HiSilicon Kirin 810 vs Unisoc Tiger T710
The HiSilicon Kirin 810 and the Unisoc Tiger T710 are two processors with distinct specifications. Let's compare them based on their CPU cores and architecture, lithography, instruction set, and neural processing capabilities.
Starting with the HiSilicon Kirin 810, it features a powerful architecture consisting of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This octa-core processor operates on the ARMv8.2-A instruction set and has a lithography of 7 nm, which indicates greater energy efficiency and superior performance. With 6900 million transistors, the Kirin 810 offers a robust processing capability. It has a low TDP of 5 Watts, making it suitable for power-efficient devices. Additionally, it incorporates the Ascend D100 Lite and the HUAWEI Da Vinci Architecture for efficient neural processing.
On the other hand, the Unisoc Tiger T710 features an architecture comprising 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Similar to the Kirin 810, it operates on the ARMv8.2-A instruction set. However, it has a larger lithography of 12 nm, which may result in slightly lower energy efficiency compared to the Kirin 810. The Tiger T710 incorporates a Dual NPU for neural processing, enhancing its performance in tasks related to artificial intelligence.
In terms of specifications, the HiSilicon Kirin 810 outperforms the Unisoc Tiger T710 in several areas. The Kirin 810 offers a more advanced architecture with Cortex-A76 cores, which are more powerful than the Cortex-A75 cores found in the Tiger T710. Moreover, the Kirin 810 operates at a smaller lithography, indicating better energy efficiency. Additionally, the Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci Architecture, further improving its neural processing capabilities.
In conclusion, while both the HiSilicon Kirin 810 and the Unisoc Tiger T710 possess similar instruction sets and core counts, the Kirin 810 boasts a more advanced architecture, smaller lithography, and enhanced neural processing capabilities. Thus, the Kirin 810 is likely to deliver better overall performance compared to the Tiger T710.
Starting with the HiSilicon Kirin 810, it features a powerful architecture consisting of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This octa-core processor operates on the ARMv8.2-A instruction set and has a lithography of 7 nm, which indicates greater energy efficiency and superior performance. With 6900 million transistors, the Kirin 810 offers a robust processing capability. It has a low TDP of 5 Watts, making it suitable for power-efficient devices. Additionally, it incorporates the Ascend D100 Lite and the HUAWEI Da Vinci Architecture for efficient neural processing.
On the other hand, the Unisoc Tiger T710 features an architecture comprising 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Similar to the Kirin 810, it operates on the ARMv8.2-A instruction set. However, it has a larger lithography of 12 nm, which may result in slightly lower energy efficiency compared to the Kirin 810. The Tiger T710 incorporates a Dual NPU for neural processing, enhancing its performance in tasks related to artificial intelligence.
In terms of specifications, the HiSilicon Kirin 810 outperforms the Unisoc Tiger T710 in several areas. The Kirin 810 offers a more advanced architecture with Cortex-A76 cores, which are more powerful than the Cortex-A75 cores found in the Tiger T710. Moreover, the Kirin 810 operates at a smaller lithography, indicating better energy efficiency. Additionally, the Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci Architecture, further improving its neural processing capabilities.
In conclusion, while both the HiSilicon Kirin 810 and the Unisoc Tiger T710 possess similar instruction sets and core counts, the Kirin 810 boasts a more advanced architecture, smaller lithography, and enhanced neural processing capabilities. Thus, the Kirin 810 is likely to deliver better overall performance compared to the Tiger T710.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | Dual NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G52 MP6 | Imagination PowerVR GM9446 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 820 MHz | 800 MHz |
Execution units | 6 | |
Shaders | 96 | |
DirectX | 12 | |
OpenCL API | 2.0 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.1 |
Camera, Video, Display
Max camera resolution | 1x 48MP, 2x 20MP | 1x 24MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2019 |
Partnumber | Hi6280 | T710 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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