HiSilicon Kirin 820 5G vs MediaTek Dimensity 900

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The HiSilicon Kirin 820 5G and MediaTek Dimensity 900 are two processors with impressive specifications. Let's compare the two processors based on their key features.

First, in terms of CPU cores and architecture, the HiSilicon Kirin 820 5G comes with a 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores, offering a balanced combination of performance and power efficiency. On the other hand, the MediaTek Dimensity 900 features 2x 2.4 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55 cores, providing a slightly faster performance while maintaining overall efficiency.

Both processors have 8 cores and are based on the ARMv8.2-A instruction set, ensuring compatibility with a wide range of applications and software.

In terms of manufacturing technology, the HiSilicon Kirin 820 5G is built using a 7 nm lithography, delivering efficient power consumption and better heat dissipation. Conversely, the MediaTek Dimensity 900 adopts a more advanced 6 nm lithography, promising enhanced performance and energy efficiency.

The HiSilicon Kirin 820 5G is equipped with the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, delivering improved AI capabilities for various tasks. On the other hand, the MediaTek Dimensity 900 features an NPU, providing efficient and powerful AI processing.

In terms of power consumption, the HiSilicon Kirin 820 5G has a TDP of 6 Watts, indicating energy-efficient operation. The MediaTek Dimensity 900 has a slightly higher TDP of 10 Watts, potentially translating to slightly higher power consumption.

Additionally, the MediaTek Dimensity 900 boasts an impressive 10,000 million transistors, indicating a higher transistor count compared to the HiSilicon Kirin 820 5G. This higher transistor count can potentially result in improved overall performance and processing capabilities.

In conclusion, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 900 processors offer impressive specifications. While the MediaTek Dimensity 900 provides a slight advantage in terms of CPU clock speeds and lithography, the HiSilicon Kirin 820 5G showcases a highly efficient and balanced combination of CPU cores. Ultimately, the choice between the two processors may depend on specific use cases and requirements.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
Number of transistors 10000 million
TDP 6 Watt 10 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 12 GB up to 16 GB
Memory type LPDDR4X LPDDR5
Memory frequency 2133 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G57 MP6 Mali-G68 MP4
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 900 MHz
Execution units 6 4
Shaders 96 64
DirectX 12 12
OpenCL API 2.1 2.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 108MP, 2x 20MP
Max Video Capture 4K@30fps 4K@30fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 2.77 Gbps
Peak Upload Speed 0.2 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 6 (802.11ax)
Bluetooth 5.1 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2020 March 2021 Quarter 1
Partnumber MT6877
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Dimensity 900
435318

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Dimensity 900
704

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Dimensity 900
2139