of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 920 offers 2x 2.5 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55 cores. Both processors feature 8 cores and support the ARMv8.2-A instruction set.
Moving on to lithography, the HiSilicon Kirin 820 5G stands out with its 7 nm technology, which allows for more power efficiency and better performance. The MediaTek Dimensity 920, on the other hand, utilizes a 6 nm lithography, offering slightly improved performance compared to its counterpart.
When it comes to thermal design power (TDP), the HiSilicon Kirin 820 5G has a rating of 6 Watts, indicating its energy efficiency and cool operation. In contrast, the MediaTek Dimensity 920 has a TDP of 10 Watts, which means it may consume more power and generate more heat.
Lastly, the neural processing capabilities of these processors differ. The HiSilicon Kirin 820 5G incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture, which enhance AI capabilities for better performance in tasks such as image recognition and voice assistants. On the other hand, the MediaTek Dimensity 920 features an NPU (Neural Processing Unit) for efficient AI processing.
In conclusion, both the HiSilicon Kirin 820 5G and the MediaTek Dimensity 920 offer impressive specifications. The Kirin 820 5G excels with its efficient 7 nm lithography, lower TDP, and advanced neural processing architecture. On the other hand, the Dimensity 920 offers powerful CPU cores, a slightly improved 6 nm lithography, and its own NPU for AI processing. Ultimately, the choice between these processors will depend on specific requirements and priorities of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G68 MP4 |
GPU Architecture | Mali Valhall | Mali Valhall |
GPU frequency | 850 MHz | 950 MHz |
Execution units | 6 | 4 |
Shaders | 96 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 March | 2021 Quarter 3 |
Partnumber | MT6877T | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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