HiSilicon Kirin 810 vs Unisoc SC9832E

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The HiSilicon Kirin 810 and Unisoc SC9832E are two processors with different specifications.

Starting with the HiSilicon Kirin 810, it features an architecture of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This processor has a total of 8 cores and utilizes the ARMv8.2-A instruction set. It is manufactured using a 7 nm lithography process and consists of 6900 million transistors. The thermal design power (TDP) of the Kirin 810 is 5 Watts. Additionally, it incorporates a neural processing unit known as the Ascend D100 Lite, which is based on the HUAWEI Da Vinci Architecture.

On the other hand, the Unisoc SC9832E has an architecture consisting of 4x 1.4 GHz Cortex-A53 cores. It has a total of 4 cores and supports the ARMv8-A instruction set. The SC9832E is manufactured using a 28 nm lithography process and has a TDP of 7 Watts.

Comparing the two processors, the Kirin 810 has a higher number of CPU cores (8 cores compared to 4 cores in the SC9832E), which can potentially result in better multitasking capabilities and overall performance. Moreover, the Kirin 810 utilizes a more advanced 7 nm lithography process, which generally leads to improved power efficiency and higher clock speeds. In contrast, the SC9832E is manufactured using a less efficient 28 nm process.

The Kirin 810 also stands out with its neural processing unit, the Ascend D100 Lite, which is designed to enhance AI-related tasks. This can be advantageous for applications and tasks that require artificial intelligence and machine learning capabilities. However, it is important to note that the SC9832E does not have a dedicated neural processing unit.

In summary, the HiSilicon Kirin 810 offers a higher number of CPU cores, an advanced 7 nm lithography process, and a dedicated neural processing unit. These specifications suggest that the Kirin 810 may deliver better performance and power efficiency compared to the Unisoc SC9832E, making it more suitable for demanding tasks and AI-related applications.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
4x 1.4 GHz – Cortex-A53
Number of cores 8 4
Instruction Set ARMv8.2-A ARMv8-A
Lithography 7 nm 28 nm
Number of transistors 6900 million
TDP 5 Watt 7 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture

Memory (RAM)

Max amount up to 8 GB up to 2 GB
Memory type LPDDR4X LPDDR3
Memory frequency 2133 MHz 667 MHz
Memory-bus 4x16 bit

Storage

Storage specification UFS 2.1 eMMC 5.1

Graphics

GPU name Mali-G52 MP6 Mali-T820 MP1
GPU Architecture Bifrost Midgard
GPU frequency 820 MHz 680 MHz
Execution units 6 1
Shaders 96 4
DirectX 12 11
OpenCL API 2.0 1.2
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.0

Camera, Video, Display

Max screen resolution 1440x720
Max camera resolution 1x 48MP, 2x 20MP 1x 13MP
Max Video Capture FullHD@30fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 0.15 Gbps
Peak Upload Speed 0.15 Gbps 0.05 Gbps
Wi-Fi 6 (802.11ax) 4 (802.11n)
Bluetooth 5.1 4.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
GLONASS

Supplemental Information

Launch Date 2019 Quarter 2 2018
Partnumber Hi6280
Vertical Segment Mobiles Mobiles
Positioning Mid-end Low-end

AnTuTu 10

Total Score
Kirin 810
373134
SC9832E
55434

GeekBench 6 Single-Core

Score
Kirin 810
604
SC9832E
98

GeekBench 6 Multi-Core

Score
Kirin 810
1959
SC9832E
455