HiSilicon Kirin 810 vs Unisoc SC7731E
When comparing the HiSilicon Kirin 810 and Unisoc SC7731E processors, several key differences become apparent.
In terms of CPU cores and architecture, the Kirin 810 boasts a more advanced design. It features a combination of 2x 2.27 GHz Cortex-A76 and 6x 1.88 GHz Cortex-A55 cores, providing a total of 8 cores for efficient multitasking. On the other hand, the SC7731E is equipped with 4x 1.3 GHz Cortex-A7 cores, offering a less powerful processing capability with only 4 cores.
Another significant point of comparison is the instruction set. The Kirin 810 utilizes the ARMv8.2-A instruction set, which is more modern and efficient in executing commands. In contrast, the SC7731E relies on the older ARMv7-A instruction set, which may result in slower performance and limited compatibility with newer software and applications.
When considering the manufacturing process, the Kirin 810 shines again with a lithography of 7 nm. This smaller fabrication process allows for more transistors to be packed onto the chip, enhancing overall performance and power efficiency. The SC7731E, on the other hand, has a larger 28 nm lithography, indicating a less advanced manufacturing process and potentially lower performance and efficiency.
Additionally, the power consumption of the processors differs. The Kirin 810 has a TDP (Thermal Design Power) of 5 Watt, which suggests it is designed to operate with minimal power usage. Conversely, the SC7731E has a slightly higher TDP of 7 Watt, indicating a relatively higher power requirement.
It is also worth mentioning that the Kirin 810 includes Neural Processing capabilities utilizing the Ascend D100 Lite and HUAWEI Da Vinci Architecture. This enables advanced AI and machine learning tasks. The SC7731E, on the other hand, does not offer any specific neural processing capabilities.
In summary, the HiSilicon Kirin 810 stands out with its more powerful and efficient CPU architecture, advanced instruction set, smaller lithography, lower power consumption, and added Neural Processing capabilities. Meanwhile, the Unisoc SC7731E lags behind in terms of core count, instruction set, manufacturing process, and power efficiency. Depending on specific requirements and use cases, the Kirin 810 may offer superior performance and functionality.
In terms of CPU cores and architecture, the Kirin 810 boasts a more advanced design. It features a combination of 2x 2.27 GHz Cortex-A76 and 6x 1.88 GHz Cortex-A55 cores, providing a total of 8 cores for efficient multitasking. On the other hand, the SC7731E is equipped with 4x 1.3 GHz Cortex-A7 cores, offering a less powerful processing capability with only 4 cores.
Another significant point of comparison is the instruction set. The Kirin 810 utilizes the ARMv8.2-A instruction set, which is more modern and efficient in executing commands. In contrast, the SC7731E relies on the older ARMv7-A instruction set, which may result in slower performance and limited compatibility with newer software and applications.
When considering the manufacturing process, the Kirin 810 shines again with a lithography of 7 nm. This smaller fabrication process allows for more transistors to be packed onto the chip, enhancing overall performance and power efficiency. The SC7731E, on the other hand, has a larger 28 nm lithography, indicating a less advanced manufacturing process and potentially lower performance and efficiency.
Additionally, the power consumption of the processors differs. The Kirin 810 has a TDP (Thermal Design Power) of 5 Watt, which suggests it is designed to operate with minimal power usage. Conversely, the SC7731E has a slightly higher TDP of 7 Watt, indicating a relatively higher power requirement.
It is also worth mentioning that the Kirin 810 includes Neural Processing capabilities utilizing the Ascend D100 Lite and HUAWEI Da Vinci Architecture. This enables advanced AI and machine learning tasks. The SC7731E, on the other hand, does not offer any specific neural processing capabilities.
In summary, the HiSilicon Kirin 810 stands out with its more powerful and efficient CPU architecture, advanced instruction set, smaller lithography, lower power consumption, and added Neural Processing capabilities. Meanwhile, the Unisoc SC7731E lags behind in terms of core count, instruction set, manufacturing process, and power efficiency. Depending on specific requirements and use cases, the Kirin 810 may offer superior performance and functionality.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
4x 1.3 GHz – Cortex-A7 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv7-A |
Lithography | 7 nm | 28 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 7 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
Max amount | up to 8 GB | up to 1 GB |
Memory type | LPDDR4X | LPDDR3 |
Memory frequency | 2133 MHz | 533 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 2.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-T820 MP1 |
GPU Architecture | Mali Bifrost | Mali Midgard |
GPU frequency | 820 MHz | 600 MHz |
Execution units | 6 | 1 |
Shaders | 96 | 4 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 1.2 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 1440x720 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 8MP |
Max Video Capture | FullHD@30fps | HD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | |
Peak Upload Speed | 0.15 Gbps | |
Wi-Fi | 6 (802.11ax) | 4 (802.11n) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2018 Quarter 2 |
Partnumber | Hi6280 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
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