HiSilicon Kirin 810 vs Unisoc Tanggula T740 5G
The HiSilicon Kirin 810 and Unisoc Tanggula T740 5G are two processors with different specifications. Let's compare them based on their specifications.
In terms of CPU cores and architecture, the HiSilicon Kirin 810 has a combination of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T740 5G features 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Both processors have 8 cores, but the HiSilicon Kirin 810 offers a higher clock speed on its higher-performance cores.
When it comes to the instruction set, both processors utilize ARMv8.2-A instruction set, allowing for improved performance and power efficiency.
In terms of lithography, the HiSilicon Kirin 810 is manufactured using a more advanced 7 nm process, while the Unisoc Tanggula T740 5G is built on a 12 nm process. Generally, a smaller lithography offers better power efficiency and higher performance.
Regarding neural processing capabilities, the HiSilicon Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing. The Unisoc Tanggula T740 5G, on the other hand, features a Dual NPU for its neural processing capabilities.
Overall, the HiSilicon Kirin 810 has a more powerful CPU configuration with higher clock speeds and a more advanced lithography. It also offers dedicated neural processing capabilities with its Ascend D100 Lite and HUAWEI Da Vinci Architecture. On the other hand, the Unisoc Tanggula T740 5G utilizes a Dual NPU for its neural processing. However, specific performance benchmarks and real-life usage scenarios would be needed to determine which processor performs better in practical applications.
In conclusion, the HiSilicon Kirin 810 and Unisoc Tanggula T740 5G have distinct differences in their specifications. These variances may result in varying performance levels in different applications and usage scenarios.
In terms of CPU cores and architecture, the HiSilicon Kirin 810 has a combination of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the Unisoc Tanggula T740 5G features 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. Both processors have 8 cores, but the HiSilicon Kirin 810 offers a higher clock speed on its higher-performance cores.
When it comes to the instruction set, both processors utilize ARMv8.2-A instruction set, allowing for improved performance and power efficiency.
In terms of lithography, the HiSilicon Kirin 810 is manufactured using a more advanced 7 nm process, while the Unisoc Tanggula T740 5G is built on a 12 nm process. Generally, a smaller lithography offers better power efficiency and higher performance.
Regarding neural processing capabilities, the HiSilicon Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing. The Unisoc Tanggula T740 5G, on the other hand, features a Dual NPU for its neural processing capabilities.
Overall, the HiSilicon Kirin 810 has a more powerful CPU configuration with higher clock speeds and a more advanced lithography. It also offers dedicated neural processing capabilities with its Ascend D100 Lite and HUAWEI Da Vinci Architecture. On the other hand, the Unisoc Tanggula T740 5G utilizes a Dual NPU for its neural processing. However, specific performance benchmarks and real-life usage scenarios would be needed to determine which processor performs better in practical applications.
In conclusion, the HiSilicon Kirin 810 and Unisoc Tanggula T740 5G have distinct differences in their specifications. These variances may result in varying performance levels in different applications and usage scenarios.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 12 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | Dual NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 1866 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G52 MP6 | Imagination PowerVR GM9446 |
GPU Architecture | Mali Bifrost | PowerVR Rogue |
GPU frequency | 820 MHz | 800 MHz |
Execution units | 6 | |
Shaders | 96 | |
DirectX | 12 | |
OpenCL API | 2.0 | 4.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.1 |
Camera, Video, Display
Max screen resolution | 2960x1440@60Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.5 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.75 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2020 Quarter 1 |
Partnumber | Hi6280 | T740, Tiger T7510 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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