HiSilicon Kirin 820 5G vs HiSilicon Kirin 950

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When comparing the HiSilicon Kirin 820 5G and the HiSilicon Kirin 950 processors based on their specifications, several key differences can be identified.

Starting with the CPU architecture, the Kirin 820 5G features a 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. In contrast, the Kirin 950 is equipped with 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. This suggests that the Kirin 820 5G has a more advanced and diverse CPU architecture compared to the Kirin 950.

Another notable difference is the lithography process. The Kirin 820 5G utilizes a more advanced 7 nm lithography process, while the Kirin 950 uses a 16 nm lithography process. Generally, a smaller lithography process allows for more transistors and better power efficiency, making the Kirin 820 5G potentially more efficient in terms of power consumption.

Speaking of power consumption, the thermal design power (TDP) of the Kirin 820 5G is listed as 6 Watts, whereas the Kirin 950 has a TDP of 5 Watts. This suggests that the Kirin 950 might be more power-efficient than the Kirin 820 5G, although the difference is relatively small.

In terms of instruction set, the Kirin 820 5G adopts ARMv8.2-A, while the Kirin 950 uses ARMv8-A. The Kirin 820 5G's ARMv8.2-A instruction set offers architectural enhancements over the Kirin 950's ARMv8-A instruction set, potentially resulting in improved performance and efficiency.

Lastly, the Kirin 820 5G features the Ascend D110 Lite neural processing and HUAWEI Da Vinci architecture for neural processing tasks, whereas the Kirin 950 does not mention any specific neural processing capabilities.

Overall, the HiSilicon Kirin 820 5G appears to be more advanced in terms of CPU architecture, lithography process, and instruction set compared to the HiSilicon Kirin 950. However, the Kirin 950 may have a slight advantage in terms of power efficiency. The inclusion of specific neural processing capabilities is also a notable difference between the two processors.

CPU cores and architecture

Architecture 1x 2.36 GHz – Cortex-A76
3x 2.22 GHz – Cortex-A76
4x 1.84 GHz – Cortex-A55
4x 2.4 GHz – Cortex-A72
4x 1.8 GHz – Cortex-A53
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8-A
Lithography 7 nm 16 nm
Number of transistors 2000 million
TDP 6 Watt 5 Watt
Neural Processing Ascend D110 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 12 GB up to 4 GB
Memory type LPDDR4X LPDDR4
Memory frequency 2133 MHz 1333 MHz
Memory-bus 4x16 bit 2x32 bit

Storage

Storage specification UFS 2.1 UFS 2.0

Graphics

GPU name Mali-G57 MP6 Mali-T880 MP4
GPU Architecture Valhall Midgard
GPU frequency 850 MHz 900 MHz
Execution units 6 4
Shaders 96 64
DirectX 12 11.2
OpenCL API 2.1 1.2
OpenGL API ES 3.2
Vulkan API 1.2 1.0

Camera, Video, Display

Max camera resolution 1x 48MP, 2x 20MP 1x 31MP, 2x 13MP
Max Video Capture 4K@30fps FullHD@60fps
Video codec support AV1
H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 1.6 Gbps 0.3 Gbps
Peak Upload Speed 0.2 Gbps 0.05 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 4.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2020 March 2015 November
Partnumber Hi3650
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 820 5G
387656
Kirin 950
135741

GeekBench 6 Single-Core

Score
Kirin 820 5G
640
Kirin 950
341

GeekBench 6 Multi-Core

Score
Kirin 820 5G
2436
Kirin 950
1294