HiSilicon Kirin 810 vs Unisoc Tiger T610
The HiSilicon Kirin 810 and the Unisoc Tiger T610 are two processors that we will be comparing based on their specifications.
Starting with the HiSilicon Kirin 810, it has an architecture that consists of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This processor features a total of 8 cores and operates on the ARMv8.2-A instruction set. With a lithography of 7 nm, it is able to provide efficient power consumption. The HiSilicon Kirin 810 also boasts a significant number of transistors, with 6900 million transistors enabling it to handle complex tasks. Additionally, it has a TDP (Thermal Design Power) of 5 Watt, which means it generates minimal heat while in operation. It also utilizes Ascend D100 Lite Neural Processing, incorporating HUAWEI Da Vinci Architecture for enhanced neural processing capabilities.
On the other hand, the Unisoc Tiger T610 has a similar architecture with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. Like the Kirin 810, it also has a total of 8 cores and operates on the ARMv8.2-A instruction set. However, it has a slightly larger lithography of 12 nm, which might result in slightly less power efficiency compared to the Kirin 810. It also has a TDP of 10 Watt, which means it generates more heat compared to the Kirin 810.
In conclusion, when comparing the specifications of the HiSilicon Kirin 810 and the Unisoc Tiger T610, it is evident that the Kirin 810 has a more advanced architecture with faster core speeds and a smaller lithography, resulting in better power efficiency. Furthermore, the Kirin 810 boasts a higher number of transistors and incorporates advanced neural processing capabilities for enhanced performance. However, it is important to evaluate other factors such as real-world performance and user experience before finalizing a decision.
Starting with the HiSilicon Kirin 810, it has an architecture that consists of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This processor features a total of 8 cores and operates on the ARMv8.2-A instruction set. With a lithography of 7 nm, it is able to provide efficient power consumption. The HiSilicon Kirin 810 also boasts a significant number of transistors, with 6900 million transistors enabling it to handle complex tasks. Additionally, it has a TDP (Thermal Design Power) of 5 Watt, which means it generates minimal heat while in operation. It also utilizes Ascend D100 Lite Neural Processing, incorporating HUAWEI Da Vinci Architecture for enhanced neural processing capabilities.
On the other hand, the Unisoc Tiger T610 has a similar architecture with 2x 1.8 GHz Cortex-A75 cores and 6x 1.8 GHz Cortex-A55 cores. Like the Kirin 810, it also has a total of 8 cores and operates on the ARMv8.2-A instruction set. However, it has a slightly larger lithography of 12 nm, which might result in slightly less power efficiency compared to the Kirin 810. It also has a TDP of 10 Watt, which means it generates more heat compared to the Kirin 810.
In conclusion, when comparing the specifications of the HiSilicon Kirin 810 and the Unisoc Tiger T610, it is evident that the Kirin 810 has a more advanced architecture with faster core speeds and a smaller lithography, resulting in better power efficiency. Furthermore, the Kirin 810 boasts a higher number of transistors and incorporates advanced neural processing capabilities for enhanced performance. However, it is important to evaluate other factors such as real-world performance and user experience before finalizing a decision.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 6 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1600 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G52 MP2 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 820 MHz | 614.4 MHz |
Execution units | 6 | 2 |
Shaders | 96 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2400x1080 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 32MP |
Max Video Capture | FullHD@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2019 June |
Partnumber | Hi6280 | T610 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Qualcomm Snapdragon 778G Plus vs Qualcomm Snapdragon 821
2
Qualcomm Snapdragon 4 Gen 1 vs MediaTek Dimensity 8100
3
Samsung Exynos 7420 vs MediaTek Dimensity 1000 Plus
4
MediaTek Helio G88 vs Qualcomm Snapdragon 8 Gen 2
5
Qualcomm Snapdragon 685 vs Samsung Exynos 8895
6
MediaTek Dimensity 800U vs MediaTek Dimensity 6020
7
Unisoc Tanggula T770 5G vs MediaTek Dimensity 8200
8
Qualcomm Snapdragon 660 vs Unisoc SC9832E
9
Qualcomm Snapdragon 710 vs MediaTek Dimensity 920
10
MediaTek Helio G35 vs Samsung Exynos 9609