HiSilicon Kirin 820 5G vs MediaTek Dimensity 900
The HiSilicon Kirin 820 5G and MediaTek Dimensity 900 are two processors with impressive specifications. Let's compare the two processors based on their key features.
First, in terms of CPU cores and architecture, the HiSilicon Kirin 820 5G comes with a 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores, offering a balanced combination of performance and power efficiency. On the other hand, the MediaTek Dimensity 900 features 2x 2.4 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55 cores, providing a slightly faster performance while maintaining overall efficiency.
Both processors have 8 cores and are based on the ARMv8.2-A instruction set, ensuring compatibility with a wide range of applications and software.
In terms of manufacturing technology, the HiSilicon Kirin 820 5G is built using a 7 nm lithography, delivering efficient power consumption and better heat dissipation. Conversely, the MediaTek Dimensity 900 adopts a more advanced 6 nm lithography, promising enhanced performance and energy efficiency.
The HiSilicon Kirin 820 5G is equipped with the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, delivering improved AI capabilities for various tasks. On the other hand, the MediaTek Dimensity 900 features an NPU, providing efficient and powerful AI processing.
In terms of power consumption, the HiSilicon Kirin 820 5G has a TDP of 6 Watts, indicating energy-efficient operation. The MediaTek Dimensity 900 has a slightly higher TDP of 10 Watts, potentially translating to slightly higher power consumption.
Additionally, the MediaTek Dimensity 900 boasts an impressive 10,000 million transistors, indicating a higher transistor count compared to the HiSilicon Kirin 820 5G. This higher transistor count can potentially result in improved overall performance and processing capabilities.
In conclusion, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 900 processors offer impressive specifications. While the MediaTek Dimensity 900 provides a slight advantage in terms of CPU clock speeds and lithography, the HiSilicon Kirin 820 5G showcases a highly efficient and balanced combination of CPU cores. Ultimately, the choice between the two processors may depend on specific use cases and requirements.
First, in terms of CPU cores and architecture, the HiSilicon Kirin 820 5G comes with a 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores, offering a balanced combination of performance and power efficiency. On the other hand, the MediaTek Dimensity 900 features 2x 2.4 GHz Cortex-A78 and 6x 2.0 GHz Cortex-A55 cores, providing a slightly faster performance while maintaining overall efficiency.
Both processors have 8 cores and are based on the ARMv8.2-A instruction set, ensuring compatibility with a wide range of applications and software.
In terms of manufacturing technology, the HiSilicon Kirin 820 5G is built using a 7 nm lithography, delivering efficient power consumption and better heat dissipation. Conversely, the MediaTek Dimensity 900 adopts a more advanced 6 nm lithography, promising enhanced performance and energy efficiency.
The HiSilicon Kirin 820 5G is equipped with the Ascend D110 Lite and HUAWEI Da Vinci Architecture for neural processing, delivering improved AI capabilities for various tasks. On the other hand, the MediaTek Dimensity 900 features an NPU, providing efficient and powerful AI processing.
In terms of power consumption, the HiSilicon Kirin 820 5G has a TDP of 6 Watts, indicating energy-efficient operation. The MediaTek Dimensity 900 has a slightly higher TDP of 10 Watts, potentially translating to slightly higher power consumption.
Additionally, the MediaTek Dimensity 900 boasts an impressive 10,000 million transistors, indicating a higher transistor count compared to the HiSilicon Kirin 820 5G. This higher transistor count can potentially result in improved overall performance and processing capabilities.
In conclusion, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 900 processors offer impressive specifications. While the MediaTek Dimensity 900 provides a slight advantage in terms of CPU clock speeds and lithography, the HiSilicon Kirin 820 5G showcases a highly efficient and balanced combination of CPU cores. Ultimately, the choice between the two processors may depend on specific use cases and requirements.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 10000 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G68 MP4 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 900 MHz |
Execution units | 6 | 4 |
Shaders | 96 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 2x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 March | 2021 Quarter 1 |
Partnumber | MT6877 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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