HiSilicon Kirin 810 vs MediaTek Dimensity 900

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The HiSilicon Kirin 810 and MediaTek Dimensity 900 are two processors that offer impressive specifications for modern smartphones. Let's compare these processors based on their specifications.

In terms of CPU cores and architecture, both processors feature 8 cores. The HiSilicon Kirin 810 utilizes a combination of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 900 boasts 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This suggests that the Dimensity 900 has a slightly higher clock speed for both its high-performance and power-efficient cores.

Moving on to the instruction set, both processors support ARMv8.2-A, ensuring compatibility with modern software and applications. This allows for optimized performance and enhanced functionality.

When it comes to lithography, the HiSilicon Kirin 810 is manufactured using a 7 nm process, while the MediaTek Dimensity 900 takes advantage of an even more advanced 6 nm process. A smaller lithography generally implies improved power efficiency and potentially better performance.

In terms of the number of transistors, the Kirin 810 comes with 6900 million, whereas the Dimensity 900 boasts a higher count of 10000 million transistors. This suggests that the Dimensity 900 has a more complex architecture, potentially enabling more advanced features and improved performance.

Considering power consumption, the Kirin 810 has a thermal design power (TDP) of 5 watts, whereas the Dimensity 900's TDP is slightly higher at 10 watts. A lower TDP generally implies better power efficiency, potentially leading to increased battery life.

Finally, regarding neural processing, the Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci architecture, while the Dimensity 900 features its own Neural Processing Unit (NPU). Both processors offer AI capabilities, but the specific architecture and features may differ, potentially impacting AI performance.

In conclusion, both the HiSilicon Kirin 810 and MediaTek Dimensity 900 offer compelling specifications for smartphone processors. It is important to consider factors such as clock speed, lithography, transistor count, power consumption, and neural processing capabilities when selecting the most suitable processor for your specific needs.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 6 nm
Number of transistors 6900 million 10000 million
TDP 5 Watt 10 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR5
Memory frequency 2133 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G52 MP6 Mali-G68 MP4
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 900 MHz
Execution units 6 4
Shaders 96 64
DirectX 12 12
OpenCL API 2.0 2.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 108MP, 2x 20MP
Max Video Capture FullHD@30fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 6 (802.11ax)
Bluetooth 5.1 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2019 Quarter 2 2021 Quarter 1
Partnumber Hi6280 MT6877
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
373134
Dimensity 900
435318

GeekBench 6 Single-Core

Score
Kirin 810
604
Dimensity 900
704

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Dimensity 900
2139