HiSilicon Kirin 820 5G vs MediaTek Dimensity 920

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The HiSilicon Kirin 820 5G and the MediaTek Dimensity 920 are two powerful processors that offer impressive specifications. Let's compare their key features.

In terms of CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a combination of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 920 offers 2x 2.5 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55 cores. Both processors feature 8 cores and support the ARMv8.2-A instruction set.

Moving on to lithography, the HiSilicon Kirin 820 5G stands out with its 7 nm technology, which allows for more power efficiency and better performance. The MediaTek Dimensity 920, on the other hand, utilizes a 6 nm lithography, offering slightly improved performance compared to its counterpart.

When it comes to thermal design power (TDP), the HiSilicon Kirin 820 5G has a rating of 6 Watts, indicating its energy efficiency and cool operation. In contrast, the MediaTek Dimensity 920 has a TDP of 10 Watts, which means it may consume more power and generate more heat.

Lastly, the neural processing capabilities of these processors differ. The HiSilicon Kirin 820 5G incorporates the Ascend D110 Lite and HUAWEI Da Vinci Architecture, which enhance AI capabilities for better performance in tasks such as image recognition and voice assistants. On the other hand, the MediaTek Dimensity 920 features an NPU (Neural Processing Unit) for efficient AI processing.

In conclusion, both the HiSilicon Kirin 820 5G and the MediaTek Dimensity 920 offer impressive specifications. The Kirin 820 5G excels with its efficient 7 nm lithography, lower TDP, and advanced neural processing architecture. On the other hand, the Dimensity 920 offers powerful CPU cores, a slightly improved 6 nm lithography, and its own NPU for AI processing. Ultimately, the choice between these processors will depend on specific requirements and priorities of the user.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
2x 2.5 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
TDP 6 Watt 10 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 12 GB up to 16 GB
Memory type LPDDR4X LPDDR5
Memory frequency 2133 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G57 MP6 Mali-G68 MP4
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 950 MHz
Execution units 6 4
Shaders 96 96
DirectX 12 12
OpenCL API 2.1 2.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 108MP, 2x 20MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 2.77 Gbps
Peak Upload Speed 0.2 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 6 (802.11ax)
Bluetooth 5.1 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2020 March 2021 Quarter 3
Partnumber MT6877T
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Dimensity 920
453634

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Dimensity 920
780

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Dimensity 920
2594