HiSilicon Kirin 820 5G vs MediaTek Dimensity 720
The HiSilicon Kirin 820 5G and MediaTek Dimensity 720 are both powerful processors that offer impressive specifications. Let's compare the two processors based on their specifications.
In terms of CPU cores and architecture, the Kirin 820 5G has a more diverse setup with 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Dimensity 720 has 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. The Kirin 820 5G has a higher clock speed for its high-performance cores, which might result in better overall performance.
Both processors feature 8 cores and support the ARMv8.2-A instruction set, making them compatible with the latest software and applications. They also have a 7 nm lithography, which ensures power efficiency and better performance compared to processors with a higher lithography.
In terms of TDP (Thermal Design Power), the Kirin 820 5G has a lower TDP of 6 Watt, indicating that it will consume less power and generate less heat during operation. The Dimensity 720, on the other hand, has a TDP of 10 Watt.
When it comes to Neural Processing, the Kirin 820 5G utilizes the Ascend D110 Lite and HUAWEI Da Vinci Architecture, while the Dimensity 720 features its own NPU (Neural Processing Unit). Both processors offer advanced AI capabilities, but the architecture and performance of their neural processing units might differ, resulting in varying AI performance.
In conclusion, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 720 are powerful processors with similar specifications. While the Kirin 820 5G has a more diverse CPU core setup and a lower TDP, the Dimensity 720 might offer competitive performance with its own NPU. The choice between the two processors depends on the specific needs and preferences of the user.
In terms of CPU cores and architecture, the Kirin 820 5G has a more diverse setup with 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. On the other hand, the Dimensity 720 has 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. The Kirin 820 5G has a higher clock speed for its high-performance cores, which might result in better overall performance.
Both processors feature 8 cores and support the ARMv8.2-A instruction set, making them compatible with the latest software and applications. They also have a 7 nm lithography, which ensures power efficiency and better performance compared to processors with a higher lithography.
In terms of TDP (Thermal Design Power), the Kirin 820 5G has a lower TDP of 6 Watt, indicating that it will consume less power and generate less heat during operation. The Dimensity 720, on the other hand, has a TDP of 10 Watt.
When it comes to Neural Processing, the Kirin 820 5G utilizes the Ascend D110 Lite and HUAWEI Da Vinci Architecture, while the Dimensity 720 features its own NPU (Neural Processing Unit). Both processors offer advanced AI capabilities, but the architecture and performance of their neural processing units might differ, resulting in varying AI performance.
In conclusion, both the HiSilicon Kirin 820 5G and MediaTek Dimensity 720 are powerful processors with similar specifications. While the Kirin 820 5G has a more diverse CPU core setup and a lower TDP, the Dimensity 720 might offer competitive performance with its own NPU. The choice between the two processors depends on the specific needs and preferences of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 12 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G57 MP6 | Mali-G57 MP3 |
GPU Architecture | Mali Valhall | Mali Valhall |
GPU frequency | 850 MHz | 850 MHz |
Execution units | 6 | 3 |
Shaders | 96 | |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.2 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 March | 2020 Quarter 3 |
Partnumber | MT6853V/ZA, MT6853V/NZA | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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