HiSilicon Kirin 820 5G vs MediaTek Dimensity 800U
The HiSilicon Kirin 820 5G and the MediaTek Dimensity 800U are both powerful processors designed for mobile devices. Let's compare their specifications to determine their differences and similarities.
Starting with the CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a configuration of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. In comparison, the MediaTek Dimensity 800U features 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. While both processors have 8 cores in total, the distribution and clock speeds differ slightly.
Moving on to the instruction set, both processors support ARMv8.2-A. This means they are compatible with the latest 64-bit applications and software.
In terms of lithography, both the HiSilicon Kirin 820 5G and the MediaTek Dimensity 800U are manufactured using a 7 nm process. This ensures enhanced power efficiency and improved performance.
Another aspect to consider is the neural processing capability. The HiSilicon Kirin 820 5G incorporates Ascend D110 Lite and utilizes the HUAWEI Da Vinci architecture for neural processing tasks. On the other hand, the MediaTek Dimensity 800U features an NPU for neural processing. Both processors are equipped to handle artificial intelligence and machine learning tasks efficiently.
It is important to note that the HiSilicon Kirin 820 5G has a TDP (thermal design power) of 6 Watts, whereas this information is not explicitly provided for the MediaTek Dimensity 800U.
Overall, both processors offer powerful performance with their octa-core configurations and 7 nm lithography. The HiSilicon Kirin 820 5G brings the advantage of a more varied distribution of cores, while the MediaTek Dimensity 800U offers slightly higher clock speeds for its Cortex-A76 cores. Additionally, the HiSilicon Kirin 820 5G incorporates aiW, GPU Turbo, and CPU Turbo technologies for enhanced AI and gaming experiences.
In conclusion, while both processors have their own strengths and capabilities, the choice ultimately depends on the specific requirements and preferences of the user.
Starting with the CPU cores and architecture, the HiSilicon Kirin 820 5G boasts a configuration of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55 cores. In comparison, the MediaTek Dimensity 800U features 2x 2.4 GHz Cortex-A76 and 6x 2.0 GHz Cortex-A55 cores. While both processors have 8 cores in total, the distribution and clock speeds differ slightly.
Moving on to the instruction set, both processors support ARMv8.2-A. This means they are compatible with the latest 64-bit applications and software.
In terms of lithography, both the HiSilicon Kirin 820 5G and the MediaTek Dimensity 800U are manufactured using a 7 nm process. This ensures enhanced power efficiency and improved performance.
Another aspect to consider is the neural processing capability. The HiSilicon Kirin 820 5G incorporates Ascend D110 Lite and utilizes the HUAWEI Da Vinci architecture for neural processing tasks. On the other hand, the MediaTek Dimensity 800U features an NPU for neural processing. Both processors are equipped to handle artificial intelligence and machine learning tasks efficiently.
It is important to note that the HiSilicon Kirin 820 5G has a TDP (thermal design power) of 6 Watts, whereas this information is not explicitly provided for the MediaTek Dimensity 800U.
Overall, both processors offer powerful performance with their octa-core configurations and 7 nm lithography. The HiSilicon Kirin 820 5G brings the advantage of a more varied distribution of cores, while the MediaTek Dimensity 800U offers slightly higher clock speeds for its Cortex-A76 cores. Additionally, the HiSilicon Kirin 820 5G incorporates aiW, GPU Turbo, and CPU Turbo technologies for enhanced AI and gaming experiences.
In conclusion, while both processors have their own strengths and capabilities, the choice ultimately depends on the specific requirements and preferences of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
TDP | 6 Watt | |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP3 |
GPU Architecture | Mali Valhall | Mali Valhall |
GPU frequency | 850 MHz | 850 MHz |
Execution units | 6 | 3 |
Shaders | 96 | 48 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 March | 2020 Quarter 3 |
Partnumber | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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