HiSilicon Kirin 820 5G vs MediaTek Dimensity 720

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The HiSilicon Kirin 820 5G and MediaTek Dimensity 720 are both powerful processors that offer impressive specifications. Let's compare the two processors based on their specifications.

In terms of CPU cores and architecture, the Kirin 820 5G has a more diverse setup with 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Dimensity 720 has 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. The Kirin 820 5G has a higher clock speed for its high-performance cores, which might result in better overall performance.

Both processors feature 8 cores and support the ARMv8.2-A instruction set, making them compatible with the latest software and applications. They also have a 7 nm lithography, which ensures power efficiency and better performance compared to processors with a higher lithography.

In terms of TDP (Thermal Design Power), the Kirin 820 5G has a lower TDP of 6 Watt, indicating that it will consume less power and generate less heat during operation. The Dimensity 720, on the other hand, has a TDP of 10 Watt.

When it comes to Neural Processing, the Kirin 820 5G utilizes the Ascend D110 Lite and HUAWEI Da Vinci Architecture, while the Dimensity 720 features its own NPU (Neural Processing Unit). Both processors offer advanced AI capabilities, but the architecture and performance of their neural processing units might differ, resulting in varying AI performance.

In conclusion, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 720 are powerful processors with similar specifications. While the Kirin 820 5G has a more diverse CPU core setup and a lower TDP, the Dimensity 720 might offer competitive performance with its own NPU. The choice between the two processors depends on the specific needs and preferences of the user.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 7 nm
TDP 6 Watt 10 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 12 GB up to 12 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G57 MP6 Mali-G57 MP3
GPU Architecture Valhall Valhall
GPU frequency 850 MHz 850 MHz
Execution units 6 3
Shaders 96
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 2520x1080@90Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30FPS
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 2.77 Gbps
Peak Upload Speed 0.2 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2020 March 2020 Quarter 3
Partnumber MT6853V/ZA, MT6853V/NZA
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 820 5G
387656
Dimensity 720
293337

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Dimensity 720
540

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Dimensity 720
1698