HiSilicon Kirin 810 vs MediaTek Dimensity 1300

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Which processor is better? We compared HiSilicon Kirin 810 with MediaTek Dimensity 1300. Compare, analyze the specifications. Find out their scores in popular benchmarks (AnTuTu 10, GeekBench 6 Single-Core, GeekBench 6 Multi-Core) and who is the winner?

CPU cores and architecture

Architecture	2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55	1x 3 GHz – Cortex-A78 3x 2.6 GHz – Cortex-A78 4x 2 GHz – Cortex-A55
Number of cores	8	8
Instruction Set	ARMv8.2-A	ARMv8.2-A
Lithography	7 nm	6 nm
Number of transistors	6900 million
TDP	5 Watt
Neural Processing	Ascend D100 Lite, HUAWEI Da Vinci Architecture	MediaTek APU 3.0

Memory (RAM)

Max amount	up to 8 GB	up to 16 GB
Memory type	LPDDR4X	LPDDR4X
Memory frequency	2133 MHz	2133 MHz
Memory-bus	4x16 bit	4x16 bit

Storage

Storage specification

UFS 2.1

UFS 3.1

Graphics

GPU name	Mali-G52 MP6	Mali-G77 MP9
GPU Architecture	Bifrost	Valhall
GPU frequency	820 MHz	850 MHz
Execution units	6	9
Shaders	96	144
DirectX	12
OpenCL API	2.0	2.0
OpenGL API	ES 3.2	ES 3.2
Vulkan API	1.0	1.1

Camera, Video, Display

Max screen resolution		2520x1080
Max camera resolution	1x 48MP, 2x 20MP	1x 2000MP, 1x 32MP + 1x 16MP
Max Video Capture	FullHD@30fps	4K@60fps
Video codec support	H.264 (AVC) H.265 (HEVC) VP8 VP9	AV1 H.264 (AVC) H.265 (HEVC) VP9

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	0.6 Gbps	4.7 Gbps
Peak Upload Speed	0.15 Gbps	2.5 Gbps
Wi-Fi	6 (802.11ax)	6 (802.11ax)
Bluetooth	5.1	5.2
Satellite navigation	BeiDou GPS GLONASS	BeiDou GPS Galileo GLONASS NavIC QZSS