HiSilicon Kirin 810 vs MediaTek Dimensity 800

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The HiSilicon Kirin 810 and the MediaTek Dimensity 800 are two processors designed for mobile devices. While they may have some similarities in terms of architecture and lithography, there are key differences in their specifications.

Starting with the HiSilicon Kirin 810, it features a combination of 2 Cortex-A76 cores clocked at 2.27 GHz and 6 Cortex-A55 cores running at 1.88 GHz. This results in a total of 8 cores, providing a balance between performance and power efficiency. With an instruction set of ARMv8.2-A, this processor is capable of handling the latest software and applications. The Kirin 810 is built on a 7nm lithography, which allows for better power efficiency and performance compared to larger lithography processes. It also boasts 6900 million transistors, contributing to its overall processing power. In terms of neural processing capabilities, the Kirin 810 utilizes the Ascend D100 Lite with HUAWEI Da Vinci Architecture.

Moving on to the MediaTek Dimensity 800, it features a quad-core architecture consisting of 4 Cortex-A76 cores clocked at 2.0 GHz and 4 Cortex-A55 cores running at the same frequency. With a total of 4 cores, it may not offer the same level of multitasking capabilities as the Kirin 810. Like the Kirin 810, it also utilizes the ARMv8.2-A instruction set and is built on a 7nm lithography. However, it has a higher Thermal Design Power (TDP) of 10 Watts, meaning it may consume more power compared to the Kirin 810. In terms of neural processing, the Dimensity 800 features an NPU.

Overall, both processors have their own strengths and weaknesses. The HiSilicon Kirin 810 offers a higher number of cores, a more advanced neural processing system, and a lower TDP. On the other hand, the MediaTek Dimensity 800 features a simpler quad-core architecture and a slightly higher TDP. When choosing between these processors, it is important to consider the specific requirements and needs of the device and ensure that they align with the capabilities of the chosen processor.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
4x 2.0 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 4
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 7 nm
Number of transistors 6900 million
TDP 5 Watt 10 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 8 GB up to 16 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G52 MP6 Mali-G57 MP4
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 650 MHz
Execution units 6 4
Shaders 96 64
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture FullHD@30fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
QZSS

Supplemental Information

Launch Date 2019 Quarter 2 2020 Quarter 2
Partnumber Hi6280 MT6873, MT6873V
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
373134
Dimensity 800
325654

GeekBench 6 Single-Core

Score
Kirin 810
604
Dimensity 800
514

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Dimensity 800
1882