HiSilicon Kirin 810 vs HiSilicon Kirin 980
The HiSilicon Kirin 810 and Kirin 980 are both powerful processors designed by HiSilicon. While they share some similarities in terms of their architecture and lithography, there are also some notable differences in their specifications.
Starting with the Kirin 810, it features an architecture of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This configuration provides a balance between high-performance and power efficiency. With a lithography of 7 nm, the Kirin 810 is built using advanced manufacturing processes, resulting in improved power efficiency and reduced heat generation. The processor boasts a total of 8 cores and operates on the ARMv8.2-A instruction set. It has a TDP (Thermal Design Power) of 5 Watts, indicating a lower power consumption. Additionally, the Kirin 810 utilizes Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing, offering enhanced AI capabilities.
On the other hand, the Kirin 980 features a more diverse architecture. It has a combination of 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This configuration provides a mix of high-performance cores for demanding tasks and power-efficient cores for lighter workloads. Like the Kirin 810, it has a lithography of 7 nm and a total of 8 cores. However, it operates on the ARMv8-A instruction set, which is slightly different from the ARMv8.2-A used in the Kirin 810. The Kirin 980 has a TDP of 6 Watts, indicating slightly higher power consumption. It also employs the HiSilicon Dual NPU for neural processing, enabling faster and more efficient AI functions.
In summary, the HiSilicon Kirin 810 and Kirin 980 are both high-performance processors with advanced manufacturing processes and a similar number of transistors. However, the Kirin 980 offers a more diverse architecture with higher clock speeds and a different instruction set. It has a slightly higher power consumption but compensates for it with the HiSilicon Dual NPU for improved AI performance. Ultimately, the choice between the two processors depends on the specific requirements and preferences of the user.
Starting with the Kirin 810, it features an architecture of 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. This configuration provides a balance between high-performance and power efficiency. With a lithography of 7 nm, the Kirin 810 is built using advanced manufacturing processes, resulting in improved power efficiency and reduced heat generation. The processor boasts a total of 8 cores and operates on the ARMv8.2-A instruction set. It has a TDP (Thermal Design Power) of 5 Watts, indicating a lower power consumption. Additionally, the Kirin 810 utilizes Ascend D100 Lite and HUAWEI Da Vinci Architecture for neural processing, offering enhanced AI capabilities.
On the other hand, the Kirin 980 features a more diverse architecture. It has a combination of 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. This configuration provides a mix of high-performance cores for demanding tasks and power-efficient cores for lighter workloads. Like the Kirin 810, it has a lithography of 7 nm and a total of 8 cores. However, it operates on the ARMv8-A instruction set, which is slightly different from the ARMv8.2-A used in the Kirin 810. The Kirin 980 has a TDP of 6 Watts, indicating slightly higher power consumption. It also employs the HiSilicon Dual NPU for neural processing, enabling faster and more efficient AI functions.
In summary, the HiSilicon Kirin 810 and Kirin 980 are both high-performance processors with advanced manufacturing processes and a similar number of transistors. However, the Kirin 980 offers a more diverse architecture with higher clock speeds and a different instruction set. It has a slightly higher power consumption but compensates for it with the HiSilicon Dual NPU for improved AI performance. Ultimately, the choice between the two processors depends on the specific requirements and preferences of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8-A |
Lithography | 7 nm | 7 nm |
Number of transistors | 6900 million | 6900 million |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture | HiSilicon Dual NPU |
Memory (RAM)
Max amount | up to 8 GB | up to 8 GB |
Memory type | LPDDR4X | LPDDR4X |
Memory frequency | 2133 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G52 MP6 | Mali-G76 MP10 |
GPU Architecture | Mali Bifrost | Mali Bifrost |
GPU frequency | 820 MHz | 720 MHz |
Execution units | 6 | 10 |
Shaders | 96 | 160 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 3120x1440 | |
Max camera resolution | 1x 48MP, 2x 20MP | 1x 48MP, 2x 32MP |
Max Video Capture | FullHD@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.4 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
Wi-Fi | 6 (802.11ax) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 2 | 2018 Quarter 4 |
Partnumber | Hi6280 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
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