HiSilicon Kirin 810 vs MediaTek Dimensity 930

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The HiSilicon Kirin 810 and MediaTek Dimensity 930 are two processors that are often compared in terms of their specifications.

Starting with the HiSilicon Kirin 810, it features a 7 nm lithography and 6900 million transistors. The CPU architecture includes 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores, resulting in a total of 8 cores. The instruction set of the Kirin 810 is ARMv8.2-A. With a TDP (thermal design power) of 5 watts, this processor offers efficient power consumption. It also includes Neural Processing capabilities with Ascend D100 Lite and HUAWEI Da Vinci Architecture.

On the other hand, the MediaTek Dimensity 930 showcases a 6 nm lithography, which is a slightly smaller size compared to the Kirin 810. It also consists of 8 cores with an architecture that includes 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Similar to the Kirin 810, it operates with the ARMv8.2-A instruction set. The Dimensity 930 has a TDP of 10 watts, indicating a slightly higher power consumption. In terms of Neural Processing, it features an NPU.

Comparing these two processors, they both have 8 cores with similar instruction sets. However, the Kirin 810 has a higher clock speed for its Cortex-A76 cores compared to the Dimensity 930. The Kirin 810 also has a smaller lithography of 7 nm, potentially offering improved power efficiency. On the other hand, the Dimensity 930 boasts a larger number of Cortex-A78 cores and a slightly higher TDP.

Overall, the choice between the HiSilicon Kirin 810 and MediaTek Dimensity 930 will depend on the specific requirements and preferences of the user. The Kirin 810 may be more suitable for those seeking higher clock speeds and power efficiency, while the Dimensity 930 could be a better option for individuals prioritizing a greater number of Cortex-A78 cores.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
2x 2.2 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
Number of transistors 6900 million
TDP 5 Watt 10 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR5
Memory frequency 2133 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G52 MP6 Imagination PowerVR BXM-8-256
GPU Architecture Bifrost Rogue
GPU frequency 820 MHz 800 MHz
Execution units 6
Shaders 96
DirectX 12 12
OpenCL API 2.0 3.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 108MP, 1x 64MP
Max Video Capture FullHD@30fps 2K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2019 Quarter 2 2022 Quarter 3
Partnumber Hi6280
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
373134
Dimensity 930

GeekBench 6 Single-Core

Score
Kirin 810
604
Dimensity 930

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Dimensity 930