HiSilicon Kirin 810 vs MediaTek Dimensity 800
The HiSilicon Kirin 810 and the MediaTek Dimensity 800 are two processors designed for mobile devices. While they may have some similarities in terms of architecture and lithography, there are key differences in their specifications.
Starting with the HiSilicon Kirin 810, it features a combination of 2 Cortex-A76 cores clocked at 2.27 GHz and 6 Cortex-A55 cores running at 1.88 GHz. This results in a total of 8 cores, providing a balance between performance and power efficiency. With an instruction set of ARMv8.2-A, this processor is capable of handling the latest software and applications. The Kirin 810 is built on a 7nm lithography, which allows for better power efficiency and performance compared to larger lithography processes. It also boasts 6900 million transistors, contributing to its overall processing power. In terms of neural processing capabilities, the Kirin 810 utilizes the Ascend D100 Lite with HUAWEI Da Vinci Architecture.
Moving on to the MediaTek Dimensity 800, it features a quad-core architecture consisting of 4 Cortex-A76 cores clocked at 2.0 GHz and 4 Cortex-A55 cores running at the same frequency. With a total of 4 cores, it may not offer the same level of multitasking capabilities as the Kirin 810. Like the Kirin 810, it also utilizes the ARMv8.2-A instruction set and is built on a 7nm lithography. However, it has a higher Thermal Design Power (TDP) of 10 Watts, meaning it may consume more power compared to the Kirin 810. In terms of neural processing, the Dimensity 800 features an NPU.
Overall, both processors have their own strengths and weaknesses. The HiSilicon Kirin 810 offers a higher number of cores, a more advanced neural processing system, and a lower TDP. On the other hand, the MediaTek Dimensity 800 features a simpler quad-core architecture and a slightly higher TDP. When choosing between these processors, it is important to consider the specific requirements and needs of the device and ensure that they align with the capabilities of the chosen processor.
Starting with the HiSilicon Kirin 810, it features a combination of 2 Cortex-A76 cores clocked at 2.27 GHz and 6 Cortex-A55 cores running at 1.88 GHz. This results in a total of 8 cores, providing a balance between performance and power efficiency. With an instruction set of ARMv8.2-A, this processor is capable of handling the latest software and applications. The Kirin 810 is built on a 7nm lithography, which allows for better power efficiency and performance compared to larger lithography processes. It also boasts 6900 million transistors, contributing to its overall processing power. In terms of neural processing capabilities, the Kirin 810 utilizes the Ascend D100 Lite with HUAWEI Da Vinci Architecture.
Moving on to the MediaTek Dimensity 800, it features a quad-core architecture consisting of 4 Cortex-A76 cores clocked at 2.0 GHz and 4 Cortex-A55 cores running at the same frequency. With a total of 4 cores, it may not offer the same level of multitasking capabilities as the Kirin 810. Like the Kirin 810, it also utilizes the ARMv8.2-A instruction set and is built on a 7nm lithography. However, it has a higher Thermal Design Power (TDP) of 10 Watts, meaning it may consume more power compared to the Kirin 810. In terms of neural processing, the Dimensity 800 features an NPU.
Overall, both processors have their own strengths and weaknesses. The HiSilicon Kirin 810 offers a higher number of cores, a more advanced neural processing system, and a lower TDP. On the other hand, the MediaTek Dimensity 800 features a simpler quad-core architecture and a slightly higher TDP. When choosing between these processors, it is important to consider the specific requirements and needs of the device and ensure that they align with the capabilities of the chosen processor.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 16 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 650 MHz |
Execution units | 6 | 4 |
Shaders | 96 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@120Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | FullHD@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2020 Quarter 2 |
Partnumber | Hi6280 | MT6873, MT6873V |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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