HiSilicon Kirin 810 vs MediaTek Dimensity 720
The HiSilicon Kirin 810 and the MediaTek Dimensity 720 are two processors that offer powerful performance and efficiency. Let's compare their specifications to understand the differences and similarities between the two.
In terms of CPU cores and architecture, the Kirin 810 is equipped with 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the Dimensity 720 features 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Both processors offer octa-core capabilities, ensuring smooth multitasking and overall performance.
When it comes to instruction sets, both processors support ARMv8.2-A, allowing for efficient processing and optimized performance.
In terms of lithography, both the Kirin 810 and the Dimensity 720 are manufactured using the advanced 7 nm process, providing excellent power efficiency and thermal management.
Moving on to the number of transistors, the Kirin 810 stands out with its 6900 million transistors. Meanwhile, information regarding the Dimensity 720's transistor count is not mentioned, suggesting that it may have a lower transistor count compared to the Kirin 810.
In terms of power consumption, the Kirin 810 has a TDP (Thermal Design Power) of 5W, indicating low power consumption. On the other hand, the Dimensity 720 has a slightly higher TDP of 10W, meaning it may consume more power compared to the Kirin 810.
Regarding neural processing capabilities, the Kirin 810 utilizes the Ascend D100 Lite and Huawei Da Vinci architecture. This allows for enhanced AI processing and improved neural network performance. The Dimensity 720, on the other hand, features an NPU (Neural Processing Unit), which also enables efficient AI and neural processing tasks.
In summary, both the HiSilicon Kirin 810 and the MediaTek Dimensity 720 are powerful processors with impressive specifications. While the Kirin 810 has a lower TDP, higher transistor count, and utilizes Huawei's Da Vinci architecture, the Dimensity 720 offers slightly higher clock speeds. Both processors are excellent options for smartphones and other mobile devices, providing efficient performance and advanced AI capabilities.
In terms of CPU cores and architecture, the Kirin 810 is equipped with 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the Dimensity 720 features 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Both processors offer octa-core capabilities, ensuring smooth multitasking and overall performance.
When it comes to instruction sets, both processors support ARMv8.2-A, allowing for efficient processing and optimized performance.
In terms of lithography, both the Kirin 810 and the Dimensity 720 are manufactured using the advanced 7 nm process, providing excellent power efficiency and thermal management.
Moving on to the number of transistors, the Kirin 810 stands out with its 6900 million transistors. Meanwhile, information regarding the Dimensity 720's transistor count is not mentioned, suggesting that it may have a lower transistor count compared to the Kirin 810.
In terms of power consumption, the Kirin 810 has a TDP (Thermal Design Power) of 5W, indicating low power consumption. On the other hand, the Dimensity 720 has a slightly higher TDP of 10W, meaning it may consume more power compared to the Kirin 810.
Regarding neural processing capabilities, the Kirin 810 utilizes the Ascend D100 Lite and Huawei Da Vinci architecture. This allows for enhanced AI processing and improved neural network performance. The Dimensity 720, on the other hand, features an NPU (Neural Processing Unit), which also enables efficient AI and neural processing tasks.
In summary, both the HiSilicon Kirin 810 and the MediaTek Dimensity 720 are powerful processors with impressive specifications. While the Kirin 810 has a lower TDP, higher transistor count, and utilizes Huawei's Da Vinci architecture, the Dimensity 720 offers slightly higher clock speeds. Both processors are excellent options for smartphones and other mobile devices, providing efficient performance and advanced AI capabilities.
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 12 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G57 MP3 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 820 MHz | 850 MHz |
Execution units | 6 | 3 |
Shaders | 96 | |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2520x1080@90Hz | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | FullHD@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2020 Quarter 3 |
Partnumber | Hi6280 | MT6853V/ZA, MT6853V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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