HiSilicon Kirin 810 vs MediaTek Dimensity 920

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When comparing the specifications of the HiSilicon Kirin 810 and the MediaTek Dimensity 920 processors, several key differences can be identified.

In terms of CPU cores and architecture, the Kirin 810 features 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores, while the Dimensity 920 has 2x 2.5 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This indicates that the Dimensity 920 may offer slightly higher clock speeds and potentially better performance than the Kirin 810.

Both processors have 8 cores in total and utilize the ARMv8.2-A instruction set. This means that they are capable of running 64-bit software and offer advanced features, such as enhanced security and virtualization support.

In terms of lithography, the Kirin 810 is manufactured using a 7 nm process, while the Dimensity 920 utilizes a 6 nm process. A smaller lithography generally allows for more efficient power consumption and can result in improved performance.

The number of transistors in the Kirin 810 is listed as 6900 million, while this information is not provided for the Dimensity 920. More transistors generally indicate a more powerful and capable processor.

The TDP (thermal design power) of the Kirin 810 is 5 Watts, while the Dimensity 920 has a TDP of 10 Watts. A lower TDP suggests that the Kirin 810 may be more power-efficient.

Finally, in terms of neural processing capabilities, the Kirin 810 is equipped with the Ascend D100 Lite and HUAWEI Da Vinci Architecture, while the Dimensity 920 features an NPU (neural processing unit). This suggests that the Kirin 810 may have more advanced AI processing capabilities.

In conclusion, while both the HiSilicon Kirin 810 and the MediaTek Dimensity 920 offer powerful and capable performance, the Dimensity 920 appears to have slightly higher clock speeds, a smaller lithography, and potentially greater AI processing capabilities. However, the Kirin 810 has a lower TDP, which may result in improved power efficiency. Ultimately, the choice between these processors would depend on the specific requirements and preferences of the user.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
2x 2.5 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
Number of transistors 6900 million
TDP 5 Watt 10 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR5
Memory frequency 2133 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G52 MP6 Mali-G68 MP4
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 950 MHz
Execution units 6 4
Shaders 96 96
DirectX 12 12
OpenCL API 2.0 2.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 108MP, 2x 20MP
Max Video Capture FullHD@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 6 (802.11ax)
Bluetooth 5.1 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2019 Quarter 2 2021 Quarter 3
Partnumber Hi6280 MT6877T
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
373134
Dimensity 920
453634

GeekBench 6 Single-Core

Score
Kirin 810
604
Dimensity 920
780

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Dimensity 920
2594