HiSilicon Kirin 820 5G vs MediaTek Dimensity 800U

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The HiSilicon Kirin 820 5G and the MediaTek Dimensity 800U are both powerful processors designed for mobile devices. Let's compare their specifications to determine their differences and similarities.

Starting with the CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a configuration of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. In comparison, the MediaTek Dimensity 800U features 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. While both processors have 8 cores in total, the distribution and clock speeds differ slightly.

Moving on to the instruction set, both processors support ARMv8.2-A. This means they are compatible with the latest 64-bit applications and software.

In terms of lithography, both the HiSilicon Kirin 820 5G and the MediaTek Dimensity 800U are manufactured using a 7 nm process. This ensures enhanced power efficiency and improved performance.

Another aspect to consider is the neural processing capability. The HiSilicon Kirin 820 5G incorporates Ascend D110 Lite and utilizes the HUAWEI Da Vinci architecture for neural processing tasks. On the other hand, the MediaTek Dimensity 800U features an NPU for neural processing. Both processors are equipped to handle artificial intelligence and machine learning tasks efficiently.

It is important to note that the HiSilicon Kirin 820 5G has a TDP (thermal design power) of 6 Watts, whereas this information is not explicitly provided for the MediaTek Dimensity 800U.

Overall, both processors offer powerful performance with their octa-core configurations and 7 nm lithography. The HiSilicon Kirin 820 5G brings the advantage of a more varied distribution of cores, while the MediaTek Dimensity 800U offers slightly higher clock speeds for its Cortex-A76 cores. Additionally, the HiSilicon Kirin 820 5G incorporates aiW, GPU Turbo, and CPU Turbo technologies for enhanced AI and gaming experiences.

In conclusion, while both processors have their own strengths and capabilities, the choice ultimately depends on the specific requirements and preferences of the user.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 7 nm
TDP 6 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 12 GB up to 12 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G57 MP6 Mali-G57 MP3
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 850 MHz
Execution units 6 3
Shaders 96 48
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30FPS
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 2.77 Gbps
Peak Upload Speed 0.2 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2020 March 2020 Quarter 3
Partnumber MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Dimensity 800U
401197

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Dimensity 800U
614

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Dimensity 800U
1821