HiSilicon Kirin 810 vs Unisoc Tiger T612
When comparing the HiSilicon Kirin 810 and the Unisoc Tiger T612 processors, it is clear that they have some similarities and differences in their specifications.
Starting with the HiSilicon Kirin 810, it boasts an impressive architecture that consists of 2 Cortex-A76 cores clocked at 2.27 GHz and 6 Cortex-A55 cores running at 1.88 GHz. With 8 cores in total, this processor is designed to handle various tasks efficiently. It utilizes the ARMv8.2-A instruction set, which provides better performance and improved power efficiency. Additionally, the Kirin 810 utilizes a 7 nm lithography process, allowing for better power efficiency and smaller transistor sizes. It packs 6900 million transistors, providing enough processing power for a range of applications. With a TDP of 5 Watts, this processor is energy-efficient. It also features neural processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture, enabling users to perform AI tasks seamlessly.
On the other hand, the Unisoc Tiger T612 also consists of 8 cores. Its architecture includes 2 Cortex-A75 cores running at 1.8 GHz and 6 Cortex-A55 cores clocked at 1.8 GHz as well. Like the Kirin 810, it uses the ARMv8.2-A instruction set, ensuring compatibility with a wide range of applications. However, it is worth noting that the T612 uses a 12 nm lithography process, which may result in slightly less power efficiency compared to the Kirin 810. Moreover, it has a TDP of 10 Watts, indicating a higher power consumption.
In summary, both processors have similarities in terms of their architectural composition, featuring 8 cores and utilizing the ARMv8.2-A instruction set. However, they differ in their clock speed, lithography process, and power consumption. The Kirin 810 stands out with its 7 nm lithography, lower TDP, and the additional neural processing capabilities. On the other hand, the Tiger T612 is equipped with a different lithography process and has a higher TDP. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the user, whether it be a balance between power efficiency and performance or specific AI processing needs.
Starting with the HiSilicon Kirin 810, it boasts an impressive architecture that consists of 2 Cortex-A76 cores clocked at 2.27 GHz and 6 Cortex-A55 cores running at 1.88 GHz. With 8 cores in total, this processor is designed to handle various tasks efficiently. It utilizes the ARMv8.2-A instruction set, which provides better performance and improved power efficiency. Additionally, the Kirin 810 utilizes a 7 nm lithography process, allowing for better power efficiency and smaller transistor sizes. It packs 6900 million transistors, providing enough processing power for a range of applications. With a TDP of 5 Watts, this processor is energy-efficient. It also features neural processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture, enabling users to perform AI tasks seamlessly.
On the other hand, the Unisoc Tiger T612 also consists of 8 cores. Its architecture includes 2 Cortex-A75 cores running at 1.8 GHz and 6 Cortex-A55 cores clocked at 1.8 GHz as well. Like the Kirin 810, it uses the ARMv8.2-A instruction set, ensuring compatibility with a wide range of applications. However, it is worth noting that the T612 uses a 12 nm lithography process, which may result in slightly less power efficiency compared to the Kirin 810. Moreover, it has a TDP of 10 Watts, indicating a higher power consumption.
In summary, both processors have similarities in terms of their architectural composition, featuring 8 cores and utilizing the ARMv8.2-A instruction set. However, they differ in their clock speed, lithography process, and power consumption. The Kirin 810 stands out with its 7 nm lithography, lower TDP, and the additional neural processing capabilities. On the other hand, the Tiger T612 is equipped with a different lithography process and has a higher TDP. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the user, whether it be a balance between power efficiency and performance or specific AI processing needs.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP1 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 650 MHz |
Execution units | 6 | 1 |
Shaders | 96 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 50MP |
Max Video Capture | FullHD@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2022 January |
Partnumber | Hi6280 | T612 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Dimensity 1000 vs Qualcomm Snapdragon 480
2
MediaTek Dimensity 1000 Plus vs MediaTek Helio G88
3
Qualcomm Snapdragon 778G vs Unisoc Tanggula T770 5G
4
MediaTek Helio G25 vs MediaTek Dimensity 1080
5
MediaTek Helio G90T vs Qualcomm Snapdragon 670
6
MediaTek Helio A25 vs Qualcomm Snapdragon 750G
7
Qualcomm Snapdragon 865 vs Qualcomm Snapdragon 730G
8
Qualcomm Snapdragon 662 vs MediaTek Dimensity 820
9
MediaTek Helio G95 vs MediaTek Helio G35
10
MediaTek Helio G70 vs Qualcomm Snapdragon 8 Plus Gen 1