HiSilicon Kirin 810 vs HiSilicon Kirin 955
The HiSilicon Kirin 810 and the HiSilicon Kirin 955 are two processors designed by Huawei's semiconductor department. Let's compare their specifications to understand their differences.
Starting with the HiSilicon Kirin 810, this processor features an architecture that includes 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. It also uses the ARMv8.2-A instruction set and has a lithography of 7 nm. With a total of 8 cores, this processor offers a balance between power and efficiency. It has a TDP (Thermal Design Power) of 5 Watts, indicating that it operates at a low power consumption level. Additionally, the HiSilicon Kirin 810 includes the Ascend D100 Lite neural processing unit, which utilizes Huawei's Da Vinci architecture for improved artificial intelligence capabilities.
On the other hand, the HiSilicon Kirin 955 comes with a different set of specifications. It has an architecture that consists of 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. This processor uses the ARMv8-A instruction set and has a lithography of 16 nm, which is slightly less advanced compared to the 7 nm of the Kirin 810. With a total of 8 cores, this processor provides a decent level of performance but may not be as efficient as the Kirin 810. Similar to the Kirin 810, the TDP of the Kirin 955 is also 5 Watts.
In terms of the number of transistors, the HiSilicon Kirin 810 stands out with 6900 million transistors, while the Kirin 955 has 2000 million transistors. The higher number of transistors typically indicates a more complex and advanced design, suggesting that the Kirin 810 may have a technological edge over the Kirin 955.
Overall, while both processors offer a total of 8 cores and have the same TDP, the HiSilicon Kirin 810 appears to have a more advanced architecture, a smaller lithography, and a significantly higher number of transistors compared to the HiSilicon Kirin 955. These specifications indicate that the Kirin 810 may offer better performance and power efficiency, particularly in tasks that require artificial intelligence capabilities.
It's important to note that specifications alone do not provide a complete picture of a processor's performance, as real-world results can be influenced by various factors such as software optimization and other hardware components.
Starting with the HiSilicon Kirin 810, this processor features an architecture that includes 2x 2.27 GHz Cortex-A76 cores and 6x 1.88 GHz Cortex-A55 cores. It also uses the ARMv8.2-A instruction set and has a lithography of 7 nm. With a total of 8 cores, this processor offers a balance between power and efficiency. It has a TDP (Thermal Design Power) of 5 Watts, indicating that it operates at a low power consumption level. Additionally, the HiSilicon Kirin 810 includes the Ascend D100 Lite neural processing unit, which utilizes Huawei's Da Vinci architecture for improved artificial intelligence capabilities.
On the other hand, the HiSilicon Kirin 955 comes with a different set of specifications. It has an architecture that consists of 4x 2.5 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. This processor uses the ARMv8-A instruction set and has a lithography of 16 nm, which is slightly less advanced compared to the 7 nm of the Kirin 810. With a total of 8 cores, this processor provides a decent level of performance but may not be as efficient as the Kirin 810. Similar to the Kirin 810, the TDP of the Kirin 955 is also 5 Watts.
In terms of the number of transistors, the HiSilicon Kirin 810 stands out with 6900 million transistors, while the Kirin 955 has 2000 million transistors. The higher number of transistors typically indicates a more complex and advanced design, suggesting that the Kirin 810 may have a technological edge over the Kirin 955.
Overall, while both processors offer a total of 8 cores and have the same TDP, the HiSilicon Kirin 810 appears to have a more advanced architecture, a smaller lithography, and a significantly higher number of transistors compared to the HiSilicon Kirin 955. These specifications indicate that the Kirin 810 may offer better performance and power efficiency, particularly in tasks that require artificial intelligence capabilities.
It's important to note that specifications alone do not provide a complete picture of a processor's performance, as real-world results can be influenced by various factors such as software optimization and other hardware components.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 2x 2.27 GHz – Cortex-A76 6x 1.88 GHz – Cortex-A55 |
4x 2.5 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8.2-A | ARMv8-A |
| Lithography | 7 nm | 16 nm |
| Number of transistors | 6900 million | 2000 million |
| TDP | 5 Watt | 5 Watt |
| Neural Processing | Ascend D100 Lite, HUAWEI Da Vinci Architecture |
Memory (RAM)
| Max amount | up to 8 GB | up to 4 GB |
| Memory type | LPDDR4X | LPDDR4 |
| Memory frequency | 2133 MHz | 1333 MHz |
| Memory-bus | 4x16 bit | 2x32 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.0 |
Graphics
| GPU name | Mali-G52 MP6 | Mali-T880 MP4 |
| GPU Architecture | Mali Bifrost | Mali Midgard |
| GPU frequency | 820 MHz | 900 MHz |
| Execution units | 6 | 4 |
| Shaders | 96 | 64 |
| DirectX | 12 | 11.2 |
| OpenCL API | 2.0 | 1.2 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
| Max camera resolution | 1x 48MP, 2x 20MP | 1x 31MP, 2x 13MP |
| Max Video Capture | FullHD@30fps | FullHD@60fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.05 Gbps |
| Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
| Bluetooth | 5.1 | 4.2 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2019 Quarter 2 | 2016 April |
| Partnumber | Hi6280 | Hi3655 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Flagship |
Popular comparisons:
1
Qualcomm Snapdragon 8 Elite (Gen 4) vs Qualcomm Snapdragon 6 Gen 4
2
Samsung Exynos 1330 vs Apple A13 Bionic
3
Unisoc T820 vs Qualcomm Snapdragon 730G
4
MediaTek Dimensity 1000 Plus vs Samsung Exynos 9609
5
Unisoc T9100 vs MediaTek Helio G35
6
HiSilicon Kirin 950 vs Samsung Exynos 1280
7
MediaTek Dimensity 900 vs MediaTek MT6737
8
MediaTek Dimensity 810 vs HiSilicon Kirin 980
9
Qualcomm Snapdragon 6s Gen 4 vs Samsung Exynos 7880
10
Apple A19 Pro vs Qualcomm Snapdragon 778G