HiSilicon Kirin 810 vs MediaTek Dimensity 930
The HiSilicon Kirin 810 and MediaTek Dimensity 930 are two processors that are often compared in terms of their specifications.
Starting with the HiSilicon Kirin 810, it features a 7 nm lithography and 6900 million transistors. The CPU architecture includes 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores, resulting in a total of 8 cores. The instruction set of the Kirin 810 is ARMv8.2-A. With a TDP (thermal design power) of 5 watts, this processor offers efficient power consumption. It also includes Neural Processing capabilities with Ascend D100 Lite and HUAWEI Da Vinci Architecture.
On the other hand, the MediaTek Dimensity 930 showcases a 6 nm lithography, which is a slightly smaller size compared to the Kirin 810. It also consists of 8 cores with an architecture that includes 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Similar to the Kirin 810, it operates with the ARMv8.2-A instruction set. The Dimensity 930 has a TDP of 10 watts, indicating a slightly higher power consumption. In terms of Neural Processing, it features an NPU.
Comparing these two processors, they both have 8 cores with similar instruction sets. However, the Kirin 810 has a higher clock speed for its Cortex-A76 cores compared to the Dimensity 930. The Kirin 810 also has a smaller lithography of 7 nm, potentially offering improved power efficiency. On the other hand, the Dimensity 930 boasts a larger number of Cortex-A78 cores and a slightly higher TDP.
Overall, the choice between the HiSilicon Kirin 810 and MediaTek Dimensity 930 will depend on the specific requirements and preferences of the user. The Kirin 810 may be more suitable for those seeking higher clock speeds and power efficiency, while the Dimensity 930 could be a better option for individuals prioritizing a greater number of Cortex-A78 cores.
Starting with the HiSilicon Kirin 810, it features a 7 nm lithography and 6900 million transistors. The CPU architecture includes 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores, resulting in a total of 8 cores. The instruction set of the Kirin 810 is ARMv8.2-A. With a TDP (thermal design power) of 5 watts, this processor offers efficient power consumption. It also includes Neural Processing capabilities with Ascend D100 Lite and HUAWEI Da Vinci Architecture.
On the other hand, the MediaTek Dimensity 930 showcases a 6 nm lithography, which is a slightly smaller size compared to the Kirin 810. It also consists of 8 cores with an architecture that includes 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Similar to the Kirin 810, it operates with the ARMv8.2-A instruction set. The Dimensity 930 has a TDP of 10 watts, indicating a slightly higher power consumption. In terms of Neural Processing, it features an NPU.
Comparing these two processors, they both have 8 cores with similar instruction sets. However, the Kirin 810 has a higher clock speed for its Cortex-A76 cores compared to the Dimensity 930. The Kirin 810 also has a smaller lithography of 7 nm, potentially offering improved power efficiency. On the other hand, the Dimensity 930 boasts a larger number of Cortex-A78 cores and a slightly higher TDP.
Overall, the choice between the HiSilicon Kirin 810 and MediaTek Dimensity 930 will depend on the specific requirements and preferences of the user. The Kirin 810 may be more suitable for those seeking higher clock speeds and power efficiency, while the Dimensity 930 could be a better option for individuals prioritizing a greater number of Cortex-A78 cores.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G52 MP6 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 820 MHz | 800 MHz |
Execution units | 6 | |
Shaders | 96 | |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 3.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 1x 64MP |
Max Video Capture | FullHD@30fps | 2K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2022 Quarter 3 |
Partnumber | Hi6280 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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