HiSilicon Kirin 810 vs Unisoc Tiger T700
The HiSilicon Kirin 810 and the Unisoc Tiger T700 are both powerful processors, but they differ in several key specifications.
In terms of CPU cores and architecture, the Kirin 810 features 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the Tiger T700 has 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores.
The number of cores remains the same for both processors, with each having 8 cores. However, the Kirin 810's higher clock speeds on its primary cores might give it an advantage in terms of performance.
Both processors use the ARMv8.2-A instruction set, ensuring compatibility with modern software.
In terms of lithography, the Kirin 810 utilizes a more advanced 7 nm process, which helps improve power efficiency and overall performance. The Tiger T700, on the other hand, uses a slightly older 12 nm process. This difference could mean that the Kirin 810 is more power efficient and can offer better battery life.
The Kirin 810 also boasts a higher number of transistors, with 6900 million compared to the Tiger T700's unspecified number. More transistors typically indicate better performance and efficiency.
When comparing the Thermal Design Power (TDP), the Kirin 810 has a lower 5 Watt rating, suggesting that it generates less heat during operation compared to the Tiger T700's 10 Watt rating. This lower TDP can be beneficial in terms of cooling and power consumption.
Additionally, the Kirin 810 includes Neural Processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture. This feature enhances the processor's ability to handle AI and machine learning tasks efficiently.
In summary, the HiSilicon Kirin 810 and the Unisoc Tiger T700 are both notable processors, but the Kirin 810 surpasses the Tiger T700 in terms of clock speeds, lithography, number of transistors, lower TDP, and the inclusion of Neural Processing capabilities.
In terms of CPU cores and architecture, the Kirin 810 features 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the Tiger T700 has 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A5 cores.
The number of cores remains the same for both processors, with each having 8 cores. However, the Kirin 810's higher clock speeds on its primary cores might give it an advantage in terms of performance.
Both processors use the ARMv8.2-A instruction set, ensuring compatibility with modern software.
In terms of lithography, the Kirin 810 utilizes a more advanced 7 nm process, which helps improve power efficiency and overall performance. The Tiger T700, on the other hand, uses a slightly older 12 nm process. This difference could mean that the Kirin 810 is more power efficient and can offer better battery life.
The Kirin 810 also boasts a higher number of transistors, with 6900 million compared to the Tiger T700's unspecified number. More transistors typically indicate better performance and efficiency.
When comparing the Thermal Design Power (TDP), the Kirin 810 has a lower 5 Watt rating, suggesting that it generates less heat during operation compared to the Tiger T700's 10 Watt rating. This lower TDP can be beneficial in terms of cooling and power consumption.
Additionally, the Kirin 810 includes Neural Processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture. This feature enhances the processor's ability to handle AI and machine learning tasks efficiently.
In summary, the HiSilicon Kirin 810 and the Unisoc Tiger T700 are both notable processors, but the Kirin 810 surpasses the Tiger T700 in terms of clock speeds, lithography, number of transistors, lower TDP, and the inclusion of Neural Processing capabilities.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 4 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G52 MP2 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 820 MHz | 850 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 48MP |
Max Video Capture | FullHD@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2021 March |
Partnumber | Hi6280 | T700 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Samsung Exynos 8895 vs MediaTek Dimensity 7050
2
MediaTek Dimensity 700 vs Apple A10 Fusion
3
Unisoc Tiger T606 vs MediaTek Helio G90
4
Samsung Exynos 9820 vs Apple A11 Bionic
5
Unisoc Tanggula T760 5G vs Unisoc Tiger T610
6
Unisoc SC9832E vs MediaTek Helio P70
7
MediaTek Dimensity 1000 Plus vs MediaTek Dimensity 9000
8
MediaTek Helio P90 vs HiSilicon Kirin 935
9
HiSilicon Kirin 9000E 5G vs Unisoc Tiger T612
10
Unisoc Tanggula T740 5G vs Qualcomm Snapdragon 480