HiSilicon Kirin 810 vs MediaTek Dimensity 720

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The HiSilicon Kirin 810 and the MediaTek Dimensity 720 are two processors that offer powerful performance and efficiency. Let's compare their specifications to understand the differences and similarities between the two.

In terms of CPU cores and architecture, the Kirin 810 is equipped with 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. On the other hand, the Dimensity 720 features 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. Both processors offer octa-core capabilities, ensuring smooth multitasking and overall performance.

When it comes to instruction sets, both processors support ARMv8.2-A, allowing for efficient processing and optimized performance.

In terms of lithography, both the Kirin 810 and the Dimensity 720 are manufactured using the advanced 7 nm process, providing excellent power efficiency and thermal management.

Moving on to the number of transistors, the Kirin 810 stands out with its 6900 million transistors. Meanwhile, information regarding the Dimensity 720's transistor count is not mentioned, suggesting that it may have a lower transistor count compared to the Kirin 810.

In terms of power consumption, the Kirin 810 has a TDP (Thermal Design Power) of 5W, indicating low power consumption. On the other hand, the Dimensity 720 has a slightly higher TDP of 10W, meaning it may consume more power compared to the Kirin 810.

Regarding neural processing capabilities, the Kirin 810 utilizes the Ascend D100 Lite and Huawei Da Vinci architecture. This allows for enhanced AI processing and improved neural network performance. The Dimensity 720, on the other hand, features an NPU (Neural Processing Unit), which also enables efficient AI and neural processing tasks.

In summary, both the HiSilicon Kirin 810 and the MediaTek Dimensity 720 are powerful processors with impressive specifications. While the Kirin 810 has a lower TDP, higher transistor count, and utilizes Huawei's Da Vinci architecture, the Dimensity 720 offers slightly higher clock speeds. Both processors are excellent options for smartphones and other mobile devices, providing efficient performance and advanced AI capabilities.

CPU cores and architecture

Architecture 2x 2.27 GHz – Cortex-A76
6x 1.88 GHz – Cortex-A55
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 7 nm 7 nm
Number of transistors 6900 million
TDP 5 Watt 10 Watt
Neural Processing Ascend D100 Lite, HUAWEI Da Vinci Architecture NPU

Memory (RAM)

Max amount up to 8 GB up to 12 GB
Memory type LPDDR4X LPDDR4X
Memory frequency 2133 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G52 MP6 Mali-G57 MP3
GPU Architecture Bifrost Valhall
GPU frequency 820 MHz 850 MHz
Execution units 6 3
Shaders 96
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2520x1080@90Hz
Max camera resolution 1x 48MP, 2x 20MP 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture FullHD@30fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2019 Quarter 2 2020 Quarter 3
Partnumber Hi6280 MT6853V/ZA, MT6853V/NZA
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 810
373134
Dimensity 720
293337

GeekBench 6 Single-Core

Score
Kirin 810
604
Dimensity 720
540

GeekBench 6 Multi-Core

Score
Kirin 810
1959
Dimensity 720
1698