HiSilicon Kirin 820 5G vs MediaTek Dimensity 800

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The HiSilicon Kirin 820 5G and the MediaTek Dimensity 800 are both powerful processors used in smartphones. While they share some similarities in terms of architecture, instruction set, and lithography, there are notable differences that set them apart.

Starting with the HiSilicon Kirin 820 5G, it boasts a more extensive array of CPU cores and architecture. It has 8 cores, consisting of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55. This diverse combination offers a balanced performance for a range of tasks. In contrast, the MediaTek Dimensity 800 features 4x 2.0 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55 cores. While the Dimensity 800 has fewer cores, it still delivers a satisfactory performance.

In terms of instruction set, both processors utilize ARMv8.2-A, which ensures compatibility and efficiency in running applications. Their lithography, or the size of their transistors, is also the same at 7 nm. This indicates that both processors are manufactured using the latest technology, resulting in improved power efficiency and better thermal control.

One key difference lies in the TDP (Thermal Design Power). The HiSilicon Kirin 820 5G has a TDP of 6 Watt, while the MediaTek Dimensity 800 has a TDP of 10 Watt. This suggests that the Kirin 820 5G is more power-efficient, which can lead to longer battery life and reduced heat generation.

Another distinction is in their neural processing capabilities. The HiSilicon Kirin 820 5G features the Ascend D110 Lite and HUAWEI Da Vinci Architecture, which provide advanced AI-related functions. On the other hand, the MediaTek Dimensity 800 employs an NPU (Neural Processing Unit) for enhanced AI performance.

In conclusion, both the HiSilicon Kirin 820 5G and the MediaTek Dimensity 800 are solid processors designed for smartphones. The Kirin 820 5G excels in terms of CPU cores, power efficiency, and AI capabilities, while the Dimensity 800 offers good performance and AI processing with its fewer cores. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the device and its user.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
4x 2.0 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 4
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 7 nm
TDP 6 Watt 10 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 12 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G57 MP6 Mali-G57 MP4
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 650 MHz
Execution units 6 4
Shaders 96 64
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30FPS
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 2.77 Gbps
Peak Upload Speed 0.2 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2020 March 2020 Quarter 2
Partnumber MT6873, MT6873V
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Dimensity 800
325654

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Dimensity 800
514

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Dimensity 800
1882