HiSilicon Kirin 810 vs Unisoc Tiger T616
In terms of CPU cores and architecture, the HiSilicon Kirin 810 and the Unisoc Tiger T616 processors have a similar setup with 8 cores. However, there are some differences in the specifications that set them apart.
Starting with the HiSilicon Kirin 810, it features an architecture of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This combination offers a good balance between performance and power efficiency. The processor is built on a 7 nm lithography, which allows for better power efficiency and improved performance. It also has a total of 6900 million transistors and a TDP (Thermal Design Power) of 5 Watts. Additionally, the HiSilicon Kirin 810 includes Neural Processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture, providing enhanced AI processing abilities.
On the other hand, the Unisoc Tiger T616 has an architecture of 2x 2.0 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. While it also has 8 cores like the Kirin 810, the clock speeds are slightly lower. The Tiger T616 is built on a 12 nm lithography, which is a bit less advanced than the 7 nm lithography of the Kirin 810. As a result, it may not offer the same power efficiency and performance improvements. The Tiger T616 has a TDP of 10 Watts, meaning it consumes more power compared to the Kirin 810.
In conclusion, the HiSilicon Kirin 810 outperforms the Unisoc Tiger T616 in terms of CPU architecture and lithography. The Kirin 810's use of the Cortex-A76 cores and advanced 7 nm lithography results in better performance and power efficiency compared to the Tiger T616's Cortex-A75 cores and 12 nm lithography. Additionally, the Kirin 810's inclusion of Neural Processing capabilities further enhances its capabilities in AI tasks.
Starting with the HiSilicon Kirin 810, it features an architecture of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This combination offers a good balance between performance and power efficiency. The processor is built on a 7 nm lithography, which allows for better power efficiency and improved performance. It also has a total of 6900 million transistors and a TDP (Thermal Design Power) of 5 Watts. Additionally, the HiSilicon Kirin 810 includes Neural Processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture, providing enhanced AI processing abilities.
On the other hand, the Unisoc Tiger T616 has an architecture of 2x 2.0 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. While it also has 8 cores like the Kirin 810, the clock speeds are slightly lower. The Tiger T616 is built on a 12 nm lithography, which is a bit less advanced than the 7 nm lithography of the Kirin 810. As a result, it may not offer the same power efficiency and performance improvements. The Tiger T616 has a TDP of 10 Watts, meaning it consumes more power compared to the Kirin 810.
In conclusion, the HiSilicon Kirin 810 outperforms the Unisoc Tiger T616 in terms of CPU architecture and lithography. The Kirin 810's use of the Cortex-A76 cores and advanced 7 nm lithography results in better performance and power efficiency compared to the Tiger T616's Cortex-A75 cores and 12 nm lithography. Additionally, the Kirin 810's inclusion of Neural Processing capabilities further enhances its capabilities in AI tasks.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2.0 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 6 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP1 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 820 MHz | 750 MHz |
Execution units | 6 | 1 |
Shaders | 96 | 16 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 2x 32MP |
Max Video Capture | FullHD@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2021 |
Partnumber | Hi6280 | T616 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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