HiSilicon Kirin 810 vs MediaTek Dimensity 900
The HiSilicon Kirin 810 and MediaTek Dimensity 900 are two processors that offer impressive specifications for modern smartphones. Let's compare these processors based on their specifications.
In terms of CPU cores and architecture, both processors feature 8 cores. The HiSilicon Kirin 810 utilizes a combination of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 900 boasts 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This suggests that the Dimensity 900 has a slightly higher clock speed for both its high-performance and power-efficient cores.
Moving on to the instruction set, both processors support ARMv8.2-A, ensuring compatibility with modern software and applications. This allows for optimized performance and enhanced functionality.
When it comes to lithography, the HiSilicon Kirin 810 is manufactured using a 7 nm process, while the MediaTek Dimensity 900 takes advantage of an even more advanced 6 nm process. A smaller lithography generally implies improved power efficiency and potentially better performance.
In terms of the number of transistors, the Kirin 810 comes with 6900 million, whereas the Dimensity 900 boasts a higher count of 10000 million transistors. This suggests that the Dimensity 900 has a more complex architecture, potentially enabling more advanced features and improved performance.
Considering power consumption, the Kirin 810 has a thermal design power (TDP) of 5 watts, whereas the Dimensity 900's TDP is slightly higher at 10 watts. A lower TDP generally implies better power efficiency, potentially leading to increased battery life.
Finally, regarding neural processing, the Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci architecture, while the Dimensity 900 features its own Neural Processing Unit (NPU). Both processors offer AI capabilities, but the specific architecture and features may differ, potentially impacting AI performance.
In conclusion, both the HiSilicon Kirin 810 and MediaTek Dimensity 900 offer compelling specifications for smartphone processors. It is important to consider factors such as clock speed, lithography, transistor count, power consumption, and neural processing capabilities when selecting the most suitable processor for your specific needs.
In terms of CPU cores and architecture, both processors feature 8 cores. The HiSilicon Kirin 810 utilizes a combination of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 900 boasts 2x 2.4 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This suggests that the Dimensity 900 has a slightly higher clock speed for both its high-performance and power-efficient cores.
Moving on to the instruction set, both processors support ARMv8.2-A, ensuring compatibility with modern software and applications. This allows for optimized performance and enhanced functionality.
When it comes to lithography, the HiSilicon Kirin 810 is manufactured using a 7 nm process, while the MediaTek Dimensity 900 takes advantage of an even more advanced 6 nm process. A smaller lithography generally implies improved power efficiency and potentially better performance.
In terms of the number of transistors, the Kirin 810 comes with 6900 million, whereas the Dimensity 900 boasts a higher count of 10000 million transistors. This suggests that the Dimensity 900 has a more complex architecture, potentially enabling more advanced features and improved performance.
Considering power consumption, the Kirin 810 has a thermal design power (TDP) of 5 watts, whereas the Dimensity 900's TDP is slightly higher at 10 watts. A lower TDP generally implies better power efficiency, potentially leading to increased battery life.
Finally, regarding neural processing, the Kirin 810 incorporates the Ascend D100 Lite and HUAWEI Da Vinci architecture, while the Dimensity 900 features its own Neural Processing Unit (NPU). Both processors offer AI capabilities, but the specific architecture and features may differ, potentially impacting AI performance.
In conclusion, both the HiSilicon Kirin 810 and MediaTek Dimensity 900 offer compelling specifications for smartphone processors. It is important to consider factors such as clock speed, lithography, transistor count, power consumption, and neural processing capabilities when selecting the most suitable processor for your specific needs.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2.4 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 6 nm |
Number of transistors | 6900 million | 10000 million |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR5 |
Memory frequency | 2133 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G68 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 900 MHz |
Execution units | 6 | 4 |
Shaders | 96 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 108MP, 2x 20MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2021 Quarter 1 |
Partnumber | Hi6280 | MT6877 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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