HiSilicon Kirin 820 5G vs HiSilicon Kirin 935
The HiSilicon Kirin 820 5G and HiSilicon Kirin 935 are two processors with varying specifications.
Starting with the HiSilicon Kirin 820 5G, it boasts an impressive architecture consisting of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. This configuration allows for efficient multitasking and provides a balance between performance and power consumption. Additionally, it utilizes the ARMv8.2-A instruction set and has a lithography of 7 nm, resulting in enhanced power efficiency and overall performance. The TDP (thermal design power) of the Kirin 820 5G is 6 Watts, making it an energy-efficient option. It also features the Ascend D110 Lite neural processing and HUAWEI Da Vinci Architecture for efficient AI processing.
On the other hand, the HiSilicon Kirin 935 has a different architecture. It is equipped with 4x 2.2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. While this configuration provides decent performance, it may not be as powerful as the Kirin 820 5G. The Kirin 935 utilizes the ARMv8-A instruction set and has a lithography of 28 nm. With a TDP of 7 Watts, it is slightly less energy-efficient than the Kirin 820 5G. The Kirin 935 also features 1000 million transistors, which contributes to its overall performance.
In summary, while both processors have 8 cores, the Kirin 820 5G offers a more advanced architecture with higher clock speeds. Its 7 nm lithography and lower TDP make it a more energy-efficient choice. The inclusion of Ascend D110 Lite and HUAWEI Da Vinci Architecture further enhances its AI processing capabilities. On the other hand, the Kirin 935 has a less advanced architecture and a slightly higher TDP. However, it still provides decent performance, especially with its 1000 million transistors. Ultimately, the choice between the two processors depends on specific requirements and priorities, such as power efficiency or AI processing capabilities.
Starting with the HiSilicon Kirin 820 5G, it boasts an impressive architecture consisting of 1x 2.36 GHz Cortex-A76 core, 3x 2.22 GHz Cortex-A76 cores, and 4x 1.84 GHz Cortex-A55 cores. This configuration allows for efficient multitasking and provides a balance between performance and power consumption. Additionally, it utilizes the ARMv8.2-A instruction set and has a lithography of 7 nm, resulting in enhanced power efficiency and overall performance. The TDP (thermal design power) of the Kirin 820 5G is 6 Watts, making it an energy-efficient option. It also features the Ascend D110 Lite neural processing and HUAWEI Da Vinci Architecture for efficient AI processing.
On the other hand, the HiSilicon Kirin 935 has a different architecture. It is equipped with 4x 2.2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. While this configuration provides decent performance, it may not be as powerful as the Kirin 820 5G. The Kirin 935 utilizes the ARMv8-A instruction set and has a lithography of 28 nm. With a TDP of 7 Watts, it is slightly less energy-efficient than the Kirin 820 5G. The Kirin 935 also features 1000 million transistors, which contributes to its overall performance.
In summary, while both processors have 8 cores, the Kirin 820 5G offers a more advanced architecture with higher clock speeds. Its 7 nm lithography and lower TDP make it a more energy-efficient choice. The inclusion of Ascend D110 Lite and HUAWEI Da Vinci Architecture further enhances its AI processing capabilities. On the other hand, the Kirin 935 has a less advanced architecture and a slightly higher TDP. However, it still provides decent performance, especially with its 1000 million transistors. Ultimately, the choice between the two processors depends on specific requirements and priorities, such as power efficiency or AI processing capabilities.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 2.2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8-A |
Lithography | 7 nm | 28 nm |
Number of transistors | 1000 million | |
TDP | 6 Watt | 7 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR3 |
Memory frequency | 2133 MHz | 800 MHz |
Memory-bus | 4x16 bit | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.0 |
Graphics
GPU name | Mali-G57 MP6 | Mali-T628 MP4 |
GPU Architecture | Valhall | Midgard |
GPU frequency | 850 MHz | 680 MHz |
Execution units | 6 | 4 |
Shaders | 96 | 64 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 1.2 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.2 | 1.0 |
Camera, Video, Display
Max screen resolution | 2560x1600 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.05 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2015 Quarter 2 |
Partnumber | Hi3635 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 1050 vs Apple A17 Pro
2
Qualcomm Snapdragon 845 vs MediaTek Dimensity 6080
3
Qualcomm Snapdragon 765G vs HiSilicon Kirin 810
4
Apple A16 Bionic vs HiSilicon Kirin 980
5
Qualcomm Snapdragon 888 Plus vs MediaTek Dimensity 8100
6
Qualcomm Snapdragon 632 vs MediaTek Dimensity 9000 Plus
7
MediaTek Helio G95 vs Qualcomm Snapdragon 678
8
Unisoc Tiger T616 vs Samsung Exynos 1380
9
MediaTek Dimensity 1000L vs MediaTek Dimensity 700
10
Qualcomm Snapdragon 765 vs Samsung Exynos 9611