HiSilicon Kirin 820 5G vs MediaTek Dimensity 800
The HiSilicon Kirin 820 5G and the MediaTek Dimensity 800 are both powerful processors used in smartphones. While they share some similarities in terms of architecture, instruction set, and lithography, there are notable differences that set them apart.
Starting with the HiSilicon Kirin 820 5G, it boasts a more extensive array of CPU cores and architecture. It has 8 cores, consisting of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55. This diverse combination offers a balanced performance for a range of tasks. In contrast, the MediaTek Dimensity 800 features 4x 2.0 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55 cores. While the Dimensity 800 has fewer cores, it still delivers a satisfactory performance.
In terms of instruction set, both processors utilize ARMv8.2-A, which ensures compatibility and efficiency in running applications. Their lithography, or the size of their transistors, is also the same at 7 nm. This indicates that both processors are manufactured using the latest technology, resulting in improved power efficiency and better thermal control.
One key difference lies in the TDP (Thermal Design Power). The HiSilicon Kirin 820 5G has a TDP of 6 Watt, while the MediaTek Dimensity 800 has a TDP of 10 Watt. This suggests that the Kirin 820 5G is more power-efficient, which can lead to longer battery life and reduced heat generation.
Another distinction is in their neural processing capabilities. The HiSilicon Kirin 820 5G features the Ascend D110 Lite and HUAWEI Da Vinci Architecture, which provide advanced AI-related functions. On the other hand, the MediaTek Dimensity 800 employs an NPU (Neural Processing Unit) for enhanced AI performance.
In conclusion, both the HiSilicon Kirin 820 5G and the MediaTek Dimensity 800 are solid processors designed for smartphones. The Kirin 820 5G excels in terms of CPU cores, power efficiency, and AI capabilities, while the Dimensity 800 offers good performance and AI processing with its fewer cores. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the device and its user.
Starting with the HiSilicon Kirin 820 5G, it boasts a more extensive array of CPU cores and architecture. It has 8 cores, consisting of 1x 2.36 GHz Cortex-A76, 3x 2.22 GHz Cortex-A76, and 4x 1.84 GHz Cortex-A55. This diverse combination offers a balanced performance for a range of tasks. In contrast, the MediaTek Dimensity 800 features 4x 2.0 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55 cores. While the Dimensity 800 has fewer cores, it still delivers a satisfactory performance.
In terms of instruction set, both processors utilize ARMv8.2-A, which ensures compatibility and efficiency in running applications. Their lithography, or the size of their transistors, is also the same at 7 nm. This indicates that both processors are manufactured using the latest technology, resulting in improved power efficiency and better thermal control.
One key difference lies in the TDP (Thermal Design Power). The HiSilicon Kirin 820 5G has a TDP of 6 Watt, while the MediaTek Dimensity 800 has a TDP of 10 Watt. This suggests that the Kirin 820 5G is more power-efficient, which can lead to longer battery life and reduced heat generation.
Another distinction is in their neural processing capabilities. The HiSilicon Kirin 820 5G features the Ascend D110 Lite and HUAWEI Da Vinci Architecture, which provide advanced AI-related functions. On the other hand, the MediaTek Dimensity 800 employs an NPU (Neural Processing Unit) for enhanced AI performance.
In conclusion, both the HiSilicon Kirin 820 5G and the MediaTek Dimensity 800 are solid processors designed for smartphones. The Kirin 820 5G excels in terms of CPU cores, power efficiency, and AI capabilities, while the Dimensity 800 offers good performance and AI processing with its fewer cores. Ultimately, the choice between these processors will depend on the specific requirements and priorities of the device and its user.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP4 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 850 MHz | 650 MHz |
Execution units | 6 | 4 |
Shaders | 96 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 March | 2020 Quarter 2 |
Partnumber | MT6873, MT6873V | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Samsung Exynos 9609 vs Samsung Exynos 2100
2
MediaTek Helio G35 vs Samsung Exynos 980
3
Apple A14 Bionic vs MediaTek Dimensity 9000 Plus
4
Qualcomm Snapdragon 675 vs Qualcomm Snapdragon 678
5
MediaTek Dimensity 9000 vs Qualcomm Snapdragon 720G
6
Samsung Exynos 7884B vs Samsung Exynos 9825
7
Qualcomm Snapdragon 8 Gen 2 vs Qualcomm Snapdragon 855
8
Qualcomm Snapdragon 7 Gen 1 vs MediaTek Helio P90
9
Unisoc Tanggula T760 5G vs MediaTek Dimensity 7200
10
Qualcomm Snapdragon 865 vs Samsung Exynos 1330