HiSilicon Kirin 810 vs Unisoc Tanggula T770 5G
When comparing the specifications of the HiSilicon Kirin 810 and the Unisoc Tanggula T770 5G processors, there are several notable differences.
Starting with the CPU cores and architecture, the HiSilicon Kirin 810 features a 2x 2.27 GHz Cortex-A76 architecture along with 6x 1.88 GHz Cortex-A55 architecture. On the other hand, the Unisoc Tanggula T770 5G processor has a 1x 2.5 GHz Cortex-A76, 3x 2.2 GHz Cortex-A76, and 4x 2.0 GHz Cortex-A55 architecture. Both processors have eight cores but differ in terms of clock speed and distribution.
Moving on to instruction set and lithography, both processors utilize the ARMv8.2-A instruction set, which ensures compatibility with modern software and operating systems. The HiSilicon Kirin 810 has a lithography of 7 nm while the Unisoc Tanggula T770 5G boasts a slightly better 6 nm lithography. A smaller lithography generally signifies improved power efficiency and better overall performance.
In terms of transistor count, the HiSilicon Kirin 810 has 6900 million transistors, whereas the Unisoc Tanggula T770 5G does not mention the number of transistors in its specifications. While the exact number of transistors may not be crucial in determining performance, a higher count often indicates increased processing power.
Both processors have a thermal design power (TDP) of 5 Watts, which means they consume the same amount of power and are suitable for low-power devices.
Lastly, the neural processing capabilities differ between the two processors. The HiSilicon Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing, suggesting advanced AI capabilities. In contrast, the Unisoc Tanggula T770 5G simply states its neural processing unit (NPU) without providing further details.
Overall, while the HiSilicon Kirin 810 offers slightly higher clock speeds and a larger transistor count, the Unisoc Tanggula T770 5G excels in lithography. The choice between the two processors ultimately depends on the specific requirements of the device and the desired balance between power efficiency and performance.
Starting with the CPU cores and architecture, the HiSilicon Kirin 810 features a 2x 2.27 GHz Cortex-A76 architecture along with 6x 1.88 GHz Cortex-A55 architecture. On the other hand, the Unisoc Tanggula T770 5G processor has a 1x 2.5 GHz Cortex-A76, 3x 2.2 GHz Cortex-A76, and 4x 2.0 GHz Cortex-A55 architecture. Both processors have eight cores but differ in terms of clock speed and distribution.
Moving on to instruction set and lithography, both processors utilize the ARMv8.2-A instruction set, which ensures compatibility with modern software and operating systems. The HiSilicon Kirin 810 has a lithography of 7 nm while the Unisoc Tanggula T770 5G boasts a slightly better 6 nm lithography. A smaller lithography generally signifies improved power efficiency and better overall performance.
In terms of transistor count, the HiSilicon Kirin 810 has 6900 million transistors, whereas the Unisoc Tanggula T770 5G does not mention the number of transistors in its specifications. While the exact number of transistors may not be crucial in determining performance, a higher count often indicates increased processing power.
Both processors have a thermal design power (TDP) of 5 Watts, which means they consume the same amount of power and are suitable for low-power devices.
Lastly, the neural processing capabilities differ between the two processors. The HiSilicon Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing, suggesting advanced AI capabilities. In contrast, the Unisoc Tanggula T770 5G simply states its neural processing unit (NPU) without providing further details.
Overall, while the HiSilicon Kirin 810 offers slightly higher clock speeds and a larger transistor count, the Unisoc Tanggula T770 5G excels in lithography. The choice between the two processors ultimately depends on the specific requirements of the device and the desired balance between power efficiency and performance.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 5 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 32 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP6 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 850 MHz |
Execution units | 6 | 6 |
Shaders | 96 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2160x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 2x 24MP |
Max Video Capture | FullHD@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.7 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.5 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2021 February |
Partnumber | Hi6280 | T770, Tiger T7520 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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