HiSilicon Kirin 810 vs MediaTek Dimensity 920
When comparing the specifications of the HiSilicon Kirin 810 and the MediaTek Dimensity 920 processors, several key differences can be identified.
In terms of CPU cores and architecture, the Kirin 810 features 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores, while the Dimensity 920 has 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This indicates that the Dimensity 920 may offer slightly higher clock speeds and potentially better performance than the Kirin 810.
Both processors have 8 cores in total and utilize the ARMv8.2-A instruction set. This means that they are capable of running 64-bit software and offer advanced features, such as enhanced security and virtualization support.
In terms of lithography, the Kirin 810 is manufactured using a 7 nm process, while the Dimensity 920 utilizes a 6 nm process. A smaller lithography generally allows for more efficient power consumption and can result in improved performance.
The number of transistors in the Kirin 810 is listed as 6900 million, while this information is not provided for the Dimensity 920. More transistors generally indicate a more powerful and capable processor.
The TDP (thermal design power) of the Kirin 810 is 5 Watts, while the Dimensity 920 has a TDP of 10 Watts. A lower TDP suggests that the Kirin 810 may be more power-efficient.
Finally, in terms of neural processing capabilities, the Kirin 810 is equipped with the Ascend D100 Lite and HUAWEI Da Vinci Architecture, while the Dimensity 920 features an NPU (neural processing unit). This suggests that the Kirin 810 may have more advanced AI processing capabilities.
In conclusion, while both the HiSilicon Kirin 810 and the MediaTek Dimensity 920 offer powerful and capable performance, the Dimensity 920 appears to have slightly higher clock speeds, a smaller lithography, and potentially greater AI processing capabilities. However, the Kirin 810 has a lower TDP, which may result in improved power efficiency. Ultimately, the choice between these processors would depend on the specific requirements and preferences of the user.
In terms of CPU cores and architecture, the Kirin 810 features 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores, while the Dimensity 920 has 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This indicates that the Dimensity 920 may offer slightly higher clock speeds and potentially better performance than the Kirin 810.
Both processors have 8 cores in total and utilize the ARMv8.2-A instruction set. This means that they are capable of running 64-bit software and offer advanced features, such as enhanced security and virtualization support.
In terms of lithography, the Kirin 810 is manufactured using a 7 nm process, while the Dimensity 920 utilizes a 6 nm process. A smaller lithography generally allows for more efficient power consumption and can result in improved performance.
The number of transistors in the Kirin 810 is listed as 6900 million, while this information is not provided for the Dimensity 920. More transistors generally indicate a more powerful and capable processor.
The TDP (thermal design power) of the Kirin 810 is 5 Watts, while the Dimensity 920 has a TDP of 10 Watts. A lower TDP suggests that the Kirin 810 may be more power-efficient.
Finally, in terms of neural processing capabilities, the Kirin 810 is equipped with the Ascend D100 Lite and HUAWEI Da Vinci Architecture, while the Dimensity 920 features an NPU (neural processing unit). This suggests that the Kirin 810 may have more advanced AI processing capabilities.
In conclusion, while both the HiSilicon Kirin 810 and the MediaTek Dimensity 920 offer powerful and capable performance, the Dimensity 920 appears to have slightly higher clock speeds, a smaller lithography, and potentially greater AI processing capabilities. However, the Kirin 810 has a lower TDP, which may result in improved power efficiency. Ultimately, the choice between these processors would depend on the specific requirements and preferences of the user.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2.5 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G68 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 950 MHz |
Execution units | 6 | 4 |
Shaders | 96 | 96 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 2x 20MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2021 Quarter 3 |
Partnumber | Hi6280 | MT6877T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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