HiSilicon Kirin 820 5G vs HiSilicon Kirin 930
The HiSilicon Kirin 820 5G and the HiSilicon Kirin 930 are two processors with different specifications. Let's compare them based on their specifications.
Starting with the HiSilicon Kirin 820 5G, it features a powerful architecture with one 2.36 GHz Cortex-A76 core, three 2.22 GHz Cortex-A76 cores, and four 1.84 GHz Cortex-A55 cores. This architecture provides a balanced mix of performance and power efficiency. The processor is built on a 7 nm lithography process, which allows for improved power efficiency and performance. It has a TDP (thermal design power) of 6 Watts, indicating its power consumption. The HiSilicon Kirin 820 5G also comes with the Neural Processing unit Ascend D110 Lite and the HUAWEI Da Vinci Architecture for advanced AI capabilities.
On the other hand, the HiSilicon Kirin 930 has a different architecture, featuring four 2 GHz Cortex-A53 cores and four 1.5 GHz Cortex-A53 cores. While it offers a higher clock speed, it may not match the performance of the HiSilicon Kirin 820 5G's architecture. The Kirin 930 is built on a 28 nm lithography process, which is not as efficient as the 7 nm process of the Kirin 820 5G. It has a TDP of 5 Watts, indicating a slightly lower power consumption. Additionally, the Kirin 930 has 1000 million transistors, which may offer improved performance capabilities.
In conclusion, the HiSilicon Kirin 820 5G outperforms the HiSilicon Kirin 930 in terms of architecture, lithography process, and power efficiency. The Kirin 820 5G offers higher clock speeds, a more advanced neural processing unit, and is built on a more efficient 7 nm process. These specifications indicate that the Kirin 820 5G may deliver better overall performance and power efficiency, making it a more desirable processor compared to the Kirin 930.
Starting with the HiSilicon Kirin 820 5G, it features a powerful architecture with one 2.36 GHz Cortex-A76 core, three 2.22 GHz Cortex-A76 cores, and four 1.84 GHz Cortex-A55 cores. This architecture provides a balanced mix of performance and power efficiency. The processor is built on a 7 nm lithography process, which allows for improved power efficiency and performance. It has a TDP (thermal design power) of 6 Watts, indicating its power consumption. The HiSilicon Kirin 820 5G also comes with the Neural Processing unit Ascend D110 Lite and the HUAWEI Da Vinci Architecture for advanced AI capabilities.
On the other hand, the HiSilicon Kirin 930 has a different architecture, featuring four 2 GHz Cortex-A53 cores and four 1.5 GHz Cortex-A53 cores. While it offers a higher clock speed, it may not match the performance of the HiSilicon Kirin 820 5G's architecture. The Kirin 930 is built on a 28 nm lithography process, which is not as efficient as the 7 nm process of the Kirin 820 5G. It has a TDP of 5 Watts, indicating a slightly lower power consumption. Additionally, the Kirin 930 has 1000 million transistors, which may offer improved performance capabilities.
In conclusion, the HiSilicon Kirin 820 5G outperforms the HiSilicon Kirin 930 in terms of architecture, lithography process, and power efficiency. The Kirin 820 5G offers higher clock speeds, a more advanced neural processing unit, and is built on a more efficient 7 nm process. These specifications indicate that the Kirin 820 5G may deliver better overall performance and power efficiency, making it a more desirable processor compared to the Kirin 930.
CPU cores and architecture
Architecture | 1x 2.36 GHz – Cortex-A76 3x 2.22 GHz – Cortex-A76 4x 1.84 GHz – Cortex-A55 |
4x 2 GHz – Cortex-A53 4x 1.5 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8-A |
Lithography | 7 nm | 28 nm |
Number of transistors | 1000 million | |
TDP | 6 Watt | 5 Watt |
Neural Processing | Ascend D110 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 12 GB | up to 6 GB |
Memory type | LPDDR4X | LPDDR3 |
Memory frequency | 2133 MHz | 800 MHz |
Memory-bus | 4x16 bit | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.0 |
Graphics
GPU name | Mali-G57 MP6 | Mali-T628 MP4 |
GPU Architecture | Valhall | Midgard |
GPU frequency | 850 MHz | 600 MHz |
Execution units | 6 | 4 |
Shaders | 96 | 64 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 1.2 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.2 | 1.0 |
Camera, Video, Display
Max screen resolution | 2560x1600 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 20MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 1.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.2 Gbps | 0.05 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 March | 2015 Quarter 2 |
Partnumber | Hi3630 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 6080 vs MediaTek Helio G85
2
Apple A10X Fusion vs HiSilicon Kirin 810
3
Qualcomm Snapdragon 835 vs Samsung Exynos 1380
4
Samsung Exynos 9609 vs Qualcomm Snapdragon 636
5
Samsung Exynos 9820 vs MediaTek Dimensity 7200
6
Samsung Exynos 7870 vs Samsung Exynos 990
7
MediaTek Dimensity 1000 vs MediaTek Helio G35
8
Apple A12 Bionic vs Apple A15 Bionic
9
HiSilicon Kirin 710 vs Qualcomm Snapdragon 460
10
Samsung Exynos 9610 vs MediaTek Helio A25