HiSilicon Kirin 810 vs Unisoc Tiger T612

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When comparing the HiSilicon Kirin 810 and the Unisoc Tiger T612 processors, it is clear that they have some similarities and differences in their specifications.

Starting with the HiSilicon Kirin 810, it boasts an impressive architecture that consists of 2 Cortex-A76 cores clocked at 2.27 GHz and 6 Cortex-A55 cores running at 1.88 GHz. With 8 cores in total, this processor is designed to handle various tasks efficiently. It utilizes the ARMv8.2-A instruction set, which provides better performance and improved power efficiency. Additionally, the Kirin 810 utilizes a 7 nm lithography process, allowing for better power efficiency and smaller transistor sizes. It packs 6900 million transistors, providing enough processing power for a range of applications. With a TDP of 5 Watts, this processor is energy-efficient. It also features neural processing capabilities with the Ascend D100 Lite and HUAWEI Da Vinci Architecture, enabling users to perform AI tasks seamlessly.

On the other hand, the Unisoc Tiger T612 also consists of 8 cores. Its architecture includes 2 Cortex-A75 cores running at 1.8 GHz and 6 Cortex-A55 cores clocked at 1.8 GHz as well. Like the Kirin 810, it uses the ARMv8.2-A instruction set, ensuring compatibility with a wide range of applications. However, it is worth noting that the T612 uses a 12 nm lithography process, which may result in slightly less power efficiency compared to the Kirin 810. Moreover, it has a TDP of 10 Watts, indicating a higher power consumption.

In summary, both processors have similarities in terms of their architectural composition, featuring 8 cores and utilizing the ARMv8.2-A instruction set. However, they differ in their clock speed, lithography process, and power consumption. The Kirin 810 stands out with its 7 nm lithography, lower TDP, and the additional neural processing capabilities. On the other hand, the Tiger T612 is equipped with a different lithography process and has a higher TDP. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the user, whether it be a balance between power efficiency and performance or specific AI processing needs.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
2x 1.8 GHz – Cortex-A75
6x 1.8 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 12 nm
Number of transistors 6900 million
TDP 5 Watt 10 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 8 GB up to 8 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 1600 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G52 MP6 Mali-G57 MP1
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 650 MHz
Execution units 6 1
Shaders 96 16
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2400x1080
Max camera resolution 1x 48MP, 2x 20MP 1x 50MP
Max Video Capture FullHD@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 0.3 Gbps
Peak Upload Speed 0.15 Gbps 0.1 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.0
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2019 Quarter 2 2022 January
Partnumber Hi6280 T612
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
373134
Tiger T612
207365

GeekBench 6 Single-Core

Score
Kirin 810
604
Tiger T612
339

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Tiger T612
1306